Conductive laminated structure and foldable electronic device
A conductive laminated structure includes a conductive layer and a thickening layer. The conductive layer extends in a first direction. The thickening layer is disposed over or under the conductive layer. The conductive laminated structure can withstand more than 40,000 folding times without breakage when a radius of curvature R is equal to 3 mm, a folding direction is perpendicular or parallel to the first direction, and a folding angle is 180°. A foldable electronic device is also provided herein.
1. A foldable electronic device comprising:
a display region; and
a non-display region disposed outside the display region, wherein:
the non-display region has a plurality of traces having a longest dimension extending in a first direction,
each of the traces comprises:
a substrate; and
a conductive layer disposed over the substrate,
the non-display region has a local thickened area comprising a bend when the foldable electronic device is bent,
each of the traces in the local thickened area comprises a thickening layer disposed over or under the conductive layer and in a stress tensile side of the foldable electronic device when the foldable electronic device is bent,
the thickening layer has a first end at which a material of the thickening layer ceases to continue in the first direction and a second end at which the material of the thickening layer ceases to continue in the first direction,
a length of the thickening layer in the first direction, measured from the first end to the second end, is less than a length of a corresponding conductive layer,
the material of the thickening layer is a metal material, and
a ratio of a thickness of the thickening layer to a thickness of the conductive layer is about 0.5 to 5.
2. The foldable electronic device of claim 1 , wherein:
the local thickened area has a width extending in a second direction perpendicular to the first direction,
one of the traces has a width of W 1 ,
a spacing between the traces is P 1 ,
a number of the traces is N, and
the width of the local thickened area ranges between W 1 to (W 1 +P 1 )×N.
3. The foldable electronic device of claim 1 , wherein the length of the thickening layer is greater than 3 mm.
4. The foldable electronic device of claim 1 , wherein:
a value of a thickness of the substrate multiplied by Young's modulus of the substrate is about 100 to 300 μm·Gpa,
a value of the thickness of the conductive layer multiplied by Young's modulus of the conductive layer is about 20 to 70 μm·Gpa, and
a value of the thickness of the thickening layer multiplied by Young's modulus of the thickening layer is about 5 to 30 μm·Gpa.
5. The foldable electronic device of claim 1 , wherein a value of the thickness of the conductive layer multiplied by Young's modulus of the conductive layer is about 20 to 70 μm·Gpa.
6. The foldable electronic device of claim 1 , wherein a value of the thickness of the thickening layer multiplied by Young's modulus of the thickening layer is about 5 to 30 μm·Gpa.
7. The foldable electronic device of claim 1 , wherein the length of the thickening layer is greater than 9 mm.
8. The foldable electronic device of claim 1 , wherein the length of the thickening layer is greater than 15 mm.
9. The foldable electronic device of claim 1 , wherein an angle at an axle center of bending and between the first end and the second end of the thickening layer is 180° to 360°.
10. The foldable electronic device of claim 1 , wherein a ratio of the length of the thickening layer to the length of the conductive layer is 0.001 to less than 1.
11. The foldable electronic device of claim 1 , wherein:
the conductive layer is configured to carry conductive signals transmitted through the traces, and
the thickness of the conductive layer is the same in the local thickened area and outside the local thickened area such that the conductive signals transmitted through the traces are carried by a conductor having a uniform thickness in the local thickened area and outside the local thickened area.
12. A foldable electronic device comprising:
a display region; and
a non-display region disposed outside the display region, wherein:
the non-display region has a plurality of traces having a longest dimension extending in a first direction,
each of the traces comprises:
a substrate; and
a conductive layer disposed over the substrate,
the non-display region has a local thickened area comprising a bend when the foldable electronic device is bent,
each of the traces in the local thickened area comprises a thickening layer disposed over or under the conductive layer and in a stress tensile side of the foldable electronic device when the foldable electronic device is bent,
the thickening layer has a first end at which a material of the thickening layer ceases to continue in the first direction and a second end at which the material of the thickening layer ceases to continue in the first direction,
a length of the thickening layer in the first direction, measured from the first end to the second end, is less than a length of a corresponding conductive layer,
the material of the thickening layer is a metal material,
a value of a thickness of the substrate multiplied by Young's modulus of the substrate is about 100 to 300 μm·Gpa,
a value of a thickness of the conductive layer multiplied by Young's modulus of the conductive layer is about 20 to 70 μm·Gpa, and
a value of a thickness of the thickening layer multiplied by Young's modulus of the thickening layer is about 5 to 30 μm·Gpa.
13. The foldable electronic device of claim 12 , wherein:
the local thickened area has a width extending in a second direction perpendicular to the first direction,
one of the traces has a width of W 1 ,
a spacing between the traces is P 1 ,
a number of the traces is N, and
the width of the local thickened area ranges between W 1 to (W 1 +P 1 )×N.
14. The foldable electronic device of claim 12 , wherein the length of the thickening layer is greater than 3 mm.
15. A foldable electronic device comprising:
a display region; and
a non-display region disposed outside the display region, wherein:
the non-display region has a plurality of traces having a longest dimension extending in a first direction,
each of the traces comprises:
a substrate; and
a conductive layer disposed over the substrate,
the non-display region has a local thickened area comprising a bend when the foldable electronic device is bent,
each of the traces in the local thickened area comprises a thickening layer disposed over or under the conductive layer and in a stress tensile side of the foldable electronic device when the foldable electronic device is bent,
the thickening layer has a first end at which a material of the thickening layer ceases to continue in the first direction and a second end at which the material of the thickening layer ceases to continue in the first direction,
a length of the thickening layer in the first direction, measured from the first end to the second end, is less than a length of a corresponding conductive layer,
the thickening layer comprises:
a first polymer layer; and
a second polymer layer disposed over the first polymer layer,
a material of the first polymer layer is different from a material of the second polymer layer, and
a ratio of Young's modulus of the first polymer layer to Young's modulus of the second polymer layer is about 10 3 to 10 6 .
16. The foldable electronic device of claim 15 , wherein:
a ratio of a thickness of the first polymer layer to a thickness of the conductive layer is about 30 to 100,
a ratio of a thickness of the second polymer layer to the thickness of the conductive layer is about 30 to 100, and
a ratio of the thickness of the first polymer layer to the thickness of the second polymer layer is about 0.5 to 2.
17. The foldable electronic device of claim 15 , wherein:
the local thickened area has a width extending in a second direction perpendicular to the first direction,
one of the traces has a width of W 1 ,
a spacing between the traces is P 1 ,
a number of the traces is N, and
the width of the local thickened area ranges between W 1 to (W 1 +P 1 )×N.
18. The foldable electronic device of claim 15 , wherein the length of the thickening layer is greater than 3 mm.
19. The foldable electronic device of claim 15 , wherein an angle at an axle center of bending and between the first end and the second end of the thickening layer is 180° to 360°.
20. The foldable electronic device of claim 15 , wherein:
the conductive layer is configured to carry conductive signals transmitted through the traces, and
a thickness of the conductive layer is the same in the local thickened area and outside the local thickened area such that the conductive signals transmitted through the traces are carried by a conductor having a uniform thickness in the local thickened area and outside the local thickened area.