IP Library Granted Patent US 11,578,886
Granted Patent B2
US 11,578,886 · App. 16/935,107 · Granted Feb 14, 2023

Temperature compensation for low-voltage thermostats

Inventors: Rafael Aguilar (Chihauhua, MX); Sergio Adrian Martinez (Chihuahua, MX); Ever Hernandez (Chihuahua, MX); Mohammad A. Aljabari (Brooklyn Park, MN)
Assignee: Ademco Inc.
F24F11/30F24F11/65F24F11/80F24F11/88F24F13/20F24F2110/12F24F2140/50
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Quick Facts
Patent No.
US 11,578,886
App. No.
16/935,107
Granted
Feb 14, 2023
Kind
B2
Abstract

A thermostat device may use one or two temperature sensors inside the housing of the thermostat device to perform temperature compensation to determine the ambient temperature outside the housing of the thermostat device. Processing circuitry of the thermostat device may determine a current operating mode of the thermostat device out of a plurality of operating modes. The processing circuitry may also use machine learning to estimate the current and voltage of the thermostat device based on temperature differences between the two temperature sensors. The processing circuitry may determine, based at least in part on the estimated current and voltage of the thermostat device and the current operating mode of the thermostat device, an ambient temperature outside the housing of the thermostat device.

Claims (71)

1. A thermostat device comprising:

a housing;

an electronic circuit board in the housing;

a first temperature sensor disposed on the electronic circuit board in the housing and configured to sense a first temperature;

one or more relays; and

processing circuitry in the housing configured to:

determine a current operating mode of the thermostat device out of a plurality of operating modes;

determine an operating voltage of the thermostat device;

determine an amount of current flowing through the one or more relays; and

determine an ambient temperature outside the housing of the thermostat device based at least in part on the first temperature, the operating voltage, the amount of current flowing through the one or more relays, and the current operating mode of the thermostat device.

2. The thermostat device of claim 1 , further comprising:

a second temperature sensor disposed on the electronic circuit board in the housing and configured to sense a second temperature;

wherein the processing circuitry is further configured to:

estimate, based at least in part on the first temperature and the second temperature, the operating voltage of the thermostat device and the amount of current flowing through the one or more relays.

3. The thermostat device of claim 1 , wherein the processing circuitry is further configured to:

determine a style of base of the thermostat device out of a plurality of bases; and

determine the ambient temperature outside the housing of the thermostat device based at least in part on the first temperature, the operating voltage, the amount of current flowing through the one or more relays, the style of base, and the current operating mode of the thermostat device.

4. The thermostat device of claim 3 , wherein the processing circuitry is further configured to:

determine that the thermostat device has had an operating mode change from a previous operating mode to the current operating mode;

determine whether the electronic circuit board is heating up or cooling down in response to the operating mode change; and

in response to determining that the electronic circuit board is heating up, determine a heating curve associated with the current operating mode for determining the ambient temperature.

5. The thermostat device of claim 4 , wherein the processing circuitry is further configured to:

in response to determining that the electronic circuit board is heating up, determine a heating dynamic factor ΔT for the first temperature sensed by the first temperature sensor based at least on the heating curve; and

determine the ambient temperature as the first temperature sensed by the first temperature sensor minus the heating dynamic factor ΔT.

6. The thermostat device of claim 5 , wherein to determine the heating dynamic factor ΔT for the first temperature sensed by the first temperature sensor based at least on the heating curve, the processing circuitry is further configured to:

determine a point on the heating curve associated with the first temperature sensed by the first temperature sensor; and

determine the heating dynamic factor ΔT that corresponds to the point on the heating curve.

7. The thermostat device of claim 1 , wherein the processing circuitry is further configured to:

determine that the thermostat device has had an operating mode change from a previous operating mode to the current operating mode;

determine whether the electronic circuit board is heating up or cooling down in response to the operating mode change; and

in response to determining that the electronic circuit board is cooling down, determine a cooling curve associated with the current operating mode for determining the ambient temperature.

8. The thermostat device of claim 7 , wherein the processing circuitry configured to determine the ambient temperature is further configured to:

in response to determining that the electronic circuit board is cooling down, determine a cooling dynamic factor δT for the first temperature sensed by the first temperature sensor based at least in part on the cooling curve;

determine a steady state temperature difference ΔTSS associated with the current operating mode of the thermostat device; and

determine the ambient temperature as the first temperature sensed by the first temperature sensor minus the cooling dynamic factor δT minus the steady state temperature difference ΔTSS associated with the current operating mode of the thermostat device.

