IP Library › Granted Patent US 12,350,790
Granted Patent B2
US 12,350,790 · App. 16/942,539 · Granted Jul 8, 2025

Measuring abrasive flow rates in a conduit

Inventors: Ernst H. Schubert (Snoqualmie Pass, WA); Kevin A. Hay (Des Moines, WA); Axel H. Henning (Black Diamond, WA)
Assignee: Hypertherm, Inc.
B24C7/0015B24C1/045B24C5/04
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,350,790
App. No.
16/942,539
Granted
Jul 8, 2025
Kind
B2
Abstract

The present disclosure relates to abrasive material delivery systems for liquid jet cutting systems. The abrasive material delivery systems can include a valve configured to adjust an inflow of abrasive material into the abrasive material delivery system from a source of abrasive material. The systems can include a chamber downstream of the valve and configured to receive the inflow of abrasive material from the valve. The systems can include a metering component configured to control an outflow of abrasive from the chamber to a cutting head of the liquid jet cutting system. In some embodiments, the systems include a sensor configured to monitor movement of a top surface of a portion of abrasive material within the chamber as the top surface moves through the chamber; and a processing device operably connected to the sensor and configured to determine an abrasive flow rate through the metering component based on a speed of the top surface as monitored by the sensor.

Claims (31)

1. An abrasive material delivery system for use with a liquid jet cutting system, the abrasive material delivery system comprising:

a valve configured to adjust or stop an inflow of abrasive material into the abrasive material delivery system from a source of abrasive material;

a chamber downstream of the valve and configured to receive the inflow of abrasive material from the valve;

a metering component configured to control an outflow of abrasive from the chamber to a cutting head of the liquid jet cutting system;

a sensor configured to monitor movement of a top surface of a portion of abrasive material within the chamber as the top surface moves through the chamber, wherein the sensor is configured to detect the top surface of the portion of abrasive material at a first location in the chamber and at a second location in the chamber downstream of the first location; and

a processing device operably connected to the sensor and configured to determine an abrasive flow rate through the metering component based on a speed of the top surface as monitored by the sensor.

2. The abrasive material delivery system of claim 1 wherein the metering component includes an adjustable cross-section orifice.

3. The abrasive material delivery system of claim 1 wherein the abrasive material delivery system is a variable flow abrasive material delivery system.

4. The abrasive material delivery system of claim 1 wherein the abrasive material delivery system is configured to connect to an abrasive hopper.

5. The abrasive material delivery system of claim 1 wherein the valve is a pinch valve configured to flatten the top surface of the portion of abrasive material.

6. The abrasive material delivery system of claim 1 wherein the metering component includes one or more of a fluidizer, a wheel, a variable area, a pneumatic component, a vibratory feed component, or a fixed orifice.

7. The abrasive material delivery system of claim 1 wherein the chamber has a substantially uniform cross-section as measured perpendicular to a flow path of abrasive material through the chamber.

8. The abrasive material delivery system of claim 1 wherein the chamber is a portion of a tube having a constant cross-section.

9. The abrasive material delivery system of claim 1 wherein the valve is configured to close and thereby form the top surface of the portion of abrasive material, wherein the processing device determines the speed of the top surface based at least in part on the sensor sensing the top surface of the portion of abrasive material at the first location and the second location, and wherein the valve is further configured to open when the top surface of the portion of abrasive material passes the second location.

10. The abrasive material delivery system of claim 1 wherein the processing device is configured to determine the speed of the top surface of the abrasive material based on a period of time between detecting the top surface at the first location and detecting the top surface at the second location.

11. The abrasive material delivery system of claim 1 wherein the sensor is configured to start a timer when the sensor detects the top surface at the first location, and wherein the sensor is further configured to stop the timer when the sensor detects the top surface at the second location.

12. The abrasive material delivery system of claim 11 wherein the valve is configured to open when the timer is stopped.

13. The abrasive material delivery system of claim 11 wherein a volume of the chamber downstream of the second location is greater than a volume of the chamber between the first location and the second location.

