Light-emitting semiconductor component
A light-emitting semiconductor component may include a conversion layer, a radiation surface, and a plurality of adjacently arranged emission regions configured to be operated separately, individually and/or in groups. The conversion layer may be arranged downstream of the emission regions in the direction of radiation of the emission regions. The emission regions may be configured to emit primary radiation of a first wavelength range into the conversion layer. The conversion layer may be configured to convert at least a portion of the primary radiation into secondary radiation of a second wavelength range. Mixed radiation is configured to be emitted from the light-emitting semiconductor component at the radiation surface. The mixed radiation may include primary radiation and secondary radiation. A probability that primary radiation travelling from the emission region to the radiation surface is converted into secondary radiation may vary along the radiation surface by a maximum factor of 2.
1. A light-emitting semiconductor component comprising:
a plurality of adjacently arranged emission regions configured to be operated separately, individually and/or in groups;
a conversion layer comprising a conversion material;
an intermediate layer having a first refractive index; and
a radiation surface;
wherein:
the conversion layer is arranged downstream of the emission regions in the direction of radiation of the emission regions,
the emission regions are configured to emit primary radiation of a first wavelength range into the conversion layer,
the conversion layer is configured to convert at least a portion of the primary radiation into secondary radiation of a second wavelength range,
mixed radiation is configured to be emitted from the light-emitting semiconductor component at the radiation surface,
the mixed radiation comprises primary radiation and secondary radiation,
a probability that primary radiation travelling from the emission region to the radiation surface is converted into secondary radiation varies along the radiation surface by a maximum factor of 2,
a concentration of the conversion material has in each case a local maximum in the vertical direction in a middle of the conversion layer where it overlaps with the respectively assigned emission region, the concentration of the conversion material in each case decreases along all directions starting from the respective local maximum and seen in cross-section through the conversion layer; and
the concentration of the conversion material varies periodically along a main extension plane of the conversion layer, the periodicity of the variation in the concentration of the conversion material corresponds to a periodicity with which the emission regions are arranged along the main extension plane.
2. The light-emitting semiconductor component as claimed in claim 1 , wherein the conversion layer is a contiguous layer.
3. The light-emitting semiconductor component as claimed in claim 1 , wherein:
the conversion layer has a thickness along a vertical direction perpendicular to the main extension plane of the conversion layer,
the thickness varies along the main extension plane.
4. The light-emitting semiconductor component as claimed in claim 1 , wherein:
the conversion layer has a local maximum thickness in each of the regions that overlap with emission regions along the vertical direction, and
the conversion layer has a local minimum thickness in each region that does not overlap with an emission region along the vertical direction.
5. The light-emitting semiconductor component as claimed in claim 1 ,
wherein:
the intermediate layer is formed with a material transparent to primary radiation and secondary radiation, and the intermediate layer is a contiguous layer.
6. The light-emitting semiconductor component as claimed in claim 5 , wherein:
the intermediate layer is arranged between the conversion layer and the emission regions,
the intermediate layer has convex curved surfaces on one side facing away from the emission regions,
the conversion layer has a local minimum thickness in each of the regions that overlap with an emission region along the vertical direction, and
the conversion layer has a local maximum thickness in each of the regions that do not overlap with an emission region along the vertical direction.
7. The light-emitting semiconductor component as claimed in claim 1 ,
wherein:
the conversion layer has a second refractive index, the conversion layer is arranged on a side of the intermediate layer facing away from the emission regions and the first refractive index is greater than the second refractive index, or the intermediate layer is arranged on a side of the conversion layer facing away from the emission regions and the second refractive index is greater than the first refractive index.
8. The light-emitting semiconductor component as claimed in claim 7 , wherein:
the first refractive index of the intermediate layer varies along the main extension plane, and
the first refractive index has a local extremum in the vertical direction where it overlaps with each emission region.
9. The light-emitting semiconductor component as claimed in claim 8 , wherein the intermediate layer forms a lens above each emission region in the vertical direction, wherein the lens is configured to collimate or focus primary radiation.
10. The light-emitting semiconductor component as claimed in claim 9 , further comprising a diaphragm structure,
wherein:
the emission regions have edges which limit the emission regions along the main extension plane,
the diaphragm structure is arranged vertically overlapping with the edges, and the diaphragm structure comprises a material that absorbs and/or reflects the primary radiation.
11. The light-emitting semiconductor component as claimed in claim 1 , wherein the emission regions are parts of a common semiconductor chip.
12. A light-emitting semiconductor component, comprising:
a plurality of adjacently arranged emission regions that can be separately operated, individually and/or in groups;
a conversion layer comprising a conversion material;
an intermediate layer having a first refractive index;
a radiation surface;
wherein:
the emission regions are part of a common semiconductor chip,
the conversion layer is arranged downstream of the emission regions in the direction of radiation of the emission regions,
the emission regions emit primary radiation of a first wavelength range into the conversion layer,
the conversion layer converts at least a portion of the primary radiation into secondary radiation of a second wavelength range,
mixed radiation is configured to be emitted from the light-emitting semiconductor component at the radiation surface,
the mixed radiation comprises primary radiation and secondary radiation, and a probability that primary radiation travelling from the emission region to the radiation surface is converted into secondary radiation varies along the radiation surface by a maximum factor of 2,
a concentration of the conversion material has in each case a local maximum in the vertical direction in a middle of the conversion layer where it overlaps with the respectively assigned emission region, the concentration of the conversion material in each case decreases along all directions starting from the respective local maximum and seen in cross-section through the conversion layer; and
the concentration of the conversion material varies periodically along the main extension plane of the conversion layer, the periodicity of the variation in the concentration of the conversion material corresponds to a periodicity with which the emission regions are arranged along the main extension plane.