9. The thermostat device of claim 8 , wherein the processing circuitry configured to determine the cooling dynamic factor δT for the first temperature sensed by the first temperature sensor based at least on the cooling curve is further configured to:

determine a point on the cooling curve associated with the first temperature sensed by the first temperature sensor; and

determine the cooling dynamic factor δT that corresponds to the point on the cooling curve.

10. A method for performing temperature compensation, comprising:

sensing, by a first temperature sensor disposed on an electronic circuit board in a housing of a thermostat device, a first temperature;

determining, by a processing circuitry of the thermostat device, a current operating mode of the thermostat device out of a plurality of operating modes;

determining, by the processing circuitry of the thermostat device, an operating voltage of the thermostat device;

determining, by the processing circuitry of the thermostat device, an amount of current flowing through one or more relays of the thermostat device; and

determining, by the processing circuitry, an ambient temperature outside the housing of the thermostat device based at least in part on the first temperature, the operating voltage, the amount of current flowing through the one or more relays, and the current operating mode of the thermostat device.

11. The method of claim 10 , wherein determining the operating voltage of the thermostat device and determining the amount of current flowing through the one or more relays further comprises:

sensing, by a second temperature sensor disposed on the electronic circuit board in the housing, a second temperature; and

estimating, by the processing circuitry and based at least in part on the first temperature and the second temperature, the operating voltage of the thermostat device and the amount of current flowing through the one or more relays.

12. The method of claim 10 , further comprising:

determining, by the processing circuitry, a style of base of the thermostat device out of a plurality of bases; and

determining, by the processing circuitry, the ambient temperature outside the housing of the thermostat device based at least in part on the first temperature, the operating voltage, the amount of current flowing through the one or more relays, the style of base, and the current operating mode of the thermostat device.

13. The method of claim 10 , further comprising:

determining, by the processing circuitry, that the thermostat device has had an operating mode change from a previous operating mode to the current operating mode;

determining, by the processing circuitry, whether the electronic circuit board is heating up or cooling down in response to the operating mode change; and

in response to determining that the electronic circuit board is heating up, determining, by the processing circuitry, a heating curve associated with the current operating mode for determining the ambient temperature.

14. The method of claim 13 , wherein determining the ambient temperature further comprises:

in response to determining that the electronic circuit board is heating up, determining, by the processing circuitry, a heating dynamic factor ΔT for the first temperature sensed by the first temperature sensor based at least on the heating curve; and

determining, by the processing circuitry, the ambient temperature as the first temperature sensed by the first temperature sensor minus the heating dynamic factor ΔT.

15. The method of claim 14 , wherein determining the heating dynamic factor ΔT for the first temperature sensed by the first temperature sensor based at least on the heating curve further comprises:

determining, by the processing circuitry, a point on the heating curve associated with the first temperature sensed by the first temperature sensor; and

determining, by the processing circuitry, the heating dynamic factor ΔT that corresponds to the point on the heating curve.

16. The method of claim 10 , further comprising:

determining, by the processing circuitry, that the thermostat device has had an operating mode change from a previous operating mode to the current operating mode;

determining, by the processing circuitry, whether the electronic circuit board is heating up or cooling down in response to the operating mode change; and

in response to determining that the electronic circuit board is cooling down, determining, by the processing circuitry, a cooling curve associated with the current operating mode for determining the ambient temperature.

17. The method of claim 16 , wherein determining the ambient temperature further comprises:

in response to determining that the electronic circuit board is cooling down, determining, by the processing circuitry, a cooling dynamic factor δT for the first temperature sensed by the first temperature sensor based at least in part on the cooling curve;

determining, by the processing circuitry, a steady state temperature difference ΔTSS associated with the current operating mode of the thermostat device; and

determining, by the processing circuitry, the ambient temperature as the first temperature sensed by the first temperature sensor minus the cooling dynamic factor δT minus the steady state temperature difference ΔTSS associated with the current operating mode of the thermostat device.

18. The method of claim 17 , wherein determining the cooling dynamic factor δT for the first temperature sensed by the first temperature sensor based at least on the cooling curve further comprises:

determining, by the processing circuitry, a point on the cooling curve associated with the first temperature sensed by the first temperature sensor; and

determining, by the processing circuitry, the cooling dynamic factor δT that corresponds to the point on the cooling curve.

Assignments (3)
CHANGE OF NAME Recorded Jun 12, 2025
From: ADEMCO INC.
To: RESIDEO LLC
Reel/Frame 071546/0001 →
SECURITY INTEREST Recorded Apr 1, 2022
From: BRK BRANDS, INC.; ADEMCO INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 059571/0686 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2020
From: MARTINEZ, SERGIO ADRIAN; HERNANDEZ, EVER; AGUILAR, RAFAEL; ALJABARI, MOHAMMAD A.
To: ADEMCO INC.
Reel/Frame 053272/0196 →