14. The abrasive material delivery system of claim 1 wherein the sensor is configured to periodically monitor movement of the top surface of the abrasive material.

15. The abrasive material delivery system of claim 1 wherein the chamber has a larger cross-section at a downstream end of the chamber than at an upstream end of the chamber.

16. The abrasive material delivery system of claim 1 wherein the chamber has a bulged portion between the valve and the metering component.

17. An abrasive material delivery system for use with a liquid jet cutting system, the abrasive material delivery system comprising:

a valve configured to adjust or stop an inflow of abrasive material into the abrasive material delivery system from a source of abrasive material;

a chamber downstream of the valve and configured to receive the inflow of abrasive material from the valve;

a metering component configured to control an outflow of abrasive material from the chamber to a cutting head of the liquid jet cutting system;

a sensor configured to monitor movement of a top surface of a portion of abrasive material within the chamber as the top surface moves through the chamber; and

a processing device operably connected to the sensor and configured to determine an abrasive flow rate through the metering component based on a speed of the top surface as monitored by the sensor.

18. The abrasive material delivery system of claim 17 wherein the chamber is configured to contain the inflow of abrasive material in the absence of liquid and provide the outflow of abrasive to the cutting head in the absence of liquid.

19. The abrasive material delivery system of claim 17 wherein the valve is configured to close and thereby form the top surface of the portion of abrasive material, wherein the processing device determines the speed of the top surface based at least in part on the sensor sensing the top surface of the portion of abrasive material at a first point in the chamber and at a second point in the chamber, and wherein the valve is further configured to open when the top surface of the portion of abrasive material passes the second point in the chamber.

20. The abrasive material delivery system of claim 17 wherein the sensor is configured to detect the top surface of the portion of abrasive material at a first location in the chamber and to detect the top surface of the portion of abrasive material at a second location downstream of the first location, and wherein the processing device is configured to determine the speed of the top surface of the abrasive material based on a period of time between detecting the top surface at the first location and detecting the top surface at the second location.

