Manufacturing method of conductive film

1. A manufacturing method of a conductive film, comprising following steps:

providing a substrate, wherein the substrate comprises a first surface and a second surface, which are opposite to each other;

forming a first metal layer and a second metal layer on the first surface, wherein the first metal layer is positioned on the first surface, and the second metal layer is positioned on a surface of the first metal layer away from the substrate; and

forming a third metal layer on a surface of the second metal layer away from the substrate, wherein the third metal layer fully covers edges of the second metal layer and contacts the first metal layer;

etching the first metal layer and the second metal layer after forming the first metal layer and the second metal layer on the first surface;

etching the third metal layer after forming the third metal layer on the surface of the second metal layer away from the substrate;

forming a complete conductive film with the first metal layer, the second metal layer, and the third metal layer after etching the third metal layer; and

forming a light-shielding layer on a surface of the third metal layer away from the substrate;

wherein the light-shielding layer shields reflected light on two opposite sides of the second metal layer after etching the third metal layer.

2. The manufacturing method of the conductive film according to claim 1 , wherein material of the first metal layer and the third metal layer comprises titanium, and material of the second metal layer comprises aluminum.

3. The manufacturing method of the conductive film according to claim 1 , wherein a thickness of the second metal layer ranges from 4500 to 5500 angstroms (Å).

4. The manufacturing method of the conductive film according to claim 1 , wherein a thickness of the second metal layer is 5000 angstroms (Å).