Manufacturing method of antenna pattern, manufacturing method of RFID inlay, manufacturing method of RFID label, and manufacturing method of RFID medium
The manufacturing method of the antenna pattern has: a step of forming a dipole antenna on a front surface of a continuous substrate while conveying the continuous substrate; and a step of forming a sub-element on a back surface of the continuous substrate.
1. A manufacturing method of an antenna pattern having a dipole antenna formed on a first surface of a substrate and a sub-element formed on a second surface of the substrate, the method comprising:
a first adhesive-agent coating step of coating an adhesive agent at inner side of an edges of the dipole antenna formed on a first surface of a continuous substrate while conveying the continuous substrate;
a first metal-foil placement step of placing a continuous metal-foil on the adhesive agent on the continuous substrate, the continuous metal-foil being configured to form the dipole antenna;
a first cutting step of forming a cut for the dipole antenna in the continuous metal-foil;
a first removal step of removing an unwanted portion that does not form the dipole antenna in the continuous metal-foil;
a second adhesive-agent coating step of coating the adhesive agent at inner side of an edges of the sub-element formed on the second surface;
a second metal-foil placement step of placing the continuous metal-foil on the adhesive agent coated in the second adhesive-agent coating step, the continuous metal-foil being configured to form the sub-element;
a second cutting step of forming a cut for the sub-element in the continuous metal-foil placed in the second metal-foil placement step; and
a second removal step of removing an unwanted portion that does not form the sub-element in the continuous metal-foil placed in the second metal-foil placement step.
2. The manufacturing method of the antenna pattern according to claim 1 , wherein
in the first adhesive-agent coating step and the second adhesive-agent coating step, a position for coating the adhesive agent is aligned such that a blank space between the edges of the antenna pattern and the adhesive agent coated at the inner side of the edges is wider along an upstream side in a conveying direction.
3. The manufacturing method of the antenna pattern according to claim 2 , further comprising
a pressing step of applying pressure on the dipole antenna and the sub-element placed on the continuous substrate.
4. The manufacturing method of the antenna pattern according to claim 2 , wherein
the unwanted portion is removed by suction in the first removal step and the second removal step.
5. The manufacturing method of the antenna pattern according to claim 1 , wherein
the unwanted portion is removed by suction in the first removal step and the second removal step.
6. A manufacturing method of an RFID inlay provided with an antenna pattern and an IC chip connected to a dipole antenna, the antenna pattern having the dipole antenna formed on a first surface of a substrate and a sub-element formed on a second surface of the substrate, the method comprising:
a first adhesive-agent coating step of coating an adhesive agent at inner side of an edges of the dipole antenna formed on a first surface of a continuous substrate while conveying the continuous substrate;
a first metal-foil placement step of placing a continuous metal-foil on the adhesive agent on the continuous substrate, the continuous metal-foil being configured to form the dipole antenna;
a first cutting step of forming a cut for the dipole antenna in the continuous metal-foil;
a first removal step of removing an unwanted portion that does not form the dipole antenna in the continuous metal-foil;
a second adhesive-agent coating step of coating the adhesive agent at inner side of a edges of the sub-element formed on the second surface;
a second metal-foil placement step of placing the continuous metal-foil on the adhesive agent coated in the second adhesive-agent coating step, the continuous metal-foil being configured to form the sub-element;
a second cutting step of forming a cut for the sub-element in the continuous metal-foil placed in the second metal-foil placement step;
a second removal step of removing an unwanted portion that does not form the sub-element in the continuous metal-foil placed in the second metal-foil placement step; and
an IC-chip mounting step of mounting the IC chip by using a conductive material on a specific position on the dipole antenna.