21. The abrasive material delivery system of claim 1 , further comprising the cutting head, wherein the cutting head is configured to combine the outflow of abrasive material from the chamber with a high-pressure jet of liquid.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2025
From: OMAX CORPORATION
To: HYPERTHERM, INC.
Reel/Frame 071018/0319 →
CORRECTIVE ASSIGNMENT TO CORRECT THE COLLATERAL AGENT/ASSIGNEE'S ADDRESS PREVIOUSLY RECORDED AT REEL: 058573 FRAME: 0832. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Feb 8, 2022
From: HYPERTHERM, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 058983/0459 →
SECURITY INTEREST Recorded Jan 5, 2022
From: HYPERTHERM, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 058573/0832 →
SECURITY INTEREST Recorded Jan 5, 2022
From: HYPERTHERM, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 058982/0425 →
SECURITY INTEREST Recorded Jan 5, 2022
From: HYPERTHERM, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 058982/0480 →
SECURITY INTEREST Recorded Dec 30, 2021
From: OMAX CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 058510/0840 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2021
From: SCHUBERT, ERNST H.; HAY, KEVIN A.; HENNING, AXEL H.
To: OMAX CORPORATION
Reel/Frame 056623/0632 →
Continuity (2)
Provisional Application 62879995 · Jul 29, 2019
Related Publication 20210046610A1 · Feb 18, 2021
References Cited (326)
US 773665A · Murray · 1904 [cited by applicant]
US 1081071A · Westland · 1913 [cited by applicant]
US 1144556A · Lowe · 1915 [cited by applicant]
US 1684431A · Behee, Jr. · 1928 [cited by applicant]
US 2359352A · Bucknam et al. · 1944 [cited by applicant]
US 2929120A · Brandt et al. · 1960 [cited by applicant]
US 2985050A · Schwacha · 1961 [cited by applicant]
US 3014665A · Shames et al. · 1961 [cited by applicant]
US 3073070A · Mead · 1963 [cited by applicant]
US 3137978A · Incantalupo · 1964 [cited by applicant]
US 3148484A · Meek · 1964 [cited by applicant]
US 3201901A · Pauli · 1965 [cited by applicant]
US 3270464A · Bowling, Jr. et al. · 1966 [cited by applicant]
US 3413794A · Bell et al. · 1968 [cited by applicant]
US 3452412A · Allman, Jr. et al. · 1969 [cited by applicant]
US 3507740A · Gaspari · 1970 [cited by applicant]
US 3543444A · Mehta · 1970 [cited by applicant]
US 3553895A · Power · 1971 [cited by applicant]
US 3593459A · Kulischenko · 1971 [cited by applicant]
US 3708936A · Rogers · 1973 [cited by applicant]
US 3769753A · Fleischer · 1973 [cited by applicant]
US 3834082A · Grudzinski · 1974 [cited by applicant]
US 4048918A · Peck · 1977 [cited by applicant]
US 4049545A · Horvath · 1977 [cited by applicant]
US 4058986A · Granholm · 1977 [cited by applicant]
US 4075789A · Dremann · 1978 [cited by applicant]
US 4109636A · Burge · 1978 [cited by applicant]
US 4125969A · Easton · 1978 [cited by applicant]
US 4164183A · Peck · 1979 [cited by applicant]
US 4216906A · Olsen et al. · 1980 [cited by applicant]
US 4253610A · Larkin · 1981 [cited by applicant]
US 4280913A · Applegate et al. · 1981 [cited by applicant]
US 4478368A · Me · 1984 [cited by applicant]
US 4522597A · Gallant · 1985 [cited by applicant]
US 4534427A · Wang et al. · 1985 [cited by applicant]
US 4545157A · Saurwein · 1985 [cited by applicant]
US 4547286A · Hsiung · 1985 [cited by applicant]
US 4555872A · Me · 1985 [cited by applicant]
