IP Library Granted Patent US 11,535,743
Granted Patent B2
US 11,535,743 · App. 16/978,367 · Granted Dec 27, 2022

Thermoplastic compounds bondable to rigid substrates

Inventors: Haiping Zhang (Gaggenau, DE); Dirk Von Falkenhayn (Von Falkenhayn, DE)
Assignee: Avient Corporation
C08L53/02B29C45/14475C08L23/12C08L23/26C08L2205/03C08L2207/04
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Quick Facts
Patent No.
US 11,535,743
App. No.
16/978,367
Granted
Dec 27, 2022
Kind
B2
Abstract

Thermoplastic compounds include elastomer, modified polyolefin polymer including a polar functional group, and unmodified polyolefin polymer. The melt flow rate of the modified polyolefin polymer is greater than the melt flow rate of the unmodified polyolefin polymer. The thermoplastic compounds exhibit excellent bonding when overmolded onto rigid substrates such as metals, while also providing desirable aesthetic properties and good processability.

Claims (46)

1. A thermoplastic compound comprising:

(a) from about 1 to about 30 weight percent, by weight of the thermoplastic compound, of an elastomer;

(b) from about 10 to about 50 weight percent, by weight of the thermoplastic compound, of a modified polyolefin polymer comprising a polar functional group; and

(c) from about 10 to about 90 weight percent, by weight of the thermoplastic compound, of an unmodified polyolefin polymer;

wherein the unmodified polyolefin polymer is selected from polypropylene homopolymer, polypropylene copolymer, and combinations thereof;

wherein the modified polyolefin polymer includes one type or multiple types of modified polyolefin polymer and the unmodified polyolefin polymer includes one type or multiple types of unmodified polyolefin polymer; and

wherein each type of the modified polyolefin polymer and each type of the unmodified polyolefin polymer has a Melt Flow Rate;

wherein the one type of modified polyolefin polymer or a combination of the multiple types of modified polyolefin polymer has a Melt Flow Rate (190° C., 2.16 kg) of at least about 100 g/10 min; and

wherein the Melt Flow Rate for the one type of modified polyolefin polymer or the combination of the multiple types of modified polyolefin polymers present in the thermoplastic compound is greater than the Melt Flow Rate for the one type of unmodified polyolefin polymer or the combination of the multiple types of unmodified polyolefin polymers present in the thermoplastic compound.

2. The thermoplastic compound of claim 1 , wherein the one type of unmodified polyolefin polymer or the combination of the multiple types of unmodified polyolefin polymer has a Melt Flow Rate (230° C., 2.16 kg) of less than about 50 g/10 min.

3. The thermoplastic compound of claim 1 , wherein a ratio of the Melt Flow Rate (230° C., 2.16 kg) for the one type of modified polyolefin polymer or the combination of the multiple types of modified polyolefin polymers relative to the Melt Flow Rate (230° C., 2.16 kg) for the one type of unmodified polyolefin polymer or the combination of the multiple types of unmodified polyolefin polymers is at least about 2:1.

4. The thermoplastic compound of claim 1 , wherein the elastomer is a thermoplastic elastomer selected from the group consisting of styrenic block copolymers (SBC), thermoplastic vulcanizates (TPV), thermoplastic polyolefins (TPO), copolyesters (COPE), thermoplastic polyurethanes (TPU), copolyamides (COPA), olefin block copolymers (OBC), and combinations thereof.

5. The thermoplastic compound of claim 1 , wherein the elastomer is a styrenic block copolymer (SBC) selected from the group consisting of styrene-ethylene/butylene-styrene (SEBS) block copolymer, styrene-ethylene/propylene-styrene (SEPS) block copolymer, styrene-ethylene/ethylene/propylene-styrene (SEEPS) block copolymer, styrene-isobutylene-styrene (SIBS) block copolymer, styrene-butadiene-styrene (SBS) block copolymer, styrene-isoprene-styrene (SIS) block copolymer, and combinations thereof.

6. The thermoplastic compound of claim 1 , wherein the polar functional group of the modified polyolefin polymer comprises carboxylic acid or its ester or its anhydride.

7. The thermoplastic compound of claim 1 , wherein the polar functional group of the modified polyolefin polymer comprises maleic acid or maleic anhydride.

8. The thermoplastic compound of claim 1 , wherein the modified polyolefin polymer is maleic anhydride modified polypropylene.

9. The thermoplastic compound of claim 1 , further comprising one or more additives selected from the group consisting of antioxidants; colorants; fillers; plasticizers; release agents; ultraviolet light absorbers; and combinations thereof.

