IP Library Granted Patent US 11,107,515
Granted Patent B2
US 11,107,515 · App. 16/937,402 · Granted Aug 31, 2021

Ferroelectric memory cells

Inventors: Scott J. Derner (Boise, ID); Christopher J. Kawamura (Boise, ID)
Assignee: Micron Technology, Inc.
G11C11/221G11C11/2253G11C11/2259G11C11/2273G11C11/2275G11C11/2293H01L27/11502H01L27/11507H01L27/11514H01L28/55H01L28/90G11C11/2257
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Quick Facts
Patent No.
US 11,107,515
App. No.
16/937,402
Granted
Aug 31, 2021
Kind
B2
Abstract

Apparatuses and methods are disclosed that include ferroelectric memory cells. An example ferroelectric memory cell includes two transistors and two capacitors. Another example ferroelectric memory cell includes three transistors and two capacitors. Another example ferroelectric memory cell includes four transistors and two capacitors.

Claims (50)

1. An apparatus, comprising:

a first memory cell; and

a second memory cell;

wherein each memory cell comprises:

a first transistor;

a first ferroelectric capacitor including a ferroelectric material, coupled to the first transistor and vertically stacked relative to the first transistor;

a second transistor;

a second ferroelectric capacitor coupled to the second transistor and vertically stacked relative to the second transistor; and

a third transistor coupled to the first and second ferroelectric capacitors; and

a plate line structure shared by the first and second memory cells, the plate line structure coupled to the respective third transistor of the first and second memory cells.

2. The apparatus of claim 1 , wherein the third transistor is vertically stacked relative to the first and second transistors.

3. The apparatus of claim 2 , wherein the third transistor of the first memory cell is below the first and second transistors.

4. The apparatus of claim 2 , wherein the third transistor of the second memory cell is above the first and second transistors.

5. The apparatus of claim 1 , wherein the first and second transistors are laterally displaced relative to one another.

6. The apparatus of claim 1 , wherein a first plate of the first ferroelectric capacitor and a first plate of the second ferroelectric capacitor are inner plates configured to fit into a respective outer plate.

7. The apparatus of claim 6 , wherein a second plate of the first ferroelectric, capacitor is a first container-shaped outer plate configured to fit the first plate of the first ferroelectric capacitor, and wherein a second plate of the second ferroelectric capacitor is a second container-shaped outer plate configured to fit the second plate of second ferroelectric capacitor.

8. The apparatus of claim 6 , wherein the first plate of the first ferroelectric capacitor and the first plate of the second ferroelectric capacitor have a different composition than a composition of the plate line structure.

9. The apparatus of claim 1 , wherein a second plate of the first ferroelectric capacitor is coupled to a first source/drain region of the first transistor, and wherein a second plate of the second ferroelectric capacitor a first source/drain region of the second transistor.

10. The apparatus of claim 9 , further comprising:

a first digit line coupled to a second source/drain region of the first transistor; and

a second digit line coupled to a second source/drain region of the second transistor.

11. The apparatus of claim 1 wherein the first and second transistors of each memory cell include respective gates coupled to respective word lines.

12. An apparatus, comprising:

a first transistor;

a first ferroelectric capacitor including a ferroelectric material, coupled to the first transistor and vertically stacked relative to the first transistor;

a second transistor;

a second ferroelectric capacitor coupled to the second transistor and vertically stacked relative to the second transistor;

a third transistor coupled to the first ferroelectric capacitor; and

a fourth transistor coupled to the second ferroelectric capacitor; and

a plate line structure coupled to the respective third and fourth transistors.

13. The apparatus of claim 12 , wherein the third transistor is vertically stacked relative to the first transistor.

14. The apparatus of claim 12 , wherein the fourth transistor is vertically stacked relative to the second transistor.

15. The apparatus of claim 12 , wherein the first transistor and the second transistor are vertically stacked relative to one another.

16. The apparatus of claim 12 , wherein a second plate of the first ferroelectric capacitor is coupled to a first source/drain region of the first transistor, and wherein a second plate of the second ferroelectric capacitor is coupled to a first source/drain region of the second transistor.

17. The apparatus of claim 16 , further comprising:

a first digit line coupled to a second source/drain region of the first transistor; and

a second digit line coupled to a second source/drain region of the second transistor.

18. An apparatus, comprising:

a first capacitor including a first plate, a second plate, and a ferroelectric material disposed between the first and second plates, the first plate coupled to a first source/drain region of a third transistor;

a second capacitor including a first plate, a second plate, and a ferroelectric material disposed between the first and second plates, the first plate coupled to a first source/drain region of a fourth transistor;

a first transistor vertically displaced relative to the first capacitor and coupled to the second plate of the first capacitor; and

a second transistor vertically displaced relative to the second capacitor and coupled to the second plate of the second capacitor; and

a shared digit line coupled to a first source/drain region of the first transistor and a first source/drain region of the second transistor, wherein the second plate of the first capacitor is coupled to a second source/drain region of the first transistor, and wherein the second plate of the second capacitor is coupled to a second source/drain region of the second transistor.

19. The apparatus of claim 18 , wherein the first transistor and the second transistor are vertically displaced relative to one another.

20. The apparatus of claim 18 , wherein the first and second transistors include respective gates coupled to respective word lines.

21. The apparatus of claim 18 , wherein a second source/drain region of the third transistor is coupled to a plate line structure, and wherein a second source/drain region of the fourth transistor is coupled to an additional plate line structure.

22. The apparatus of claim 21 , further comprising:

a third capacitor including a first plate, a second plate, and a ferroelectric material disposed between the first and second plates, the first plate coupled to a first source/drain region of a fifth transistor.

23. The apparatus of claim 22 , wherein a second source/drain region of the fifth transistor is coupled to the plate line structure.

24. The apparatus of claim 22 , wherein the third and fifth transistors are laterally displaced relative to one another.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2020
From: DERNER, SCOTT J.; KAWAMURA, CHRISTOPHER J.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 053297/0937 →
Continuity (5)
Continuation 16425769 · May 29, 2019
Continuation 16104709 · Aug 17, 2018
Continuation 15678978 · Aug 16, 2017
Provisional Application 62381942 · Aug 31, 2016
Related Publication 20200357454A1 · Nov 12, 2020
Cited By (3)
US 12,396,215 US 12,581,659 US 12,707,645