US 4617064A · Moore · 1986 [cited by applicant]
US 4666083A · Me · 1987 [cited by applicant]
US 4674239A · Jodoin · 1987 [cited by applicant]
US 4698940A · Zwicker · 1987 [cited by applicant]
US 4742623A · Meurer et al. · 1988 [cited by applicant]
US 4785027A · Brasington et al. · 1988 [cited by applicant]
US 4802312A · Glaeser et al. · 1989 [cited by applicant]
US 4802993A · Katoh · 1989 [cited by applicant]
US 4815241A · Woodson · 1989 [cited by applicant]
US 4816284A · Magee · 1989 [cited by applicant]
US 4817342A · Martin et al. · 1989 [cited by applicant]
US 4817874A · Jarzebowicz · 1989 [cited by applicant]
US 4820913A · Haddock · 1989 [cited by applicant]
US 4821467A · Woodson et al. · 1989 [cited by applicant]
US 4872293A · Yasukawa et al. · 1989 [cited by applicant]
US 4872975A · Benson · 1989 [cited by applicant]
US 4878320A · Woodson · 1989 [cited by applicant]
US 4934111A · Hashish et al. · 1990 [cited by applicant]
US 4951429A · Hashish et al. · 1990 [cited by applicant]
US 4955164A · Hashish et al. · 1990 [cited by applicant]
US 4984397A · Van Leeuwen · 1991 [cited by applicant]
US 4993200A · Morioka et al. · 1991 [cited by applicant]
US 4995202A · Gardner et al. · 1991 [cited by applicant]
US 5018670A · Chalmers · 1991 [cited by applicant]
US 5081799A · Kirschner et al. · 1992 [cited by applicant]
US 5098229A · Meier et al. · 1992 [cited by applicant]
US 5107630A · Lodewijk · 1992 [cited by applicant]
US 5109636A · Lloyd et al. · 1992 [cited by applicant]
US 5176018A · Thompson · 1993 [cited by applicant]
US 5192532A · Guay et al. · 1993 [cited by applicant]
US 5201150A · Kuboyama et al. · 1993 [cited by applicant]
US 5203794A · Stratford et al. · 1993 [cited by applicant]
US 5205998A · Boone et al. · 1993 [cited by applicant]
US 5230185A · Kirschner et al. · 1993 [cited by applicant]
US 5236459A · Koch et al. · 1993 [cited by applicant]
US 5239788A · Woodson · 1993 [cited by applicant]
US 5271255A · Thompson · 1993 [cited by applicant]
US 5320289A · Hashish et al. · 1994 [cited by applicant]
US 5330167A · Plumb · 1994 [cited by applicant]
US 5335459A · Dale · 1994 [cited by applicant]
US 5352254A · Celikkaya · 1994 [cited by applicant]
US 5363556A · Banholzer et al. · 1994 [cited by applicant]
US 5407379A · Shank et al. · 1995 [cited by applicant]
US 5413270A · Lechervy et al. · 1995 [cited by applicant]
US 5415584A · Brooke et al. · 1995 [cited by applicant]
US 5421766A · Shank, Jr. · 1995 [cited by applicant]
US 5441441A · Cook et al. · 1995 [cited by applicant]
US 5468066A · Hammonds · 1995 [cited by applicant]
US 5472367A · Slocum et al. · 1995 [cited by applicant]
US 5484325A · Shank · 1996 [cited by applicant]
US 5492497A · Brooke et al. · 1996 [cited by applicant]
US 5508596A · Olsen · 1996 [cited by applicant]
US 5509849A · Spears, Jr. · 1996 [cited by applicant]
US 5588901A · Rubey, III et al. · 1996 [cited by applicant]
US 5591064A · Spears, Jr. · 1997 [cited by applicant]
US 5592841A · Champaigne · 1997 [cited by applicant]
US 5616067A · Goenka · 1997 [cited by applicant]
US 5637030A · Chopra et al. · 1997 [cited by applicant]
US 5643058A · Erichsen et al. · 1997 [cited by applicant]
US 5647989A · Hayashi et al. · 1997 [cited by applicant]
US 5649694A · Buck · 1997 [cited by applicant]
US 5679058A · Rhoades · 1997 [cited by applicant]
US 5704824A · Hashish et al. · 1998 [cited by applicant]