7. A manufacturing method of an RFID label adhered to an adherend, the RFID label being provided with an antenna pattern and an IC chip connected to a dipole antenna, the antenna pattern having a substrate with a printing surface, the dipole antenna formed on a first surface of the substrate, and a sub-element formed on a second surface of the substrate, the method comprising:
a first adhesive-agent coating step of coating an adhesive agent at inner side of an edges of the dipole antenna formed on a first surface of a continuous substrate while conveying the continuous substrate;
a first metal-foil placement step of placing a continuous metal-foil on the adhesive agent on the continuous substrate, the continuous metal-foil being configured to form the dipole antenna;
a first cutting step of forming a cut for the dipole antenna in the continuous metal-foil;
a first removal step of removing an unwanted portion that does not form the dipole antenna in the continuous metal-foil;
a second adhesive-agent coating step of coating the adhesive agent at inner side of an edges of the sub-element formed on the second surface;
a second metal-foil placement step of placing the continuous metal-foil on the adhesive agent coated in the second adhesive-agent coating step, the continuous metal-foil being configured to form the sub-element;
a second cutting step of forming a cut for the sub-element in the continuous metal-foil placed in the second metal-foil placement step;
a second removal step of removing an unwanted portion that does not form the sub-element in the continuous metal-foil placed in the second metal-foil placement step;
an IC-chip mounting step of mounting the IC chip by using a conductive material on a specific position on the dipole antenna; and
a step of temporarily adhering a separator with the adhesive agent on a surface of the substrate on a reverse side of the printing surface.
8. A manufacturing method of an RFID label adhered to an adherend, the RFID label being provided with an antenna pattern and an IC chip connected to a dipole antenna, the antenna pattern having the dipole antenna formed on a first surface of a substrate and a sub-element formed on a second surface of the substrate, the method comprising:
a first adhesive-agent coating step of coating an adhesive agent at inner side of an edges of the dipole antenna formed on a first surface of a continuous substrate while conveying the continuous substrate;
a first metal-foil placement step of placing a continuous metal-foil on the adhesive agent on the continuous substrate, the continuous metal-foil being configured to form the dipole antenna;
a first cutting step of forming a cut for the dipole antenna in the continuous metal-foil;
a first removal step of removing an unwanted portion that does not form the dipole antenna in the continuous metal-foil;
a second adhesive-agent coating step of coating the adhesive agent at inner side of an edges of the sub-element formed on the second surface;
a second metal-foil placement step of placing the continuous metal-foil on the adhesive agent coated in the second adhesive-agent coating step, the continuous metal-foil being configured to form the sub-element;
a second cutting step of forming a cut for the sub-element in the continuous metal-foil placed in the second metal-foil placement step;
a second removal step of removing an unwanted portion that does not form the sub-element in the continuous metal-foil placed in the second metal-foil placement step;
an IC-chip mounting step of mounting the IC chip by using a conductive material on a specific position on the dipole antenna;
a step of temporarily adhering a separator with the adhesive agent on either one of the first surface or the second surface of the substrate; and
a step of placing an outer substrate having an information recording surface on a surface of the substrate on a reverse side of the surface on which the separator is placed, the outer substrate being placed with the adhesive agent or an adhesive in a state in which the information recording surface faces outward.
9. A manufacturing method of an RFID medium provided with an antenna pattern and an IC chip connected to a dipole antenna, the antenna pattern having the dipole antenna formed on a first surface of a substrate and a sub-element formed on a second surface of the substrate, the method comprising:
a first adhesive-agent coating step of coating an adhesive agent at inner side of an edges of the dipole antenna formed on a first surface of a continuous substrate while conveying the continuous substrate;
a first metal-foil placement step of placing a continuous metal-foil on the adhesive agent on the continuous substrate, the continuous metal-foil being configured to form the dipole antenna;
a first cutting step of forming a cut for the dipole antenna in the continuous metal-foil;
a first removal step of removing an unwanted portion that does not form the dipole antenna in the continuous metal-foil;
a second adhesive-agent coating step of coating the adhesive agent at inner side of an edges of the sub-element formed on the second surface;
a second metal-foil placement step of placing the continuous metal-foil on the adhesive agent coated in the second adhesive-agent coating step, the continuous metal-foil being configured to form the sub-element;
a second cutting step of forming a cut for the sub-element in the continuous metal-foil placed in the second metal-foil placement step;
a second removal step of removing an unwanted portion that does not form the sub-element in the continuous metal-foil placed in the second metal-foil placement step;
an IC-chip mounting step of mounting the IC chip by using a conductive material on a specific position on the dipole antenna;
a step of placing a first outer substrate on the first surface of the substrate with the adhesive agent; and
a step of placing a second outer substrate on the second surface of the substrate with the adhesive agent.