IP Library Granted Patent US 11,277,681
Granted Patent B2
US 11,277,681 · App. 16/984,299 · Granted Mar 15, 2022

Multi-mic earphone design and assembly

Inventor: John Keady (Fairfax Station, VA)
Assignee: Staton Techiya, LLC
H04R1/1041H04R1/1016H04R1/1075H04R1/1083H04R2420/07
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Quick Facts
Patent No.
US 11,277,681
App. No.
16/984,299
Granted
Mar 15, 2022
Kind
B2
Abstract

At least one exemplary embodiment is directed to a method of earphone manufacturing with an ear canal microphone, ambient sound microphone and a speaker.

Claims (23)

1. An earphone comprising: an electronic package comprising:

a first microphone;

a second microphone;

a speaker; and

a circuit connected to the first microphone, the second microphone, and the speaker; and

where the circuit, first microphone and the second microphone are attached to a flexible PCB;

an earphone housing, where the earphone housing includes a portion that is flexible with a shore A value of greater than 60;

where the flexible portion includes a stent portion; and

where the electronic package is configured to be swappable amongst various earphone housings, where the electronics package is attached by a press fit where a protrusion on the electronics package fits within a flexible reces in the earphone housing;

where the electronic package is a self contained module that can be inserted into the earphone housing and attached; and

a cap, where the cap includes a microphone port and the cap is attached to the earphone housing.

2. The earphone according to claim 1 , where the earphone housing is at least partially 3-D printed.

3. The earphone according to claim 1 , where the earphone housing can be selected by a user.

4. The earphone according to claim 3 , where the earphone housing is 3D printed.

5. The earphone according to claim 1 , where the electronic package is configured to be swappable amongst various earphone housings, where the electronics package is attached by adhesive.

6. The earphone according to claim 1 , further including: an eartip, where the eartip has been inserted onto a first portion of the stent portion.

7. The earphone according to claim 6 , where the stent portion includes a microphone channel.

8. The earphone according to claim 7 , where the microphone channel is operatively connected between the first microphone and an ear canal of a user when the stent portion is inserted into the user's ear canal.

9. The earphone according to claim 8 , where the eartip is configured to seal the ear canal.

10. The earphone according to claim 1 , where the cap is attached by a press fit where a protrusion on the cap fits within a flexible recess in the earphone housing.

11. The earphone according to claim 1 where the electronic package can be attached to an audio control device via a wire.

12. The earphone according to claim 1 , further including a battery.

13. The earphone according to claim 12 where the electronic package can be wirelessly attached to an audio control device.

Assignments (4)
MERGER Recorded May 9, 2026
From: ST CASE1TECH, LLC; ST CASESTECH, LLC; ST FAMTECH, LLC; ST R&DTECH, LLC; ST TIPTECH, LLC; ST SEALTECH, LLC; ST BIOTECH, LLC; ST EARTECH, LLC; ST DETECTTECH, LLC; ST VRTECH, LLC; ST AWARETECH, LLC; CASES2TECH, LLC
To: ST PORTFOLIO HOLDINGS, LLC
Reel/Frame 075533/0472 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2024
From: STATON TECHIYA, LLC
To: ST PORTFOLIO HOLDINGS, LLC
Reel/Frame 067806/0722 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2024
From: ST PORTFOLIO HOLDINGS, LLC
To: ST R&DTECH, LLC
Reel/Frame 067806/0751 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2020
From: KEADY, JOHN
To: STATON TECHIYA, LLC
Reel/Frame 053786/0787 →