Heat dissipation wall system
A heat dissipation wall system includes a base wall having an outer surface, a plurality of side walls extending approximately perpendicularly from the base wall to define a component housing between the base wall and the side walls, and a plurality of heat dissipation channels defined by the base wall and extending into the base wall from the outer surface. Each of the heat dissipation channels includes a respective first airflow aperture that extends through the base wall from the outer surface to the component housing and that is configured to allow an airflow adjacent the outer surface to enter the component housing, and a respective second airflow aperture that is spaced apart from the first airflow aperture, that extends through the base wall from the outer surface to the component housing, and that is configured to allow an airflow adjacent the outer surface to enter the component housing.
1. A heat dissipation wall system, comprising:
a base wall including an outer surface;
a plurality of side walls extending approximately perpendicularly from the base wall in order to define a component housing between the base wall and the plurality of side walls; and
a plurality of elongated heat dissipation channels that each:
are defined by the base wall and extend into the base wall from the outer surface;
include a first end that is located adjacent a first side wall that is included in the plurality of side walls; and
include a second end that is located opposite that heat dissipation channel from the first end and adjacent a second side wall that is included in the plurality of side walls and that is located opposite the base wall from the first side wall such that the second side wall is substantially parallel to the first side wall,
wherein each of the plurality of elongated heat dissipation channels includes:
a respective first airflow aperture that extends through the base wall from the outer surface to the component housing and that is configured to allow an airflow adjacent the outer surface to enter the component housing; and
a respective second airflow aperture that is spaced apart from the first airflow aperture, that extends through the base wall from the outer surface to the component housing, and that is configured to allow an airflow adjacent the outer surface to enter the component housing, and
wherein a portion of each of the plurality of elongated heat dissipation channels extends between the first airflow aperture and the second airflow aperture without extending through the base wall to the component housing.
2. The heat dissipation wall system of claim 1 , further comprising:
at least one coupling feature that is included on the plurality of side walls and that is configured to couple to a computing device chassis.
3. The heat dissipation wall system of claim 1 , wherein each respective first airflow aperture is located on the first end of each of the plurality of elongated heat dissipation channels, and wherein each respective second airflow aperture is located on the second end of each of the plurality of elongated heat dissipation channels that is opposite the first end.
4. The heat dissipated wall system of claim 1 , wherein each of the plurality of elongated heat dissipation channels extend substantially along a length of the base wall.
5. The heat dissipation wall system of claim 1 , wherein each of the plurality of elongated heat dissipation channels includes a linear configuration and is oriented substantially parallel to the other elongated heat dissipation channels.
6. The heat dissipation wall system of claim 1 , wherein each of the plurality of elongated heat dissipation channels includes at least two sections that are provided in an angular configuration relative to each other, and is oriented substantially parallel to the other heat dissipation channels.
7. An Information Handling System (IHS), comprising:
a chassis;
a heat producing component that is coupled to the chassis; and
a heat dissipation cover that is coupled to the chassis adjacent the heat producing component, wherein the heat dissipation cover includes:
a base wall that includes an outer surface and that is spaced apart from the chassis;
a plurality of side walls extending between the base wall and the chassis in order to define a component housing that is located between the base wall, the plurality of side walls, and the chassis, and that houses the heat producing component; and
a plurality of elongated heat dissipation channels that each:
are defined by the base wall and extend into the base wall from the outer surface;
include a first end that is located adjacent a first side wall that is included in the plurality of side walls; and
include a second end that is located opposite that heat dissipation channel from the first end and adjacent a second side wall that is included in the plurality of side walls and that is located opposite the base wall from the first side wall such that the second side wall is substantially parallel to the first side wall,
wherein each of the plurality of elongated heat dissipation channels includes:
a respective first airflow aperture that extends through the base wall from the outer surface to the component housing and that is configured to allow an airflow adjacent the outer surface to enter the component housing; and
a respective second airflow aperture that is spaced apart from the first airflow aperture, that extends through the base wall from the outer surface to the component housing, and that is configured to allow an airflow adjacent the outer surface to enter the component housing, and
wherein a portion of each of the plurality of elongated heat dissipation channels extends between the first airflow aperture and the second airflow aperture without extending through the base wall to the component housing.
8. The IHS of claim 7 , wherein the heat dissipation cover includes:
at least one coupling feature that is included on the plurality of side walls and that engages the chassis to couple the heat dissipation cover to the chassis.
9. The IHS of claim 7 , wherein each respective first airflow aperture is located on the first end of each of the plurality of elongated heat dissipation channels, and wherein each respective second airflow aperture is located on the second end of each of the plurality of elongated heat dissipation channels that is opposite the first end.
10. The IHS of claim 7 , wherein each of the plurality of elongated heat dissipation channels extend substantially along a length of the base wall.
11. The IHS of claim 7 , wherein each of the plurality of elongated heat dissipation channels includes a linear configuration and is oriented substantially parallel to the other elongated heat dissipation channels.
12. The IHS of claim 7 , wherein each of the plurality of elongated heat dissipation channels includes at least two sections that are provided in an angular configuration relative to each other, and is oriented substantially parallel to the other heat dissipation channels.
13. The IHS of claim 7 , further comprising:
a thermal interface material engaging the heat producing component and the base wall.
14. A method for dissipating heat, comprising:
generating, by a heat producing component that is included on a chassis, heat;
conducting, by a heat dissipation cover that is coupled to the chassis via a plurality of sides walls and that includes a base wall that extends between the plurality of side walls to define a component housing that houses the heat producing component, the heat generated by the heat producing component; and
dissipating, via a plurality of elongated heat dissipation channels that each:
are defined by the base wall and extend into the base wall from the outer surface;
include a first end that is located adjacent a first side wall that is included in the plurality of side walls, and
include a second end that is located opposite that heat dissipation channel from the first end and adjacent a second side wall that is included in the plurality of side walls and that is located opposite the base wall from the first side wall such that the second side wall is substantially parallel to the first side wall,
the heat conducted by the heat dissipation cover,
wherein the dissipation includes:
allowing, by a respective first airflow aperture on each of the plurality of elongated heat dissipation channels that extends through the base wall from an outer surface of the base wall to the component housing, an airflow adjacent the outer surface of the base wall to enter the component housing; and
allowing, by a respective second airflow aperture that is spaced apart from the first airflow aperture and that extends through the base wall from the outer surface to the component housing, an airflow adjacent the outer surface of the base wall to enter the component housing,
wherein a portion of each of the plurality of elongated heat dissipation channels extends between the first airflow aperture and the second airflow aperture without extending through the base wall to the component housing.
15. The method of claim 14 , wherein the heat dissipation cover is coupled to the chassis via at least one coupling feature include on the plurality of sides walls.
16. The method of claim 14 , wherein each respective first airflow aperture is located on the first end of each of the plurality of elongated heat dissipation channels, and wherein each respective second airflow aperture is located on the second end of each of the plurality of elongated heat dissipation channels that is opposite the first end.
17. The method of claim 14 , wherein each of the plurality of elongated heat dissipation channels extend substantially along a length of the base wall.
18. The method of claim 14 , wherein each of the plurality of elongated heat dissipation channels includes a linear configuration and is oriented substantially parallel to the other elongated heat dissipation channels.
19. The method of claim 14 , wherein each of the plurality of elongated heat dissipation channels includes at least two sections that are provided in an angular configuration relative to each other, and is oriented substantially parallel to the other elongated heat dissipation channels.
20. The method of claim 14 , further comprising:
transferring, by a thermal interface material that engages the heat producing component and the base wall, the heat generated by the heat producing component to the heat dissipation cover.