US 5730635A · De Haas et al. · 1998 [cited by applicant]
US 5759086A · Klingel · 1998 [cited by applicant]
US 5771873A · Potter et al. · 1998 [cited by applicant]
US 5800246A · Tomioka · 1998 [cited by applicant]
US 5851139A · Xu · 1998 [cited by applicant]
US 5876267A · Kanda · 1999 [cited by applicant]
US 5892345A · Olsen · 1999 [cited by applicant]
US 5908349A · Warehime · 1999 [cited by applicant]
US 5928493A · MorkovskV et al. · 1999 [cited by applicant]
US 5947800A · Fring · 1999 [cited by applicant]
US 5979663A · Herrmann et al. · 1999 [cited by applicant]
US 6001265A · Toyama et al. · 1999 [cited by applicant]
US 6077152A · Warehime · 2000 [cited by applicant]
US 6083001A · Deardon et al. · 2000 [cited by applicant]
US 6098677A · Wegman et al. · 2000 [cited by applicant]
US 6099388A · Fritsch et al. · 2000 [cited by applicant]
US 6120351A · Zeng · 2000 [cited by applicant]
US 6136386A · Nakahigashi et al. · 2000 [cited by applicant]
US 6155245A · Zanzuri · 2000 [cited by applicant]
US 6168503B1 · Pao et al. · 2001 [cited by applicant]
US 6200203B1 · Xu et al. · 2001 [cited by applicant]
US 6227768B1 · Higuchi et al. · 2001 [cited by applicant]
US 6248369B1 · Nier et al. · 2001 [cited by applicant]
US 6276993B1 · Miller · 2001 [cited by applicant]
US 6280302B1 · Hashish et al. · 2001 [cited by applicant]
US 6283833B1 · Pao et al. · 2001 [cited by applicant]
US 6299510B1 · Massenburg · 2001 [cited by applicant]
US 6328638B1 · Hopkins et al. · 2001 [cited by applicant]
US 6346197B1 · Stephenson et al. · 2002 [cited by applicant]
US 6361416B1 · Hopkins et al. · 2002 [cited by applicant]
US 6375547B1 · Massenburg · 2002 [cited by applicant]
US 6390898B1 · Pieper · 2002 [cited by applicant]
US 6425804B1 · Pettit · 2002 [cited by examiner]
US 6533640B1 · Nopwaskey et al. · 2003 [cited by applicant]
US 6533643B1 · Feng · 2003 [cited by applicant]
US 6548173B2 · Erdemir et al. · 2003 [cited by applicant]
US 6607670B2 · Baldwin et al. · 2003 [cited by applicant]
US 6676039B2 · Lindsey et al. · 2004 [cited by applicant]
US 6746593B2 · Herbst · 2004 [cited by applicant]
US 6752685B2 · Ulrich et al. · 2004 [cited by applicant]
US 6804459B2 · Raghavan et al. · 2004 [cited by applicant]
US 6922605B1 · Olsen · 2005 [cited by applicant]
US 6932285B1 · Zeng · 2005 [cited by applicant]
US 6970793B2 · Pearson et al. · 2005 [cited by applicant]
US 7014770B2 · Umezawa et al. · 2006 [cited by applicant]
US 7035708B1 · Olsen · 2006 [cited by applicant]
US 7040959B1 · Panuska et al. · 2006 [cited by applicant]
US 7074112B2 · Olsen · 2006 [cited by applicant]
US 7090054B2 · Iwamasa et al. · 2006 [cited by applicant]
US 7094135B2 · Chisum et al. · 2006 [cited by applicant]
US 7108585B1 · Dorfman et al. · 2006 [cited by applicant]
US 7138063B1 · Teter et al. · 2006 [cited by applicant]
US 7153186B2 · Popescu et al. · 2006 [cited by applicant]
US 7419418B2 · Alberts et al. · 2008 [cited by applicant]
US 7465215B2 · Shimizu et al. · 2008 [cited by applicant]
US 7485027B2 · Miller · 2009 [cited by applicant]
US 7524233B1 · Reilley · 2009 [cited by applicant]
US 7549911B2 · Nguyen · 2009 [cited by applicant]
US 7585201B2 · Kanai et al. · 2009 [cited by applicant]
US 7758742B2 · Powell · 2010 [cited by applicant]
US 7815490B2 · Liu · 2010 [cited by applicant]
US 7959790B2 · Woytowich et al. · 2011 [cited by applicant]
