Optoelectronic component and method of producing an optoelectronic component
An optoelectronic component that emits electromagnetic radiation from a radiation exit surface of the optoelectronic component includes a radiation-emitting semiconductor chip that produces electromagnetic radiation, and a marker element applied to the radiation exit surface of the optoelectronic component, the marker element including a dye substance that can be removed from the radiation exit surface using a solvent and/or is permeable to the electromagnetic radiation of the optoelectronic component, wherein the dye substance includes a resin into which fluorescent particles are introduced that convert electromagnetic radiation of a first wavelength range into electromagnetic radiation of a second wavelength range, the first wavelength range and the second wavelength range being within the ultraviolet spectral range.
1. An optoelectronic component that emits electromagnetic radiation from a radiation exit surface of the optoelectronic component comprising:
a radiation-emitting semiconductor chip that produces electromagnetic radiation, and
a marker element applied to the radiation exit surface of the optoelectronic component, the marker element comprising a dye substance that can be removed from the radiation exit surface using a solvent and/or is permeable to the electromagnetic radiation of the optoelectronic component, wherein
the dye substance comprises a resin into which fluorescent particles are introduced that convert electromagnetic radiation of a first wavelength range into electromagnetic radiation of a second wavelength range, the first wavelength range and the second wavelength range being within an ultraviolet spectral range.
2. The optoelectronic component as claimed in claim 1 , wherein the marker element marks a position of at least one electrical contact of the optoelectronic component.
3. The optoelectronic component as claimed in claim 1 , wherein the dye substance is absorbent in the ultraviolet spectral range.
4. The optoelectronic component as claimed in claim 1 , wherein the radiation exit surface of the optoelectronic component is no more than 14% smaller than a cross-sectional area of the optoelectronic component.
5. The optoelectronic component as claimed in claim 1 , wherein the marker element has a dimension of at least 140 microns.
6. A method of producing an optoelectronic component comprising applying a dye substance to a radiation exit surface of the optoelectronic component to produce a marker element,
wherein the dye substance can be removed from the radiation exit surface with a solvent and/or is permeable to the electromagnetic radiation of the optoelectronic component, and
the dye substance comprises a resin into which fluorescent particles are introduced that convert electromagnetic radiation of a first wavelength range into electromagnetic radiation of a second wavelength range, the first wavelength range and the second wavelength range being within an ultraviolet spectral range.
7. The method as claimed in claim 6 , wherein the dye substance is applied from a cartridge by applying pressure by jetting through a jet valve.
8. The method as claimed in claim 6 , wherein the dye substance is applied from a cartridge by applying pressure by dispensing through a needle.
9. The method as claimed in claim 6 , wherein the dye substance is applied by inking from an open-pored membrane or a capillary on contact with the radiation exit surface.