IP Library Patent Application 16938738
Patent Application
App. No. 16/938,738

SYSTEM AND METHOD FOR SERVICE LIFE MANAGEMENT BASED ON LOCAL COOLING MANAGEMENT

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
16/938,738
Abstract

A chassis includes a first computing component; a second computing component; and an air mover that generates an airflow in the chassis used to thermally manage the first computing component and the second computing component. The chassis also includes an airflow control component that modifies a first portion of the airflow proximate to the first computing component based on a corrosion rate of the first computing component without modifying a second portion of the airflow proximate to the second computing component.

Claims (72)

1 . A chassis, comprising:

a first computing component;

a second computing component;

an air mover that generates an airflow in the chassis used to thermally manage the first computing component and the second computing component; and

an airflow control component adapted to:

modify a first portion of the airflow proximate to the first computing component based on a corrosion rate of the first computing component without modifying a second portion of the airflow proximate to the second computing component.

2 . The chassis of claim 1 , wherein the airflow control component comprises:

a passive flapper adapted to modify the first portion of the airflow by:

deflecting the first portion of the airflow away from the first computing component when a temperature of an environment proximate to the first computing component is below a threshold; and

transmitting the first portion of the airflow towards the first computing component when the temperature of the environment proximate to the first computing component is above a second threshold.

3 . The chassis of claim 2 , wherein the passive flapper comprises:

a shape memory alloy that modifies its structure when the temperature of the shape memory alloy rises above the second threshold,

wherein the structure of the shape memory allow is adapted to:

block a path through which the portion of the airflow traverses when the structure of the shape memory allow is modified into a first shape, and

clear the path when the structure of the shape memory allow is modified into a second shape.

4 . The chassis of claim 2 , wherein the passive flapper comprises:

a valve that closes mechanically when the temperature falls below the threshold.

5 . The chassis of claim 1 , wherein the airflow control component comprises:

a sensor adapted to measure a corrosion rate of the first computing component;

an actuator; and

a computer programmed to:

initiate deflection, using the actuator, of the first portion of the airflow away from the first computing component while the corrosion rate is below a threshold; and

initiate direction, using the actuator, of the first portion of the airflow towards the first computing component while the corrosion rate is above a second threshold.

6 . The chassis of claim 5 , wherein the threshold and the second threshold are the same.

7 . The chassis of claim 1 , wherein the airflow control component comprises:

a sensor adapted to measure a corrosion rate of the computing component;

a heating component; and

a computer programmed to:

initiate an increase, using the heating component, of a temperature of the first computing component while the corrosion rate is above a threshold; and

initiate a decrease, using the heating component, of the temperature of the first computing component while the corrosion rate is below a second threshold.

8 . A method for environmentally managing a chassis of an information handling system, comprising:

thermally managing a first computing component of the information handling system using a first portion of an airflow;

thermally managing a second computing component of the information handling system using a second portion of the airflow;

while thermally managing the first computing component and the second computing component:

modifying the first portion of the airflow based on a corrosion rate of the first computing component without modifying the second portion of the airflow.

9 . The method of claim 8 , wherein the first portion of the airflow is modified by:

deflecting, using a passive flapper, the first portion of the airflow away from the first computing component when a temperature of an environment proximate to the first computing component is below a threshold; and

transmitting, using the passive flapper, the first portion of the airflow towards the first computing component when the temperature of the environment proximate to the first computing component is above a second threshold.

10 . The method of claim 9 , wherein the passive flapper deflects the first portion of the airflow using a shape memory alloy that modifies its structure when the temperature of the shape memory alloy rises above the second threshold,

wherein the structure of the shape memory allow is adapted to:

block a path through which the first portion of the airflow traverses when the structure of the shape memory allow is modified into a first shape, and

clear the path when the structure of the shape memory allow is modified into a second shape.

11 . The method of claim 9 , wherein the passive flapper comprises:

a valve that closes mechanically when the temperature falls below the threshold.

12 . The method of claim 8 , wherein the first portion of the airflow is modified by:

measuring a corrosion rate of the first computing component;

initiating deflection, using an actuator, of the first portion of the airflow away from the first computing component while the corrosion rate is below a threshold; and

initiating direction, using the actuator, of the first portion of the airflow towards the first computing component while the corrosion rate is above a second threshold.

13 . The method of claim 12 , wherein the threshold and the second threshold are the same.

14 . The method of claim 9 , wherein the first portion of the airflow is modified by:

measuring a corrosion rate of the first computing component;

increasing a temperature of the first computing component while the corrosion rate is above a threshold; and

decreasing the temperature of the first computing component while the corrosion rate is below a second threshold.

15 . A non-transitory computer readable medium comprising computer readable program code, which when executed by a computer processor enables the computer processor to perform a method for environmentally managing a chassis of an information handling system, the method comprising:

thermally managing a first computing component of the information handling system using a first portion of an airflow;

thermally managing a second computing component of the information handling system using a second portion of the airflow;

while thermally managing the first computing component and the second computing component:

modifying the first portion of the airflow based on a corrosion rate of the first computing component without modifying the second portion of the airflow.

16 . The non-transitory computer readable medium of claim 15 , wherein the first portion of the airflow is modified by:

deflecting, using a passive flapper, the first portion of the airflow away from the first computing component when a temperature of an environment proximate to the first computing component is below a threshold; and

transmitting, using the passive flapper, the first portion of the airflow towards the first computing component when the temperature of the environment proximate to the first computing component is above a second threshold.

17 . The non-transitory computer readable medium of claim 16 , wherein the passive flapper deflects the first portion of the airflow using a shape memory alloy that modifies its structure when the temperature of the shape memory alloy rises above the second threshold,

wherein the structure of the shape memory allow is adapted to:

block a path through which the first portion of the airflow traverses when the structure of the shape memory allow is modified into a first shape, and

clear the path when the structure of the shape memory allow is modified into a second shape.

18 . The non-transitory computer readable medium of claim 16 , wherein the passive flapper comprises:

a valve that closes mechanically when the temperature falls below the threshold.

19 . The non-transitory computer readable medium of claim 15 , wherein the first portion of the airflow is modified by:

measuring a corrosion rate of the first computing component;

initiating deflection, using an actuator, of the first portion of the airflow away from the first computing component while the corrosion rate is below a threshold; and

initiating direction, using the actuator, of the first portion of the airflow towards the first computing component while the corrosion rate is above a second threshold.

20 . The non-transitory computer readable medium of claim 15 , wherein the threshold and the second threshold are the same.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053574/0221) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060333/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053578/0183) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060332/0864 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053573/0535) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060333/0106 →
RELEASE OF SECURITY INTEREST AT REEL 053531 FRAME 0108 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0371 →
SECURITY INTEREST Recorded Aug 21, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 053578/0183 →
SECURITY INTEREST Recorded Aug 21, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 053573/0535 →
SECURITY INTEREST Recorded Aug 21, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 053574/0221 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 19, 2020
From: EMBLETON, STEVEN; FITCH, JON TAYLOR
To: DELL PRODUCTS L.P.
Reel/Frame 053532/0190 →
SECURITY AGREEMENT Recorded Aug 18, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 053531/0108 →