Switch

1. An apparatus comprising:

a switch; and

a set of tiles; wherein each of the set of tiles include a PIC die, a DSP die, a driver die, and a TIA die; wherein the PIC die is mounted to a tile substrate;

wherein the TIA die is mounted on the PIC die;

wherein a thermal interface material is thermally connected to the backsides of the driver die, the DSP die, and the TIA die;

wherein the DSP die is mounted to the tile substrate and a thermally connected material is thermally connected to a top of the DSP;

wherein the tile further includes a heat sink; wherein the heat sink is thermally connected to the thermal interface material connected to the top of the TIA die; wherein the heat sink is thermally connected to the thermal interface material thermally connected to the top of the DSP die.

2. The apparatus of claim 1 , wherein each tile is enabled to be mounted on a same substrate as the switch by a socket.

3. The apparatus of claim 2 , wherein each tile of the set of tiles has a substrate and wherein the DSP die is flip chip bonded to the tile substrate; wherein the PIC die is wire bonded to the tile substrate.

4. The apparatus of claim 1 , wherein each tile of the plurality of tiles has a short fiber jumper enabling a multi-fiber connection.

5. The apparatus of claim 1 , wherein the set of tiles has 16 tiles.

6. The apparatus of claim 1 , wherein each tile of the set of tiles converts optical signals to electrical signals and converts electrical signals to optical signals.

7. The apparatus of claim 4 , wherein short is a length less than 6 cm.

8. The apparatus of claim 1 , wherein each tile of the set of tiles has a short fiber connect optically connecting the tile to an MPO connector.

9. The apparatus of claim 1 , wherein each tile of the set of tiles are connected to the switch by a socket.

10. The apparatus of claim 1 wherein the DSP die is mounted to the tile substrate.

11. The apparatus of claim 1 , wherein a thermally connected material is connected to a top of the heat sink of the tile.

12. The apparatus of claim 11 , wherein the switch includes a lid, wherein the lid is thermally connected to a heat sink of each tile of the set of tiles.

13. The apparatus of claim 2 , wherein the tile is held into the socket by securing the tile to the switch with a screw threaded through a screw hole in the tile.

14. The apparatus of claim 4 , wherein the fiber jumper is epoxied to the tile.

15. The apparatus of claim 1 , wherein a known-good tile is soldered directly to a main substrate.