Polyimide precursor resin composition for forming flexible device substrate
A polyimide precursor resin composition for forming a flexible device substrate, including a polyamic acid having a structure obtained from a tetracarboxylic acid component including at least one of 3,3′,4,4′-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride, a diamine component including at least one of paraphenylene diamine and 4,4′-diaminodiphenyl ether, and a carboxylic acid monoanhydride, the polyamic acid satisfying equations (1) and (2) below: 0.97≤ X/Y <1.00 Equation (1) 0.5≤( Z /2)/( Y−X )≤1.05 Equation (2) in which X represents a number of moles of tetracarboxylic acid component, Y represents a number of moles of diamine component, and Z represents a number of moles of the carboxylic acid monoanhydride.
1. A method for producing a flexible device substrate, comprising steps of:
(A) forming a laminate including a carrier substrate and a polyimide film formed thereon, wherein the laminate is formed by casting a polyimide precursor resin composition comprising a polyamic acid on the carrier substrate, and imidizing the polyamic acid by heat treatment to form a polyimide film, wherein
the polyamic acid has a structure obtained from a tetracarboxylic acid component comprising at least one of 3,3′,4,4′-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride; a diamine component comprising at least one of paraphenylenediamine and 4,4′-diaminodiphenyl ether; and a carboxylic acid monoanhydride; wherein the polyamic acid satisfies following equations (1) and (2):
0.97 ≤X/Y <1.00 Equation (1)
0.5≤( Z/ 2)/( Y−X )≤1.05 Equation (2)
wherein X represents a number of moles of tetracarboxylic acid component, Y represents a number of moles of diamine component, and Z represents a number of moles of the carboxylic acid monoanhydride, wherein a peel strength between the carrier substance and the polyimide film is 300 mN/mm or more;
(B) forming an inorganic film on the polyimide film; and
(C) separating the polyimide film from the carrier substrate to form a flexible device substrate including the polyimide film,
wherein the steps are performed in an order of (A), (B), and (C).
2. The method for producing a flexible device substrate according to claim 1 , wherein the inorganic film comprises an inorganic material selected from the group consisting of silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, titanium oxide, and zirconium oxide.
3. The method for producing a flexible device substrate according to claim 1 , further comprising (D) forming a TFT, wherein the steps are performed in an order of (A), (B), (D), and (C).
4. The method for producing a flexible device substrate according to claim 1 , wherein the carrier substrate is selected from a glass substrate and a metal substrate.
5. The method for producing a flexible device substrate according to claim 1 , wherein a content of 3,3′,4,4′-biphenyltetracarboxylic dianhydride is 40 mol % or more in the tetracarboxylic acid component.
6. The method for producing a flexible device substrate according to claim 1 , wherein a content of paraphenylenediamine is 40 mol % or more in the diamine component.
7. The method for producing a flexible device substrate according to claim 1 , wherein the carboxylic acid monoanhydride is phthalic anhydride or maleic anhydride.
8. A method for manufacturing a flexible device, comprising: manufacturing the flexible device substrate according to claim 1 ; and
forming a circuit on the flexible device substrate.