IP Library Granted Patent US 11,509,286
Granted Patent B2
US 11,509,286 · App. 16/963,780 · Granted Nov 22, 2022

BAW resonator with increased quality factor

Inventor: Gilles Moulard (Munich, DE)
Assignee: RF360 Europe GmbH
H03H9/132H03H3/02H03H9/131H03H9/173H03H9/175H03H9/568
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,509,286
App. No.
16/963,780
Granted
Nov 22, 2022
Kind
B2
Abstract

A BAW resonator comprises a center area (CA), an underlap region (UL) surrounding the center area having a thickness smaller than the thickness d C of the center region and a frame region (FR), surrounding the underlap region having thickness d F greater than d C .

Claims (37)

1. A bulk acoustic wave (BAW) resonator, comprising:

a substrate;

a sandwich, comprising:

a bottom electrode;

a piezoelectric layer; and

a top electrode; and

dielectric layer covering a surface of the BAW resonator,

wherein the sandwich further comprises:

a center area, wherein the bottom electrode, the piezoelectric layer, and the top electrode of the sandwich overlap each other;

an underlap region surrounding the center area and having a thickness d U smaller than a thickness d C of the center area, wherein the bottom electrode has a thickness in the underlap region that is smaller than the thickness of the bottom electrode in the center area; and

a frame region surrounding the underlap region and having a thickness d F greater than d C .

2. The BAW resonator of claim 1 , wherein the thickness d U being smaller than the thickness d C is mainly due to a reduced thickness of one or more of the bottom electrode or the top electrode.

3. The BAW resonator of claim 1 , wherein one of the bottom electrode and the top electrode comprises a first sub-layer of aluminum copper and a second sub-layer of tungsten, and wherein the thickness of one of the first sub-layer or the second sub-layer is reduced in the underlap region.

4. The BAW resonator of claim 1 , wherein the frame region is formed by a dielectric interlayer arranged between the top electrode and the piezoelectric layer.

5. The BAW resonator of claim 1 , wherein the dielectric layer has a uniform thickness over a total surface of the BAW resonator.

6. The BAW resonator of claim 1 , wherein the BAW resonator is arranged in ladder type circuit of series resonators and shunt resonators, each series and shunt resonator being embodied as the BAW resonator, and wherein the dielectric layer is a trimming layer.

7. The BAW resonator of claim 1 , wherein the dielectric layer is a trimming layer formed of silicon nitride having a uniform thickness of about 60 nm.

8. The BAW resonator of claim 1 , wherein a thickness of the top electrode is reduced in the underlap region relative to the center area by about 15 nm.

9. The BAW resonator of claim 1 , wherein the underlap region has a width of about 0.2 μm to 8.0 μm.

10. A bulk acoustic wave (BAW) resonator, comprising:

a substrate;

a sandwich, comprising:

a bottom electrode;

a piezoelectric layer; and

a top electrode; and

a dielectric layer covering a surface of the BAW resonator,

wherein the sandwich further comprises:

a center area, wherein the bottom electrode, the piezoelectric layer, and the top electrode of the sandwich overlap each other;

an underlap region surrounding the center area and having a thickness d U smaller than a thickness d C of the center area, wherein a thickness of the top electrode is reduced in the underlap region relative to the center area by about 15 nm; and

a frame region surrounding the underlap region and having a thickness d F greater than d C .

11. The BAW resonator of claim 10 , wherein the frame region is formed by a dielectric interlayer arranged between the top electrode and the piezoelectric layer.

12. The BAW resonator of claim 10 , wherein the thickness d U being smaller than the thickness d C is mainly due to a reduced thickness of one or more of the bottom electrode or the top electrode.

13. The BAW resonator of claim 10 , wherein one of the bottom electrode and the top electrode comprises a first sub-layer of aluminum copper and a second sub-layer of tungsten, and wherein the thickness of one of the first sub-layer or the second sub-layer is reduced in the underlap region.

14. The BAW resonator of claim 10 , wherein the dielectric layer has a uniform thickness over a total surface of the BAW resonator.

15. The BAW resonator of claim 10 , wherein the BAW resonator is arranged in ladder type circuit of series resonators and shunt resonators, each series and shunt resonator being embodied as the BAW resonator, and wherein the dielectric layer is a trimming layer.

16. The BAW resonator of claim 10 , wherein the dielectric layer is a trimming layer formed of silicon nitride having a uniform thickness of about 60 nm.

17. The BAW resonator of claim 10 , wherein the underlap region has a width of about 0.2 μm to 8.0 μm.

Assignments (3)
CHANGE OF OWNER'S ADDRESS Recorded Nov 22, 2024
From: RF360 SINGAPORE PTE. LTD.
To: RF360 SINGAPORE PTE. LTD.
Reel/Frame 069761/0931 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2023
From: RF360 EUROPE GMBH
To: RF360 SINGAPORE PTE. LTD.
Reel/Frame 063272/0475 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2021
From: MOULARD, GILLES, DR.
To: RF360 EUROPE GMBH
Reel/Frame 055972/0315 →
Priority Claims (1)
DE 10 2018 101 442.2 · Jan 23, 2018 · national
Continuity (1)
Related Publication 20200350888A1 · Nov 5, 2020