IP Library Granted Patent US 11,480,452
Granted Patent B2
US 11,480,452 · App. 16/989,459 · Granted Oct 25, 2022

Field device housing with a monitoring device

Inventors: Clemens Hengstler (Haslach, DE); Fabian Witt (Hofstetten, DE); Dominik Fehrenbach (Rottweil, DE)
Assignee: Vega Grieshaber KG
G01D11/245G12B9/04
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Quick Facts
Patent No.
US 11,480,452
App. No.
16/989,459
Granted
Oct 25, 2022
Kind
B2
Abstract

A field device housing with electronics disposed in the field device housing and a monitoring device, characterized by electronics which electrically check the monitoring device and by the monitoring device, which displays a state of the field device housing.

Claims (14)

1. A field device housing with electronics disposed in the field device housing, a housing cover and a monitoring device, wherein the electronics electrically check the monitoring device, and that the monitoring device indicates a state of the field device housing, wherein the housing cover comprises a receiver element, the electronics comprise a transmitter element and the electronics monitor the conductor path in the housing cover via a signal sent back from the transmitter element to the receiver element.

2. A field device housing of claim 1 , wherein the monitoring device is integrated in a wall of the field device housing.

3. A field device housing of claim 1 , wherein the monitoring device is disposed on an inner side of the field device housing.

4. The field device housing of claim 1 , wherein a power supply of the field device is interrupted, or the electronics switch off, when the state changes.

5. The field device housing of claim 1 , wherein the electronics are configured to send a signal to a superordinate unit, embodied as a control center, when the state changes.

6. The field device housing of claim 1 , wherein the monitoring device forms a conductor path, and that the change in the state is a change in capacitance or an increase in resistance, embodied as a conductor path break.

7. The field device housing of claim 1 , wherein the field device housing is made of injection-moldable plastic.

8. A method for producing the field device housing of claim 1 with a conductor path, comprising the following steps:

a. printing and applying conductor paths to a plastic base, and

b. inserting the plastic base into a plastic matrix by means of an injection molding process,

wherein the plastic matrix forms the field device housing.

9. A method for determining a state of a field device housing with a housing cover and a monitoring device, comprising electronics disposed in the field device housing which are configured to monitor the state of the monitoring device, wherein the housing cover comprises a receiver element, the electronics comprise a transmitter element and the electronics monitor the conductor path in the housing cover via a signal sent back from the transmitter element to the receiver element, comprising thee following steps:

a. monitoring the state of the field device housing, and

b. reacting to a change in the state.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2020
From: HENGSTLER, CLEMENS; WATT, FABIAN; FEHRENBACH, DOMINIK
To: VEGA GRIESHABER
Reel/Frame 053806/0115 →
Continuity (1)
Related Publication 20210048321A1 · Feb 18, 2021