IP Library Granted Patent US 11,191,161
Granted Patent B2
US 11,191,161 · App. 16/941,362 · Granted Nov 30, 2021

Electronic circuit

Inventors: Shiro Koide (Kariya, JP); Daisuke Dobashi (Tokyo, JP); Yohei Sakurai (Fujisawa, JP)
Assignees: DENSO CORPORATION; TYCO ELECTRONICS JAPAN G.K.
H05K1/14H01Q1/12H01Q1/36H05K3/341H05K3/36H05K2201/10
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Quick Facts
Patent No.
US 11,191,161
App. No.
16/941,362
Granted
Nov 30, 2021
Kind
B2
Abstract

An electronic circuit includes a first printed wiring board, a second printed wiring board and a third printed wiring board. The second printed wiring board is mounted such that one edge of the second printed wiring board abuts on a part mounting surface of the first printed wiring board on which a part is mounted. The third printed wiring board is mounted such that one edge of the third printed wiring board abuts on the part mounting surface. The second and third printed wiring boards are connected to each other in a state where plate thickness directions thereof are oriented in different directions from each other about a normal line to the part mounting surface. Further, at least one of the second printed wiring board and the third printed wiring board is provided with an antenna pattern.

Claims (23)

1. An electronic circuit comprising:

a first printed wiring board having a part mounting surface on which a part is mounted;

a second printed wiring board mounted on the first printed wiring board such that one edge of the second printed wiring board abuts on the part mounting surface; and

a third printed wiring board mounted on the first printed wiring board such that one edge of the third printed wiring board abuts on the part mounting surface, wherein

the second printed wiring board and the third printed wiring board are connected to each other in a state where a plate thickness direction of the second printed wiring board and a plate thickness direction of the third printed wiring board are oriented in different directions from each other about a normal line to the part mounting surface, and

at least one of the second printed wiring board and the third printed wiring board is provided with an antenna pattern.

2. The electronic circuit according to claim 1 , wherein

the first printed wiring board is provided with one of a hole and a recess,

the second printed wiring board is provided with a projection on the one edge at a position other than ends of the one edge, and

the projection of the second printed wiring board is received in the one of the hole and the recess of the first printed wiring board.

3. The electronic circuit according to claim 1 , wherein

the first printed wiring board is provided with a location regulation portion to regulate a mounting location of the second printed wiring board relative to the first printed wiring board,

the third printed wiring board is provided with a projection on the one edge of the third printed wiring board,

the first printed wiring board is further provided with one of a hole and a recess that receives the projection of the third printed wiring board in a state where the second printed wiring board and the third printed wiring board are connected to each other and the second printed wiring board is arranged at the mounting location regulated by the location regulation portion, wherein

the one of the hole and the recess of the first printed wiring board is configured to have an inner diameter that increases as a function of distance from a connecting portion between the second printed wiring board and the third printed wiring board.

4. The electronic circuit according to claim 1 , wherein

the second printed wiring board is provided with a through hole at a connecting portion where the second printed wiring board is connected to the third printed wiring board,

the third printed wiring board is provided with an engagement portion that passes through and engages with the through hole of the second printed wiring board, wherein

the engagement portion of the third printed wiring board is soldered to the through hole of the second printed wiring board in a state where the engagement portion passes through the through hole.

5. The electronic circuit according to claim 4 , wherein

the second printed wiring board is provided with the antenna pattern,

the engagement portion of the third printed wiring board has an expanding portion at a tip end, the expanding portion expanding in a direction toward the one edge of the third printed wiring board, and

the engagement portion of the third printed wiring board is soldered to the through hole of the second printed wiring board in a state where the expanding portion is engaged with a perimeter edge of the through hole.

Assignments (2)
CHANGE OF NAME Recorded Dec 18, 2024
From: TYCO ELECTRONICS JAPAN G.K.
To: TE CONNECTIVITY JAPAN G.K.
Reel/Frame 069811/0353 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 23, 2020
From: KOIDE, SHIRO; DOBASHI, DAISUKE; SAKURAI, YOHEI
To: DENSO CORPORATION; TYCO ELECTRONICS JAPAN G.K.
Reel/Frame 054150/0056 →
Priority Claims (1)
JP JP2018-015601 · Jan 31, 2018 · national
Continuity (2)
Continuation PCTJP2019003429 · Jan 31, 2019
Related Publication 20200359498A1 · Nov 12, 2020
Cited By (2)
US 12,225,664 US 12,695,199