Micro-strand transceiver heat dissipation system
A micro-strand transceiver device heat dissipation system includes a transceiver device chassis, at least one transceiver component located in the transceiver device chassis, and micro-strand heat dissipator elements that are each positioned in the transceiver device chassis in a spaced apart orientation from the others of the micro-strand heat dissipator elements. Each of the micro-strand heat dissipator elements include a first micro-strand heat dissipator element portion that engages the at least one transceiver component, and a second micro-strand heat dissipator element portion that extends from the at least one transceiver component. The first micro-strand heat dissipator element portion on each of the micro-strand heat dissipator elements conducts heat generated by the at least one transceiver component to the second micro-strand heat dissipator element portion on that micro-strand heat dissipator element, which allows that heat to be dissipated.
1. A micro-strand transceiver device heat dissipation system, comprising:
a transceiver device chassis that includes a first end that defines an air inlet, and a second end that is located opposite the transceiver device chassis from the first end and that defines an air outlet;
at least one transceiver component located in the transceiver device chassis; and
a plurality of micro-strand heat dissipator elements that are each positioned in the transceiver device chassis in a spaced apart orientation from the others of the plurality of micro-strand heat dissipator elements, wherein each of the plurality of micro-strand heat dissipator elements include:
a first micro-strand heat dissipator element portion that engages the at least one transceiver component; and
a second micro-strand heat dissipator element portion that extends from the at least one transceiver component, and wherein the air inlet and the air outlet are configured to allow an airflow to move past the plurality of micro-strand heat dissipator elements.
2. The system of claim 1 , wherein the at least one transceiver component includes a circuit board.
3. The system of claim 1 , wherein the at least one transceiver component includes a heat producing device.
4. The system of claim 3 , wherein a first subset of the plurality of micro-strand heat dissipator elements extend a first distance into the heat producing device, and wherein a second subset of the plurality of micro-strand heat dissipator elements extend a second distance into the heat producing device that is different than the first distance.
5. The system of claim 1 , wherein the transceiver device chassis includes:
a plurality of micro-strand heat dissipator element apertures that extend through a wall on the transceiver device chassis, wherein a respective one of each the plurality of micro-strand heat dissipator elements extends into the plurality of micro-strand heat dissipator element apertures.
6. The system of claim 1 , wherein the plurality of micro-strand heat dissipator elements each include a diameter between 0.04 mm and 0.1 mm.
7. An Information Handling System (IHS), comprising:
an Information Handling System (IHS) chassis;
a transceiver device connector that is included on the IHS chassis;
a transceiver device that is connected to the transceiver device connector and that includes a first end that defines an air inlet, and a second end that is located opposite the transceiver device from the first end and that defines an air outlet;
at least one transceiver component located in the transceiver device; and
a plurality of micro-strand heat dissipator elements that are each positioned in the transceiver device in a spaced apart orientation from the others of the plurality of micro-strand heat dissipator elements, wherein each of the plurality of micro-strand heat dissipator elements include:
a first micro-strand heat dissipator element portion that engages the at least one transceiver component; and
a second micro-strand heat dissipator element portion that extends from the at least one transceiver component, and wherein the air inlet and the air outlet are configured to allow an airflow to move past the plurality of micro-strand heat dissipator elements.
8. The IHS of claim 7 , wherein the at least one transceiver component includes a circuit board.
9. The IHS of claim 7 , wherein the at least one transceiver component includes a heat producing device.
10. The IHS of claim 9 , wherein a first subset of the plurality of micro-strand heat dissipator elements extend a first distance into the heat producing device, and wherein a second subset of the plurality of micro-strand heat dissipator elements extend a second distance into the heat producing device that is different than the first distance.
11. The IHS of claim 7 , wherein the transceiver device includes:
a plurality of micro-strand heat dissipator element apertures that extend through a wall on the transceiver device, wherein a respective one of each the plurality of micro-strand heat dissipator elements extends into the plurality of micro-strand heat dissipator element apertures.
12. The IHS of claim 7 , wherein the plurality of micro-strand heat dissipator elements each include a diameter between 0.04 mm and 0.1 mm.
13. The IHS of claim 7 , further comprising:
a fan system that is configured to produce the airflow.
14. A method for dissipating heat generated by a transceiver device, comprising:
generating, by at least one transceiver component in a transceiver device that engages a plurality of micro-strand heat dissipator elements that are each positioned in the transceiver device in a spaced apart orientation from the others of the plurality of micro-strand heat dissipator elements, heat;
conducting, by a first micro-strand heat dissipator element portion on each of the plurality of micro-strand heat dissipator elements that engages the at least one transceiver component, the heat that is generated by the at least one transceiver component to a respective second micro-strand heat dissipator element portion on that micro-strand heat dissipator element that extends from the at least one transceiver component; and
allowing, via an air inlet that is defined on a first end of the transceiver device and an air outlet that is defined on a second end of the transceiver device that is opposite the first end, an airflow to move past the plurality of micro-strand heat dissipator elements;
dissipating, via the airflow by the second micro-strand heat dissipator element portion on each of the plurality of micro-strand heat dissipator elements that extend from the outer surface of the first processing device, the heat.
15. The method of claim 14 , wherein the at least one transceiver component includes a circuit board.
16. The method of claim 14 , wherein the at least one transceiver component includes a heat producing device.
17. The method of claim 16 , wherein a first subset of the plurality of micro-strand heat dissipator elements extend a first distance into the heat producing device, and wherein a second subset of the plurality of micro-strand heat dissipator elements extend a second distance into the heat producing device that is different than the first distance.
18. The method of claim 14 , wherein the transceiver device includes:
a plurality of micro-strand heat dissipator element apertures that extend through a wall on the transceiver device, wherein a respective one of each the plurality of micro-strand heat dissipator elements extends into the plurality of micro-strand heat dissipator element apertures.
19. The method of claim 14 , wherein
the plurality of micro-strand heat dissipator elements each include a diameter between 0.04 mm and 0.1 mm.
20. The method of claim 14 , further comprising:
generating, by a computing system connected to the transceiver device, the airflow.