Antenna pattern, RFID inlay, RFID label, and RFID medium
An antenna pattern used in a UHF frequency band RFID inlay is provided with a substance; a dipole antenna formed from a metal foil upon the front surface of the substance; and a sub-element formed from a metal foil upon the back surface of the substance, wherein the dipole antenna is provided with a loop portion having a IC chip connecting portion; a pair of meanders configured to respectively extend from the loop portion so as to be line symmetrical; and capacitance hats, the sub-element has a pair of U-shapes, and a part of the sub-element overlaps with the dipole antenna through the substance.
1. An antenna pattern used in a UHF frequency band RFID inlay, comprising:
a substrate;
a dipole antenna formed on a front surface of the substrate with a metal foil; and
a sub-element formed on a back surface of the substrate with the metal foil, wherein
the dipole antenna is provided with:
a loop portion having an IC chip connecting portion to which an IC chip is connected;
a pair of meanders configured to respectively extend from the loop portion so as to be line symmetrical by being connected to the loop portion at end portions on one side; and
capacitance hats respectively connected to the pair of meanders, and
the sub-element has a pair of U-shapes, the sub-element being arranged such that opening sides of the U-shapes face with each other so as to be line symmetrical, the sub-element being formed such that a part thereof overlaps with the dipole antenna through the substrate.
2. The antenna pattern according to claim 1 , wherein
respective base end portions in the pair of U-shapes of the sub-element are formed so as to overlap with a part of the loop portion through the substrate.
3. The antenna pattern according to claim 1 , wherein
the IC chip connecting portion of the loop portion is positioned, through the substrate, in one of: a gap between respective base end portions of the pair of U-shapes of the sub-element, the gap being formed by the base end portions facing with each other; and a gap between respective tip end portions of the pair of U-shapes of the sub-element, the gap being formed by the tip end portions facing with each other.
4. The antenna pattern according to claim 1 , wherein
the loop portion has a rectangular shape having a pair of facing long-side portions and a pair of short-side portions configured to connect end portions of the long-side portions with each other,
the IC chip connecting portion is formed on one of the long-side portions, and the meander is connected to the long-side portion facing the long-side portion on which the IC chip connecting portion is formed, and
a part of the sub-element overlaps with a part of the dipole antenna through the substrate and overlaps with a part of the long-side portion to which the meander is connected.
5. The antenna pattern according to claim 1 , wherein
the loop portion has a rectangular shape having a pair of facing long-side portions and a pair of short-side portions configured to connect end portions of the long-side portions,
the IC chip connecting portion is formed on one of the long-side portions, and the meander is connected to the long-side portion facing the long-side portion on which the IC chip connecting portion is formed, and
a part of the sub-element overlaps with a part of the dipole antenna through the substrate and intersects with the short-side portion, but does not overlap with the long-side portion to which the IC chip connecting portion is formed and the long-side portion to which the meander is connected.
6. The antenna pattern according to claim 1 , wherein
the loop portion has a rectangular shape having a pair of facing long-side portions and a pair of short-side portions configured to connect end portions of the long-side portions,
the IC chip connecting portion is formed on one of the long-side portions, and the meander is connected to the long-side portion facing the long-side portion on which the IC chip connecting portion is formed, and
a part of the sub-element overlaps with a part of the dipole antenna through the substrate, covers an entire region of the short-side portion, and overlaps with a part of the long-side portion to which the IC chip connecting portion is formed and a part of the long-side portion to which the meander is connected.
7. A UHF frequency band RFID inlay comprising:
the antenna pattern according to claim 1 and
the IC chip connected to the IC chip connecting portion in the antenna pattern.
8. An RFID label wherein a separator is temporarily adhered on one of surfaces of the UHF frequency band RFID inlay according to claim 7 with an adhesive agent.
9. An RFID label wherein a separator is temporarily adhered on one of surfaces of the UHF frequency band RFID inlay according to claim 7 with an adhesive agent and an information recording substrate is laminated on a surface on a reverse side of the surface on which the separator is temporarily adhered.
10. An RFID medium wherein both surfaces of the UHF frequency band RFID inlay according to claim 7 are sandwiched by a plurality of outer substrates with a bonding agent.