US 7980923B2 · Olmo et al. · 2011 [cited by applicant]
US 7981301B2 · Powell · 2011 [cited by applicant]
US 8048279B2 · Powell et al. · 2011 [cited by applicant]
US 8123591B2 · Olsen · 2012 [cited by applicant]
US 8308525B2 · Hashish et al. · 2012 [cited by applicant]
US 8342912B2 · Funatsu et al. · 2013 [cited by applicant]
US 8475230B2 · Summers et al. · 2013 [cited by applicant]
US 8593086B2 · Hay et al. · 2013 [cited by applicant]
US 8821213B2 · Liu et al. · 2014 [cited by applicant]
US 8892236B2 · Olsen · 2014 [cited by applicant]
US 8904912B2 · Raghavan et al. · 2014 [cited by applicant]
US 8920213B2 · Liu · 2014 [cited by applicant]
US 9003955B1 · Stang et al. · 2015 [cited by applicant]
US 9011204B2 · Raghavan et al. · 2015 [cited by applicant]
US 9044873B2 · Guglielmetti et al. · 2015 [cited by applicant]
US 9050704B1 · Liu et al. · 2015 [cited by applicant]
US 9067331B2 · Stang · 2015 [cited by applicant]
US 9090808B1 · Liu et al. · 2015 [cited by applicant]
US 9095955B2 · Raghavan et al. · 2015 [cited by applicant]
US 9108297B2 · Schubert et al. · 2015 [cited by applicant]
US 9138863B2 · Schubert · 2015 [cited by examiner]
US 9193036B2 · Kanazawa et al. · 2015 [cited by applicant]
US 9273682B2 · Stang · 2016 [cited by applicant]
US 9283656B2 · Schubert et al. · 2016 [cited by applicant]
US 9370871B2 · Hashish et al. · 2016 [cited by applicant]
US 9492908B2 · Schubert et al. · 2016 [cited by applicant]
US 9586306B2 · Zhang et al. · 2017 [cited by applicant]
US 9610674B2 · Raghavan et al. · 2017 [cited by applicant]
US 9636799B2 · Liu et al. · 2017 [cited by applicant]
US 9638357B1 · Raghavan et al. · 2017 [cited by applicant]
US 9649744B2 · Raghavan et al. · 2017 [cited by applicant]
US 9658613B2 · Henning et al. · 2017 [cited by applicant]
US 9720399B2 · Henning et al. · 2017 [cited by applicant]
US 9727051B2 · Henning et al. · 2017 [cited by applicant]
US 9772620B2 · Henning et al. · 2017 [cited by applicant]
US 9810205B2 · Raghavan et al. · 2017 [cited by applicant]
US 9827649B2 · Schubert et al. · 2017 [cited by applicant]
US 9891617B2 · Henning et al. · 2018 [cited by applicant]
US 9976675B1 · Raghavan et al. · 2018 [cited by applicant]
US 9989954B2 · Henning et al. · 2018 [cited by applicant]
US 10010999B2 · Raghavan et al. · 2018 [cited by applicant]
US 10048676B2 · Henning et al. · 2018 [cited by applicant]
US 10146209B2 · Henning et al. · 2018 [cited by applicant]
US 10201914B2 · Schlough et al. · 2019 [cited by applicant]
US 10564627B2 · Henning et al. · 2020 [cited by applicant]
US 10606240B2 · Henning et al. · 2020 [cited by applicant]
US 10642252B2 · Henning et al. · 2020 [cited by applicant]
US 10656622B2 · Henning et al. · 2020 [cited by applicant]
US 10675733B2 · Zhang et al. · 2020 [cited by applicant]
US 10780551B2 · Zhang et al. · 2020 [cited by applicant]
US 10801651B2 · Olsen et al. · 2020 [cited by applicant]
US 10808688B1 · Raghavan et al. · 2020 [cited by applicant]
US 10981259B2 · Lerea et al. · 2021 [cited by applicant]
US 11224987B1 · Guglielmetti · 2022 [cited by applicant]
US 11577366B2 · Schubert et al. · 2023 [cited by applicant]
US 20010030245A1 · Lindsey et al. · 2001 [cited by applicant]
US 20010046833A1 · Hashish et al. · 2001 [cited by applicant]
US 20020028634A1 · Massenburg · 2002 [cited by applicant]
US 20030034122A1 · Asai · 2003 [cited by applicant]
