Optoelectronic modules and wafer-level methods for manufacturing the same
An apparatus includes an optoelectronic component mounted to a PCB substrate. A transmissive adhesive is disposed directly on the optoelectronic component and is transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component. The apparatus includes an optical filter disposed directly on the transmissive adhesive. An epoxy laterally surrounds and is in contact with side surfaces of the transmissive adhesive and the optical filter. The epoxy is non-transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component. In some cases, the epoxy defines a recess directly over the optical filter to accommodate an optical component, such as an optical diffuser. Methods of fabricating the modules are disclosed as well.
1. An apparatus comprising:
an optoelectronic component mounted to a PCB substrate;
a transmissive adhesive disposed directly on the optoelectronic component, wherein the adhesive is transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component;
an optical filter disposed directly on and in contact with the transmissive adhesive; and
an epoxy laterally surrounding and in contact with side surfaces of the transmissive adhesive and the optical filter, wherein the epoxy is non-transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component; and
wherein a coefficient of thermal expansion of the transmissive adhesive is the same as or very close to a coefficient of thermal expansion of the optoelectronic component.
2. The apparatus of claim 1 wherein the epoxy defines a recess directly over the optical filter to accommodate an optical component.
3. The apparatus of claim 1 wherein the epoxy defines a recess directly over the optical filter that accommodates an optical diffuser.
4. The apparatus of claim 1 wherein there is no air gap between the optoelectronic component and the optical filter.
5. The apparatus of claim 1 wherein the optoelectronic component is operable to emit light.
6. The apparatus of claim 1 wherein the optoelectronic component is operable to sense light.
7. The apparatus of claim 1 wherein the epoxy is a black epoxy.
8. The apparatus of claim 1 wherein the transmissive adhesive and the optical filter are disposed so as to intersect an optical axis of the optoelectronic component.
9. An apparatus comprising:
a host device including a processor and a display screen;
an optoelectronic module in the host device, the optoelectronic module including: an optoelectronic component mounted to a PCB substrate;
a transmissive adhesive disposed directly on the optoelectronic component, wherein the adhesive is transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component and wherein a coefficient of thermal expansion of the transmissive adhesive is the same as or very close to a coefficient of thermal expansion of the optoelectronic component;
an optical filter disposed directly on and in contact with the transmissive adhesive; and
an epoxy laterally surrounding and in contact with side surfaces of the transmissive adhesive and the optical filter, wherein the epoxy is non-transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component, wherein the processor is operable to control a feature of the host device based, at least in part, on signals from the optoelectronic component.
10. The apparatus of claim 9 wherein the transmissive adhesive and the optical filter are disposed so as to intersect an optical axis of the optoelectronic component.
11. The apparatus of claim 9 wherein the epoxy defines a recess directly over the optical filter that accommodates an optical diffuser.
12. The apparatus of claim 9 wherein there is no air gap between the optoelectronic component and the optical filter.
13. The apparatus of claim 9 wherein the optoelectronic component is operable to emit light.
14. The apparatus of claim 9 wherein the optoelectronic component is operable to sense light.
15. The apparatus of claim 9 wherein the epoxy is a black epoxy.