Floor panel and methods for manufacturing floor panels

1. A floor panel with a substrate, and a decorative layer of wood veneer with a thickness of 1 millimeter or less and provided on the substrate,

wherein said decorative layer is provided on the substrate by means of a glue layer situated between the substrate and the decorative layer,

wherein said glue layer comprises hard particles with an average particle size which is at least one third of the thickness of the wood veneer and wherein the substrate, at a surface where the decorative layer is situated, has a density of more than 900 kilograms per cubic meter.

2. The floor panel according to claim 1 , wherein the glue layer is a layer including thermosetting resin.

3. The floor panel according to claim 1 , wherein the substrate is a wood fiberboard.

4. The floor panel according to claim 1 , wherein the wood veneer has a thickness between 0.3 and 1 millimeter.

5. The floor panel according to claim 1 , wherein said decorative layer comprises transparent or translucent surface material at the surface.

6. The floor panel according to claim 1 , wherein the wood veneer is impregnated by thermosetting resin.

7. The floor panel according to claim 1 , wherein the hard particles at an underside of the decorative layer penetrate into the wood veneer.

8. The floor panel according to claim 1 , wherein a material of the hard particles is chosen from a list consisting of aluminum oxide, titanium carbide, silicon carbide and silicon oxide.

9. The floor panel according to claim 1 , wherein the hard particles have an orientation wherein a largest main axis of inertia or main axis of the hard particles, seen on average, is oriented substantially perpendicular to a surface of the panel.

10. The floor panel according to claim 1 , wherein the layer of thermosetting resin extends uninterruptedly underneath the entire wood veneer.

11. The floor panel according to claim 1 , wherein the floor panel is provided with coupling means on at least two opposite edges, and arranged to allow that two of such floor panels can be coupled to each other in a vertical direction perpendicular to a plane of the coupled panels and in a horizontal direction in a plane and perpendicular to the respective edge.

12. A floor panel with a substrate, and a decorative layer of wood veneer with a thickness of 1 millimeter or less provided on the substrate,

wherein said decorative layer is provided on the substrate by means of a glue layer situated between the substrate and the decorative layer,

wherein the glue layer comprises hard particles penetrating into the wood veneer at an underside of the decorative layer over a distance of at least 20% of the thickness of the wood veneer;

wherein the hard particles have an average particle size which is at least one third of the thickness of the wood veneer and wherein the substrate, at a surface where the decorative layer is situated, has a density of more than 900 kilograms per cubic meter.

13. The floor panel according to claim 12 , wherein the hard particles penetrate for 30% by weight or more of the hard particles at the underside into the wood veneer over a distance of at least 20% of the thickness of the wood veneer.

14. A method for manufacturing floor panels, the floor panels each comprising at least a substrate, and a decorative layer of wood veneer provided on the substrate, wherein the method comprises at least the following steps:

the step of providing a basic board;

the step of composing a stack including at least the basic board, a glue layer, hard particles and one or more wood veneers;

the step of pressing said stack, wherein the veneers are adhered to the basic board;

wherein the hard particles have an average particle size which is at least one third of a thickness of the wood veneer and wherein the substrate, at a surface where the decorative layer is situated, has a density of more than 900 kilograms per cubic meter;

wherein the decorative layer has a thickness of 1 millimeter or less.

15. The method according to claim 14 , wherein the hard particles are oriented by means of an electric field,

wherein a largest main axis of inertia or main axis of the hard particles, seen on average, is oriented substantially perpendicular to a surface of the panel.

16. The method according to claim 15 , wherein the hard particles have a dielectric constant of more than 5.

17. The method according to claim 14 , further comprising the step of orienting the hard particles by of an electric field.

18. The method according to claim 17 , wherein the carrier comprises at least the basic board or the substrate or the glue layer.

19. The method according to claim 14 , further comprises the step of manufacturing floor panels comprising a substrate, and decorative layer of wood veneer provided on the substrate, the decorative layer having a thickness of 1 millimeter or less,

wherein said decorative layer is provided on the substrate by means of a glue layer which is situated between the substrate and the decorative layer,

wherein said glue layer comprises hard particles with an average particle size which is at least one third of the thickness of the wood veneer.

20. A method for manufacturing floor panels, wherein these floor panels comprise at least a substrate, and a decorative layer of wood veneer provided on the substrate, wherein the method comprises at least the following steps:

the step of providing a colored paste or liquid at least on a rear side of one or more wood veneers;

the step of providing a basic board;

the step of composing a stack including at least the basic board, a glue layer, hard particles, and the one or more wood veneers;

the step of pressing said stack, wherein the veneers are adhered to the basic board and wherein the substrate, at a surface where the decorative layer is situated, has a density of more than 900 kilograms per cubic meter.