US 20030044380A1 · Zhu et al. · 2003 [cited by applicant]
US 20030085295A1 · Dijkman et al. · 2003 [cited by applicant]
US 20030166378A1 · Fuksshimov et al. · 2003 [cited by applicant]
US 20030224704A1 · Shank · 2003 [cited by applicant]
US 20040107810A1 · Sciulli et al. · 2004 [cited by applicant]
US 20040132383A1 · Langford et al. · 2004 [cited by applicant]
US 20040198179A1 · Gadd · 2004 [cited by applicant]
US 20050017091A1 · Olsen et al. · 2005 [cited by applicant]
US 20050070205A1 · Korovin et al. · 2005 [cited by applicant]
US 20050186888A1 · Gadd · 2005 [cited by applicant]
US 20050239371A1 · Togawa · 2005 [cited by applicant]
US 20060219825A1 · Rohring et al. · 2006 [cited by applicant]
US 20060223423A1 · Dorfman et al. · 2006 [cited by applicant]
US 20070015442A1 · Shin · 2007 [cited by applicant]
US 20070021039A1 · Haslett · 2007 [cited by applicant]
US 20070037495A1 · Matsubara · 2007 [cited by examiner]
US 20070128988A1 · Rivir et al. · 2007 [cited by applicant]
US 20070131455A1 · Blange · 2007 [cited by applicant]
US 20070154561A1 · Takeda et al. · 2007 [cited by applicant]
US 20070155289A1 · Miller · 2007 [cited by applicant]
US 20070218808A1 · Shimizu et al. · 2007 [cited by applicant]
US 20080060493A1 · Liu · 2008 [cited by applicant]
US 20080110311A1 · Stangherlin · 2008 [cited by applicant]
US 20080145156A1 · Livingood et al. · 2008 [cited by applicant]
US 20090042492A1 · Hashish · 2009 [cited by applicant]
US 20090064832A1 · Caretta et al. · 2009 [cited by applicant]
US 20090214628A1 · de Rijk · 2009 [cited by applicant]
US 20090229793A1 · Treb et al. · 2009 [cited by applicant]
US 20090258582A1 · Miller · 2009 [cited by applicant]
US 20090311944A1 · Olsen · 2009 [cited by applicant]
US 20090318064A1 · Hashish · 2009 [cited by applicant]
US 20100003894A1 · Miller et al. · 2010 [cited by applicant]
US 20100124872A1 · Hashish et al. · 2010 [cited by applicant]
US 20100269593A1 · Moser et al. · 2010 [cited by applicant]
US 20110008964A1 · Hughes · 2011 [cited by applicant]
US 20110214757A1 · Igarashi · 2011 [cited by applicant]
US 20110269382A1 · Deleris · 2011 [cited by applicant]
US 20120021676A1 · Schubert et al. · 2012 [cited by applicant]
US 20120085211A1 · Liu et al. · 2012 [cited by applicant]
US 20120145647A1 · Volkel et al. · 2012 [cited by applicant]
US 20120156969A1 · Liu · 2012 [cited by applicant]
US 20120160706A1 · Poirier et al. · 2012 [cited by applicant]
US 20120196516A1 · Funatsu et al. · 2012 [cited by applicant]
US 20120252325A1 · Schubert et al. · 2012 [cited by applicant]
US 20120252326A1 · Schubert · 2012 [cited by examiner]
US 20120282845A1 · Whang et al. · 2012 [cited by applicant]
US 20130005225A1 · Russo · 2013 [cited by applicant]
US 20130025425A1 · Knaupp et al. · 2013 [cited by applicant]
US 20130105717A1 · Nguyen · 2013 [cited by applicant]
US 20130267152A1 · Tera et al. · 2013 [cited by applicant]
US 20140045409A1 · Zhang et al. · 2014 [cited by applicant]
US 20140087635A1 · Ogawa et al. · 2014 [cited by applicant]
US 20140213150A1 · Schubert et al. · 2014 [cited by applicant]
US 20140273768A1 · Guglielmetti et al. · 2014 [cited by applicant]
US 20150031270A1 · Miller · 2015 [cited by applicant]
US 20150336239A1 · Liu et al. · 2015 [cited by applicant]
US 20160325401A1 · Meyer · 2016 [cited by applicant]
US 20170059058A1 · Hemme · 2017 [cited by applicant]
