LED luminaire having enhanced thermal management
View Patent ↗In one aspect, luminaires are described herein having sensor modules integrated therein. In one aspect, a luminaire described herein comprises a light emitting face including a LED assembly. A sensor module is integrated into the luminaire at a position at least partially overlapping the light emitting face. In another aspect, a luminaire described herein comprises a LED assembly and a driver assembly. A sensor module is integrated into the luminaire along or more convective air current pathways cooling the LED assembly or driver assembly.
1. A heatsink assembly comprising:
a plurality of finned structures; and
interconnects coupling the finned structures between a compressed spacing configuration and an expanded spacing configuration, wherein the interconnects are positioned in the interior of the finned structures and slidingly engaged between the finned structures in both the compressed spacing configuration and expanded spacing configuration, wherein the interconnects lock the spacing between adjacent finned structures in the expanded spacing configuration.
2. The heatsink assembly of claim 1 , wherein the spacing is a predetermined distance.
3. The heatsink assembly of claim 1 , wherein the spacing between adjacent finned structures is uniform over the heatsink assembly.
4. The heatsink of claim 1 , wherein the finned structures comprise an aperture in a vertically extending face of the finned structures for receiving the interconnects.
5. The heatsink of claim 4 , wherein the interconnects further comprise a fastener extending from the aperture.
6. The heatsink of claim 5 , wherein the fastener is operable to engage a complimentary structure on an adjacent fin.
7. The heatsink assembly of claim 1 , wherein the heatsink assembly is part of a LED architecture.
8. The luminaire of claim 1 wherein the heatsink assembly is part of the LED assembly.
9. A luminaire comprising:
a driver assembly;
a light emitting diode assembly; and
a heatsink assembly comprising a plurality of finned structures, and interconnects coupling the finned structures between a compressed spacing configuration and an expanded spacing configuration, wherein the interconnects are positioned in the interior of the finned structures and slidingly engaged between the finned structures in both the compressed spacing configuration and expanded spacing configuration, wherein the interconnects lock the spacing between adjacent finned structures in the expanded spacing configuration.
10. The luminaire of claim 9 , wherein the spacing is a predetermined distance.
11. The luminaire of claim 9 , wherein the spacing between adjacent finned structures is uniform over the heatsink assembly.
12. The luminaire of claim 9 , wherein the finned structures comprise an aperture in a vertically extending face of the finned structures for receiving the interconnects.
13. The luminaire of claim 12 , wherein the interconnects further comprise a fastener extending from the aperture.
14. The luminaire of claim 13 , wherein the fastener is operable to engage a complimentary structure on an adjacent fin.