Liquid cooling of high current devices in power flow control systems
A modular liquid cooling block is described for cooling high current devices deployed in power flow control systems. The liquid cooling blocks may have separate shower heads which may be configured for direct impingement, indirect impingement, or parallel flow cooling configurations. Voltage isolation of liquid cooling blocks from an enclosure of the power flow control system and from associated equipment enables serial or parallel connected power flow control units to inject substantial reactive power that may be configurable into a power transmission line. Associated power flow control systems are monitored for temperature, flow rate and pressure gradient. Redundant pumps and fan radiators contribute to reliable operation. Automatic shutdown and alarm may be provided.
1. An apparatus of a liquid cooling block comprising:
a liquid coolant input port configured to receive a liquid coolant;
a liquid coolant output port configured to return the liquid coolant;
a closed-circuit fluid assembly coupled to the liquid coolant input port and the liquid coolant output port, wherein the closed-circuit fluid assembly includes two halves that are machined to shape internal cavities for the liquid coolant and joined together to create a clam shell construction;
a pump configured to circulate the liquid coolant within the closed-circuit fluid assembly;
a plurality of showerheads each having an array of jetting apertures configured to generate jets of the liquid coolant; and
a cooling plate coupled to a wall of the liquid cooling block;
wherein an electronic assembly is thermally coupled to the cooling plate and wherein the jets of the liquid coolant generated by the array of jetting apertures directly impinge onto the cooling plate from the showerhead while circumventing any intervening channel structure to carry away heat generated by the electronic assembly.
2. The apparatus of claim 1 , wherein the cooling plate is patterned with three-dimensional features to improve cooling performance.
3. The apparatus of claim 2 , wherein a first one of the cooling plate patterned with a first set of three-dimensional features is interchangeable with a second one of the cooling plate patterned with a second set of three-dimensional features.
4. The apparatus of claim 1 , wherein the electronic assembly thermally coupled to the cooling plate comprises an array of high-current devices.
5. The apparatus of claim 4 , wherein the array of high current devices comprises a plurality of insulated gate bipolar transistors (IGBTs).
6. The apparatus of claim 1 , wherein the showerhead comprises a slot.
7. The apparatus of claim 1 , wherein the liquid cooling block is thermally coupled to a fan radiator configured to radiate the heat carried by the liquid coolant to ambient air.
8. The apparatus of claim 1 , wherein liquid coolant comprises a mixture of water and ethylene glycol or polyethylene glycol.