IP Library Granted Patent US 11,701,514
Granted Patent B2
US 11,701,514 · App. 16/984,410 · Granted Jul 18, 2023

Segmented ring electrode

Inventors: Markus Jung (Hanau, DE); Katharina Musiol (Hanau, DE)
Assignee: Heraeus Deutschland GmbH & Co. KG
A61N1/0534A61B5/24B29C70/84B29L2031/753
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Quick Facts
Patent No.
US 11,701,514
App. No.
16/984,410
Granted
Jul 18, 2023
Kind
B2
Abstract

One aspect is a process for producing a segmented electrode, including providing a pipe made of metal having an outer side and an inner side, wherein the inner side of the pipe forms a hollow space. A support structure is arranged in the hollow space, so that the support structure mechanically stabilizes the pipe. Intermediate spaces are formed in the pipe, which define a plurality of segments in the pipe. An electrically insulating material is introduced into the intermediate spaces and thus forming electrically insulating areas, wherein a boundary layer is in each case defined between the segments and the areas. The pipe is cut so that several segmented ring-shaped electrodes are formed therefrom. The support structure is removed from the pipe.

Claims (28)

1. A process for producing a segmented electrode, comprising:

a. providing a pipe made of metal having an outer side and an inner side, wherein the inner side of the pipe forms a hollow space;

b. arranging a support structure in the hollow space, so that the support structure mechanically stabilizes the pipe;

c. forming intermediate spaces in the pipe, which define a plurality of segments in the pipe;

d. introducing an electrically insulating material into the intermediate spaces and thus forming electrically insulating areas,

wherein a boundary layer is in each case defined between the segments and the areas;

e. cutting the pipe, so that several segmented ring-shaped electrodes are formed therefrom; and

f. removing the support structure from the pipe.

2. The process according to claim 1 , wherein the support structure and the pipe have different materials or consist of different materials.

3. The process according to claim 1 , wherein the support structure has a base metal, preferably iron, molybdenum, magnesium, copper, aluminum, tin, zinc, nickel or an alloy thereof or consists thereof.

4. The process according to claim 1 , wherein the step of removing the support structure from the pipe includes a chemical process, preferably an etching process.

5. The process according to claim 1 , wherein the outer side of the pipe is additionally structured to form a structure on the outer side of the pipe, and wherein the structure is configured to provide for the electrical contacting of the formed ring electrode.

6. The process according to claim 5 , wherein the structure is an opening, which connects the outer side to the inner side of the pipe.

7. The process according to claim 1 , wherein the outer side of the pipe is additionally coated.

8. The process according to claim 1 , wherein the electrically insulating areas are formed by means of extrusion or dip coating.

9. The process according to claim 1 , wherein the electrically insulating areas have an extrudable polymer, preferably ETFE, PTFE, PFA, FEP, TPU or PEEK or consist thereof.

10. The process according to claim 1 , wherein the segments are each structured at the boundary layer, so that the connection between the segments and the electrically insulating areas is improved.

11. The process according to claim 1 , wherein the segments and the electrically insulating areas are in each case connected to one another by means of a sub stance-to-sub stance bond or in a positive manner by liquefying the electrically insulating material.

12. The process according to claim 1 , wherein the process steps are performed in the order a, b, c, d, e, for a, b, c, d, f, e.

13. The process according to claim 1 , wherein the support structure is a part of a device, which is configured to form the pipe of several wires.

14. The process according to claim 13 , including the following steps:

a. providing a plurality of wires,

b. inserting the wires into the device, wherein the device has a support structure,

c. assembling the wires to form a pipe with the help of the device, wherein segments, which are each separated from one another by means of intermediate spaces, are in each case formed in the pipe made of the wires, wherein the support structure mechanically stabilizes the pipe,

d. filling the intermediate spaces with an electrically insulating material, so that electrically insulating areas are in each case formed from the material between the segments,

e. removing the support structure from the pipe,

f. cutting the pipe, so that several ring electrodes are formed therefrom.

15. A segmented ring electrode, produced by a process according to claim 1 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2024
From: HERAEUS DEUTSCHLAND GMBH & CO. KG
To: HERAEUS MEDEVIO GMBH & CO. KG
Reel/Frame 068189/0526 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2020
From: JUNG, MARKUS; MUSIOL, KATHARINA
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 053866/0934 →
Priority Claims (1)
DE 10 2019 211 689.2 · Aug 5, 2019 · national
Continuity (1)
Related Publication 20210038882A1 · Feb 11, 2021