10. The thermoplastic compound of claim 1 , wherein the thermoplastic compound comprises:

(d) from 0 to about 30 weight percent, by weight of the thermoplastic compound, of plasticizer;

(e) from 0 to about 10 weight percent, by weight of the thermoplastic compound, of filler;

from 0 to about 2 weight percent, by weight of the thermoplastic compound, of antioxidant.

11. The thermoplastic compound of claim 1 , wherein the modified polyolefin polymer is present in an amount relative to an amount of the elastomer at a weight ratio of at least about 1.25:1.

12. A molded article comprising:

(a) a rigid substrate part; and

(b) an overmold part molded from the thermoplastic compound of claim 1 , wherein the overmold part is bonded to at least a portion of the rigid substrate part at a bond interface.

13. The molded article of claim 12 , wherein the overmold part surrounds the portion of the rigid substrate part.

14. The molded article of claim 12 , wherein the bond interface is without any gap between the overmold part and the portion of the substrate part.

15. The molded article of claim 12 , wherein the rigid substrate part comprises a material selected from the group consisting of metals, ceramics, glasses, and thermoplastic resins.

16. A method of making a molded article having a rigid substrate part and an overmold part, the method comprising the steps of:

(a) providing the rigid substrate part;

(b) providing the compound of claim 1 ;

(c) molding the compound to provide the overmold part, wherein the overmold part is bonded to at least a portion of the rigid substrate part at a bond interface, thereby providing the molded article.

17. The method of claim 16 , wherein the molding of step (c) occurs such that the overmold part surrounds the portion of the rigid substrate part.

18. The thermoplastic compound of claim 1 , wherein from about 10 to about 40 weight percent, by weight of the thermoplastic compound, is the modified polyolefin polymer comprising a polar functional group.

19. A thermoplastic compound comprising:

(a) from about 1 to about 30 weight percent, by weight of the thermoplastic compound, of an elastomer;

(b) from about 5 to about 50 weight percent, by weight of the thermoplastic compound, of a modified polyolefin polymer comprising a polar functional group;

(c) from about 10 to about 90 weight percent, by weight of the thermoplastic compound, of an unmodified polyolefin polymer;

(d) from 0 to about 30 weight percent, by weight of the thermoplastic compound, of plasticizer;

(e) from 0 to about 10 weight percent, by weight of the thermoplastic compound, of filler; and

(f) from 0 to about 2 weight percent, by weight of the thermoplastic compound, of antioxidant;

wherein the unmodified polyolefin polymer is selected from polypropylene homopolymer, polypropylene copolymer, and combinations thereof;

wherein the modified polyolefin polymer includes one type or multiple types of modified polyolefin polymer and the unmodified polyolefin polymer includes one type or multiple types of unmodified polyolefin polymer; and

wherein each type of the modified polyolefin polymer and each type of the unmodified polyolefin polymer has a Melt Flow Rate;

wherein the one type of modified polyolefin polymer or a combination of the multiple types of modified polyolefin polymer has a Melt Flow Rate (190° C., 2.16 kg) of at least about 100 g/10 min; and

wherein the Melt Flow Rate for the one type of modified polyolefin polymer or the combination of the multiple types of modified polyolefin polymers present in the thermoplastic compound is greater than the Melt Flow Rate for the one type of unmodified polyolefin polymer or the combination of the multiple types of unmodified polyolefin polymers present in the thermoplastic compound.

Assignments (4)
RELEASE OF SECURITY INTERESTS IN PATENTS RECORDED AT REEL 067697, FRAME 0369. Recorded Jun 24, 2025
From: WELLS FARGO CAPITAL FINANCE, LLC, AS ADMINISTRATIVE AGENT
To: AVIENT CORPORATION; COLORMATRIX HOLDINGS, INC.
Reel/Frame 071708/0376 →
SECURITY AGREEMENT Recorded Jun 12, 2025
From: AVIENT CORPORATION; COLORMATRIX HOLDINGS, INC.; COLORMATRIX GROUP, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 071574/0571 →
PATENT SECURITY AGREEMENT (TERM) Recorded Jun 12, 2024
From: AVIENT CORPORATION; COLORMATRIX HOLDINGS, INC.
To: CITIBANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 067699/0676 →
SECURITY INTEREST Recorded Jun 11, 2024
From: AVIENT CORPORATION; COLORMATRIX HOLDINGS, INC.
To: WELLS FARGO CAPITAL FINANCE, LLC, AS ADMINISTRATIVE AGENT
Reel/Frame 067697/0369 →