IP Library Granted Patent US 11,825,250
Granted Patent B2
US 11,825,250 · App. 16/987,546 · Granted Nov 21, 2023

Compact modular wireless sensor

Inventors: James Phillips (Lake Geneva, WI); Don Recupido (Crystal Lake, IL); Nathan Frost (McHenry, IL); Randy Scott Brown (Poplar Grove, IL)
Assignee: WATLOW ELECTRIC MANUFACTURING COMPANY
H04Q9/00H04B1/38H04Q2209/40
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Quick Facts
Patent No.
US 11,825,250
App. No.
16/987,546
Granted
Nov 21, 2023
Kind
B2
Abstract

A sensor assembly includes a housing that defines an interior space. The sensor assembly includes a sensor connected to the housing at the aperture. The sensor assembly includes a wireless power source disposed within the interior space. The sensor assembly includes electronics disposed within the interior space and configured to receive power from the wireless power source. The electronics include a communication board and a sensor connector, and the sensor is configured to transmit data to the communication board via the sensor connector.

Claims (35)

1. A sensor assembly comprising:

a housing defining an interior space, wherein the housing comprises an upper portion and a lower portion that are secured together, and wherein the housing comprises a heat sink that is secured to the lower portion;

a sensor secured to the upper portion;

a wireless power source disposed within the interior space; and

electronics disposed within the interior space and configured to receive power from the wireless power source, wherein the electronics comprise a communication board and a sensor connector, and wherein the sensor is configured to transmit data to the communication board via the sensor connector.

2. The sensor assembly of claim 1 , wherein:

the upper portion has a first mating wedge and a first sidewall adjacent to the first mating wedge; and

the lower portion has a second mating wedge and a second sidewall adjacent to the second mating wedge.

3. The sensor assembly of claim 2 , wherein the upper portion and the lower portion define an angled sealing interface between the first mating wedge and the second mating wedge and extends to the first sidewall of the upper portion and the second sidewall of the lower portion.

4. The sensor assembly of claim 2 , wherein the first sidewall and the second sidewall are opposed to one another to form opposing ends of the housing.

5. The sensor assembly of claim 4 , wherein one of the opposing ends of the housing defines an aperture, and the sensor is secured to the housing at the aperture.

6. The sensor assembly of claim 5 , further comprising a communication connector configured to receive a mating communication connector and being operable to transmit data from the sensor to the mating communication connector, wherein:

the other one of the opposing ends of the housing defines a second aperture, and

the communication connector is disposed at the second aperture.

7. The sensor assembly of claim 6 , wherein the communication connector is one of a universal serial bus (USB) link, a USB-C link, an Ethernet link, a controller area network (CAN) link, and an Aspirated TIP/Ethernet link.

8. The sensor assembly of claim 1 , wherein the housing defines a volume of less than 2 in 3 .

9. The sensor assembly of claim 1 , wherein the communication board includes a wireless communication component to establish a wireless communication link with an external device.

10. The sensor assembly of claim 1 , wherein the communication board does not include a communication port.

11. A sensor assembly comprising:

a housing defining an aperture and including an upper portion and a lower portion, wherein the housing defines an interior space between the upper portion and the lower portion;

a sensor secured to the housing at the aperture;

a wireless power source disposed within the interior space; and

electronics disposed within the interior space and configured to receive power from the wireless power source, wherein the electronics comprise a communication board and a sensor connector, and wherein the sensor is configured to transmit data to the communication board via the sensor connector,

wherein the upper portion has a first mating wedge and a first sidewall adjacent to the first mating wedge, and

the lower portion has a second mating wedge and a second sidewall adjacent to the second mating wedge.

12. The sensor assembly of claim 11 further comprising a communication connector configured to receive a mating communication connector, wherein the communication connector is communicatively coupled to the sensor by way of the electronics and is operable to transmit data from the sensor to the mating communication connector.

13. The sensor assembly of claim 12 , wherein the communication connector is one of a universal serial bus (USB) link, a USB-C link, an Ethernet link, a controller area network (CAN) link, and an Aspirated TIP/Ethernet link.

14. The sensor assembly of claim 11 , wherein the upper portion and the lower portion are configured to be secured together.

15. The sensor assembly of claim 11 , wherein the housing includes a heat sink that is secured to one of the upper portion or the lower portion.

16. The sensor assembly of claim 11 , wherein the first sidewall and the second sidewall are opposed to one another to form opposing ends of the housing.

17. The sensor assembly of claim 16 , wherein one of the opposing ends of the housing defines the aperture.

18. The sensor assembly of claim 11 , wherein the upper portion and the lower portion define an angled sealing interface between the first mating wedge and the second mating wedge and extends to the first sidewall of the upper portion and the second sidewall of the lower portion.

19. The sensor assembly of claim 11 , wherein the housing defines a volume of less than 2 in 3 .

20. The sensor assembly of claim 11 , wherein the communication board includes a wireless communication component to establish a wireless communication link with an external device.

21. The sensor assembly of claim 11 , wherein the communication board does not include a communication port.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2023
From: PHILLIPS, JAMES; RECUPIDO, DON; FROST, NATHAN; BROWN, RANDY
To: WATLOW ELECTRIC MANUFACTURING COMPANY
Reel/Frame 063401/0378 →
PATENT SECURITY AGREEMENT (SHORT FORM) Recorded Mar 3, 2021
From: WATLOW ELECTRIC MANUFACTURING COMPANY
To: BANK OF MONTREAL, AS ADMINISTRATIVE AGENT
Reel/Frame 055479/0708 →
Continuity (3)
Continuation 15932252 · Feb 16, 2018
Provisional Application 62459698 · Feb 16, 2017
Related Publication 20200366974A1 · Nov 19, 2020