Method of producing a vehicle glass assembly
A method of producing a vehicle glass assembly includes (A) providing a harness including a metal wire, a connector at a terminal of the metal wire, including a flat portion made of a metal plate, and a block of lead-free solder, containing tin as a major component, soldered on the flat portion of the connector; (B) providing a glass substrate layer over which a conductive layer, including an electrically conductive wire pattern and a connecting terminal, is formed; (C) sandwiching the block between the flat portion of the connector and the connecting terminal of the conductive layer, and then melting the block to form a solder connection between the connector and the connecting terminal; wherein the amount of the lead-free solder is between 4 mg and 13 mg.
1. A method of producing a vehicle glass assembly, comprising:
(A) providing a harness comprising
a metal wire,
a connector at a terminal of the metal wire, comprising a flat portion made of a metal plate, the metal plate comprising
an upper face,
a lower face, and
at least one side edge, and
a block of lead-free solder, containing tin as a major component, soldered on the flat portion of the connector;
(B) providing a glass substrate layer over which a conductive layer, comprising an electrically conductive wire pattern and a connecting terminal, is formed;
(C) sandwiching the block between the flat portion of the connector and the connecting terminal of the conductive layer, and then melting the block to form a lead-free solder layer by solder connection between the connector and the connecting terminal;
wherein the amount of the lead-free solder is between 4 mg and 13 mg, the block on the flat portion is away from all side edges of the flat portions after melting, such that a gap exists along a border between the block and all side edges of the flat portion, and all lead-free solder is disposed between the flat portion and the connecting terminal in the solder connection.
2. The production method according to claim 1 , wherein the amount of the lead-free solder is between 4.5 mg and 10 mg.
3. The production method according to claim 1 , wherein the area of the flat portion is between 10 mm 2 and 15 mm 2 .
4. The production method according to claim 1 , wherein the thickness of the metal plate is between 0.2 mm and 0.4 mm.
5. The production method according to claim 1 , wherein the connector is a B-crimp clamping the metal wire.
6. The production method claim 1 , wherein the volume of the block is between 0.6 mm 3 and 2 mm 3 .
7. The production method according to claim 1 , wherein the thickness of the block is between 0.2 mm and 0.4 mm.
8. The production method according to claim 1 , wherein the conductive layer is a printed hot-wire and the glass substrate layer is of non-tempered glass.
9. The production method according to any one of claim 1 , wherein all lead-free solder recesses from all edges of the flat portion.
10. The production method according to claim 1 , wherein the shape of the flat portion is a rectangle, a square, an oval, or a circle.
11. The production method according to claim 1 , wherein the metal plate is made of Cu, a Cu alloy, or an Fe alloy comprising Ni or Cr.
12. The production method according to claim 1 , wherein the lead-free solder contains tin as a major component.
13. The production method according to claim 1 , wherein the lead-free solder is an Sn-Ag based solder or an Sn-Ag-Cu based solder.
14. The production method according to claim 13 , wherein the lead-free solder contains 95-99 mass % of Sn, 1-5 mass % of Ag, and 0-1.5 mass % of Cu.
15. The production method according to claim 1 , wherein the lead-free solder layer is thinner than the block in thickness.
16. The production method according to claim 1 , wherein the block is melted in the step (C) by using a soldering iron or by electrical heating of the connector.
17. The production method according to claim 1 , wherein the lead-free solder layer has a thickness that is between 0.1 mm to 0.3 mm.
18. A method of producing a vehicle glass assembly, comprising:
(A) providing a harness comprising
a metal wire,
a connector at a terminal of the metal wire, comprising a flat portion made of a metal plate, the metal plate comprising
an upper face,
a lower face, and
at least one side edge, and
a block of lead-free solder, containing tin as a major component, soldered on the flat portion of the connector;
(B) providing a glass substrate layer over which a conductive layer, comprising an electrically conductive wire pattern and a connecting terminal, is formed;
(C) sandwiching the block between the flat portion of the connector and the connecting terminal of the conductive layer, and then melting the block to form a lead-free solder layer by a solder connection between the connector and the connecting terminal;
wherein the amount of the lead-free solder is between 4.5 mg and 10 mg,
wherein the block on the flat portion is away from all side edges of the flat portions after melting, such that a gap exists along a border between the block and all side edges of the flat portion,
wherein all lead-free solder is disposed between the flat portion and the connecting terminal in the solder connection,
wherein the area of the flat portion is between 10 mm 2 and 15 mm 2 ,
wherein the thickness of the metal plate is between 0.2 mm and 0.4 mm,
wherein the connector is a B-crimp clamping the metal wire,
wherein the volume of the block is between 0.6 mm 3 and 2 mm 3 ,
wherein the thickness of the block is between 0.2 mm and 0.4 mm,
wherein the conductive layer is a printed hot-wire and the glass substrate layer is of non-tempered glass,
wherein all lead-free solder recesses from all side edges of the flat portions.
19. The production method according to claim 18 , wherein the lead-free solder is an Sn-Ag based solder or an Sn-Ag-Cu based solder.
20. The production method according to claim 18 , wherein the lead-free solder contains 95-99 mass % of Sn, 1-5 mass % of Ag, and 0-1.5 mass % of Cu.