Method for producing a housing cover for a laser component and housing cover for a laser component and laser component
View Patent ↗A method for producing a housing cover for a laser component, a housing for a laser component, and a laser component are provided. The method includes providing an at least partially radiation-permeable window including an aluminum oxide, provide a copper carrier for the window, and forming a copper oxide in an oxide region on the copper carrier. The method further includes arranging the window at the oxide region, forming a eutectic bond between the window and the copper oxide in the oxide region, and thereby fixing the window to the copper carrier.
1. A method for producing a housing cover for a laser component, comprising:
providing an at least partially radiation-permeable window comprising an aluminum oxide,
providing a copper carrier for the window,
forming a copper oxide in an oxide region on the copper carrier,
arranging the window at the oxide region,
applying an aluminum oxide layer to a predetermined region of the window,
forming a eutectic bond between the window and the copper oxide in the oxide region, and thereby
fixing the window to the copper carrier.
2. The method according to claim 1 , wherein the window has a sapphire window, the method further comprising:
placing the sapphire window directly on the oxide region so that the sapphire window and the copper oxide have a common contact surface,
forming the eutectic bond directly between the sapphire window and the copper oxide.
3. The method according to claim 2 , comprising:
forming the copper oxide flat on a surface of the copper carrier,
forming the eutectic bond on the entire contact surface between the sapphire window and the surface of the copper carrier.
4. The method according to claim 2 , comprising:
forming a coating on a surface of the sapphire window,
forming the eutectic bond on the surface of the sapphire window outside the coating.
5. The method according to claim 1 , comprising forming of the eutectic bond between the aluminum oxide layer and the copper oxide, wherein the predetermined region of the window corresponds to the oxide region.
6. The method according to claim 5 , comprising:
applying the aluminum oxide layer to the predetermined region of the window so that the window remains free of aluminum oxide outside the predetermined region,
fixing the window to the copper carrier so that the window and the copper carrier have a distance from each other outside the predetermined region.
7. The method according to claim 5 , comprising:
forming the copper oxide flat on the surface of the copper carrier,
applying the aluminum oxide layer over an entire surface of the window,
forming the eutectic bond on the entire contact surface between the window of the surface of the copper carrier.
8. The method according to claim 5 , comprising:
applying the aluminum oxide layer by means of vapor phase deposition.
9. A method for producing a laser component comprising:
providing a housing cover produced by a method according to claim 1 ,
providing a housing body,
arranging a semiconductor laser diode in the housing body,
sealing of the housing body with the housing cover on a beam exit side of the laser component.
10. A housing cover for a laser component, comprising:
an at least partially radiation-permeable window comprising an aluminum oxide,
a copper carrier comprising a copper oxide in an oxide region,
a eutectic bond between the window and the copper oxide in the oxide region, which fixes the window to the copper carrier, wherein
an aluminum oxide layer is applied in a predetermined region of the window.
11. The housing cover according to claim 10 , wherein
the window has a sapphire window, and
the eutectic bond is directly between the sapphire window and the copper oxide.
12. The housing cover according to claim 11 , wherein
the sapphire window has a coating on a surface facing the copper carrier, and
the eutectic bond is formed outside the coating.
13. The housing cover according to claim 10 , wherein
the predetermined region of the window corresponds to the oxide region, and
the eutectic bond is between the aluminum oxide layer and the copper oxide.
14. The housing cover according to claim 10 , wherein the window outside the eutectic bond has a distance from the copper carrier.
15. A laser component, comprising:
a housing cover according to claim 10 ,
a housing body,
a semiconductor laser diode arranged in the housing body, wherein the housing body is sealed with the housing cover at a beam exit side of the laser component.