Multi-gate string drivers having shared pillar structure
Some embodiments include apparatuses, and methods of forming the apparatuses. Some of the apparatuses include a first group of conductive materials interleaved with a first group of dielectric materials, a pillar extending through the conductive materials and the dielectric materials, memory cells located along the first pillar, a conductive contact coupled to a conductive material of the first group of conductive materials, and additional pillars extending through a second group of conductive materials and a second group of dielectric materials. The second pillar includes a first portion coupled to a conductive region, a second portion, a third portion, and a fourth portion coupled to the conductive contact. The second portion is located between the first and third portions. The second portion of each of the additional pillars is part of a piece of material extending from a first pillar to a second pillar of the additional pillars.
1. A method comprising:
forming a mask having an opening over pillars of a device, the pillars are separated from each other by a dielectric material;
removing a portion of each of the pillars and a portion of the dielectric material at a location at the opening;
forming a material at the location, the material having a first structure;
causing the first structure of the material to change to a second structure; and
removing part of the material having the second structure to form separate portions from a remaining part of the second structure, such that each of the separate portions contacts a portion of one of the pillars.
2. The method of claim 1 , wherein causing the first structure of the material to change includes annealing the material.
3. The method of claim 1 , wherein causing the first structure to change includes reducing defects in the material.
4. The method of claim 1 , wherein:
the separate portions include a first portion contacting a portion of a first pillar of the pillars, wherein the first portion has a grain size greater than a grain size of the portion of the first pillar; and
the separate portions include a second portion contacting a portion of a second pillar of the pillars, wherein the second portion has a grain size greater than a grain size of the portion of the second pillar.
5. The method of claim 1 , further comprising:
forming doped polysilicon portions over the separate portions of the remaining part of the second structure, such that each of the doped polysilicon portions contacts a respective portion of the separate portions of the remaining part of the second structure.
6. The method of claim 5 , wherein the remaining part of the second structure has a doping concentration less than a doping concentration of the doped polysilicon portions.
7. The method of claim 5 , further comprising:
forming a conductive region contacting the doped polysilicon portions.
8. A method comprising:
forming a mask having an opening over pillars of a device, the pillars are separated from each other by a dielectric material;
removing a portion of each of the pillars and a portion of the dielectric material at a location at the opening;
forming a material at the location at the opening, the material having a first grain size;
causing the material having the first grain size to change to a material having a second grain size, the second grain size being greater than the first grain size; and
removing part of the material having the second grain size to obtain a remaining part of the material having the second grain size, such that the remaining part of the material having the second grain size includes separate portions that contact respective portions of the pillars.
9. The method of claim 8 , wherein the second grain size is at least 10 times the first grain size.
10. The method of claim 8 , wherein the material includes polysilicon.
11. The method of claim 8 , wherein the pillars include undoped polysilicon.
12. The method of claim 8 , wherein the pillars include doped polysilicon.
13. A method comprising:
forming a mask having an opening over pillars of a device, the pillars are separated from each other by a dielectric material;
removing a portion of each of the pillars and a portion of the dielectric material at a location at the opening;
forming a polysilicon material at the location at the opening;
annealing the polysilicon material to form modified polysilicon material; and
removing part of the modified polysilicon material to form separate portions of the modified polysilicon material, such that the separate portions contact respective portions of the pillars.
14. The method of claim 13 , wherein the polysilicon material includes doped polysilicon material.
15. The method of claim 13 , wherein the pillars include undoped polysilicon.
16. The method of claim 13 , wherein the pillars include doped polysilicon.
17. The method of claim 16 , wherein the pillars have a doping concentration less than a doping concentration of the modified polysilicon material.
18. The method of claim 13 , further comprising:
forming doped polysilicon portions, such that each of the doped polysilicon portions contacts a respective portion of the separate portions of the modified polysilicon material.
19. The method of claim 18 , wherein the modified polysilicon material has a doping concentration less than a doping concentration of the doped polysilicon portions.
20. The method of claim 18 , further comprising:
forming a conductive region contacting the doped polysilicon portions.