US 20170165810A1 · Zhang et al. · 2017 [cited by applicant]
US 20170190021A1 · Zhang et al. · 2017 [cited by applicant]
US 20170225297A1 · Trull, Jr. et al. · 2017 [cited by applicant]
US 20170297168A1 · Raghavan et al. · 2017 [cited by applicant]
US 20180104843A1 · Adams · 2018 [cited by examiner]
US 20180161958A1 · Schubert et al. · 2018 [cited by applicant]
US 20180197018A1 · Nakasu et al. · 2018 [cited by applicant]
US 20180264625A1 · Schneidau · 2018 [cited by examiner]
US 20180320802A1 · Raghavan et al. · 2018 [cited by applicant]
US 20180364679A1 · Henning et al. · 2018 [cited by applicant]
US 20190101894A1 · Henning et al. · 2019 [cited by applicant]
US 20190249805A1 · Olsen et al. · 2019 [cited by applicant]
US 20200007254A1 · Hay et al. · 2020 [cited by applicant]
US 20200406424A1 · Zhang et al. · 2020 [cited by applicant]
US 20210107113A1 · Linde · 2021 [cited by examiner]
US 20210107114A1 · Linde · 2021 [cited by examiner]
US 20210187778A1 · Denney et al. · 2021 [cited by applicant]
US 20230143795A1 · Schubert et al. · 2023 [cited by applicant]
CN 101357809A · 2009 [cited by applicant]
CN 101811287A · 2010 [cited by applicant]
CN 201785277U · 2011 [cited by applicant]
CN 102139978B · 2011 [cited by applicant]
CN 202415300U · 2012 [cited by applicant]
EP 0165690A2 · 1985 [cited by applicant]
EP 0761603A1 · 1997 [cited by applicant]
FR 2452696A1 · 1980 [cited by applicant]
GB 2198975A · 1988 [cited by applicant]
GB 2483740A · 2012 [cited by applicant]
JP 2012157956A · 2012 [cited by applicant]
KR 1019930008692B1 · 1993 [cited by applicant]
KR 101678356B1 · 2016 [cited by applicant]
WO 2002085572A1 · 2002 [cited by applicant]
WO 2003011524A1 · 2003 [cited by applicant]
WO 03055644A1 · 2003 [cited by applicant]
WO 2009050251A2 · 2009 [cited by applicant]
WO 2010122336A2 · 2010 [cited by applicant]
WO 2017134242A1 · 2017 [cited by applicant]
WO 2018197018A1 · 2018 [cited by applicant]
Ruppenthal, Michael, “Carinox S.A. Purchases Third Waterjet Cutting Machine from Flow International Corporation” (http://www.businesswire.com/news/home/20031218005772/en/Carinox), Business Wire, Dec. 18, 2003, p. 1, Ken… [cited by applicant]
Operation Manual Abrasive Delivery System Type ADS-24-11, Straaltechniek International B.V., © Flow Europe GmbH, Jul. 2000, 28 pages, The Netherlands. [cited by applicant]
Bakalar, Tomas et al., “Heavy metal removal using reverse osmosis”, Acta Montanistica Slovaca Rocnik 14 (2009), cislo 3, 250-253. [cited by applicant]
Hashish, M., “Waterjet Machine Tool of the Future”, 9th American Waterjet Conference, Aug. 23-26, 1997, Paper 58, 15 pages. [cited by applicant]
Tsai, Feng-Che et al., “Abrasive jet polishing of micro groove using compound SiC abrasives with compound additives”, Advanced Materials Research vols. 481-420 (2012), pp. 2153-2157, © 2012 Trans Tech Publications, Swit… [cited by applicant]
Fox Solids Conveying Educators, http://www.flowmeterdirectory.com/solid-conveying-eductor.html, accessed May 24, 2011, 2 pages. [cited by applicant]
Hashish, Porter Cable Pancake Compressor Instruction Manual, 2006, 66 pages. [cited by applicant]
European Patent Office International Search Authority, International Search Report and Written Opinion mailed Jan. 18, 2021 for PCT/US2020/044093 filed Jul. 29, 2020, Applicant: OMAX Corporation, 23 pages. [cited by applicant]