Electromagnetic shielding of heatsinks with spring press-fit pins
An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.
1. An apparatus comprising:
a printed circuit board, a logic chip, a heatsink, and a grounding member, wherein the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member;
the logic chip electrically coupled to the printed circuit board;
the heatsink disposed on a top surface of the logic chip;
a thermal interface material disposed between the top surface of the logic chip and a bottom surface of the heatsink;
the first terminal pin at the first end of the grounding member disposed in a plated-through hole of the printed circuit board, wherein the grounding member electrically couples the heatsink to the printed circuit board; and
a load bar of the grounding member translates a load applied to the heatsink during an assembly process to the integrated spring and the first terminal pin;
the integrated spring of the grounding member presses a second end of the grounding member against the bottom surface of the heatsink, wherein the second end of the grounding member electrically couples the heatsink to the grounding member.
2. The apparatus of claim 1 , further comprising:
a second end of the grounding member electrically coupled to the heatsink utilizing at least one spot weld.
3. The apparatus of claim 1 , further comprising:
a second end of the grounding member electrically coupled to the heatsink utilizing solder.
4. The apparatus of claim 1 , wherein the integrated spring is selected from a group consisting of: a pogo pin, a helical spring, a conical spring, a multiple bend spring, and a leaf spring.