Small Camera with Molding Compound

1 . A camera module comprising:

a chip scale package including an image sensor;

a lens assembly configured to focus image light to the image sensor; and

molding compound disposed around the chip scale package, wherein the molding compound shields ambient light from becoming incident onto the image sensor.

2 . The camera module of claim 1 , wherein the molding compound is a mounting surface that supports the lens assembly.

3 . The camera module of claim 2 , wherein the molding compound adheres the lens assembly to the chip scale package.

4 . The camera module of claim 2 , wherein an adhesive layer adheres the lens assembly to the molding compound.

5 . The camera module of claim 1 , wherein the molding compound is an epoxy molding compound (EMC) molded around the chip scale package.

6 . The camera module of claim 1 , wherein:

the chip scale package includes a coverglass layer disposed between the lens assembly and the image sensor, and

the molding compound surrounds sides of the coverglass layer and the image sensor.

7 . The camera module of claim 6 , wherein a portion of the molding compound is disposed between the coverglass layer and the lens assembly.

8 . The camera module of claim 1 further comprising:

a printed circuit board (PCB), wherein the molding compound adheres the chip scale package to the PCB.

9 . The camera module of claim 1 , wherein the molding compound disposed around the chip scale package is substantially a same width as the lens assembly.

10 . An imaging module comprising:

a chip scale package including a first image sensor;

a first lens assembly configured to focus image light to the first image sensor;

a second image sensor;

a second lens assembly configured to focus image light to the second image sensor; and

molding compound disposed around the first image sensor and disposed around the second image sensor, wherein the molding compound shields ambient light from becoming incident onto the first image sensor and the second image sensor.

11 . The imaging module of claim 10 further comprising:

a printed circuit board (PCB), wherein:

the first image sensor is electrically coupled to the PCB, and

the second image sensor is electrically coupled to the PCB.

12 . The imaging module of claim 11 further comprising:

a connector configured to:

deliver first image signals of first images captured by the first image sensor, and

deliver second image signals of second images captured by the second image sensor.

13 . The imaging module of claim 10 , wherein the molding compound is a plastic polymer molded around the first image sensor and the second image sensor.

14 . The imaging module of claim 10 , wherein the first image sensor is disposed adjacent to the second image sensor to share an almost same optical perspective as the second image sensor.

15 . The imaging module of claim 10 , wherein the second image sensor is included in a second chip scale package.

16 . The imaging module of claim 10 , wherein the molding compound supports the first lens assembly.

17 . The imaging module of claim 16 , wherein the molding compound adheres the first lens assembly to the chip scale package.

18 . The imaging module of claim 16 further comprising:

an adhesive layer adhering the first lens assembly to the molding compound.

19 . The imaging module of claim 10 , wherein the molding compound disposed around the chip scale package is substantially a same width as the first lens assembly.

20 . A camera module comprising:

a printed circuit board;

an image sensor;

a solder ball grid array electrically coupling the image sensor to the printed circuit board;

a lens assembly configured to focus image light to the image sensor; and

molding compound disposed around the image sensor to shield ambient light from becoming incident onto the image sensor while allowing the image light from the lens assembly to become incident onto the image sensor.