Electronic component fixation structure and current detection device
An electronic component fixation structure disclosed in the present application includes a holding member which, being made of an insulating material, is formed of a storing portion which stores a main body portion of an electronic component, a protection portion which surrounds a plurality of connection terminals of the electronic component, and a pair of protrusion portions which protrude upward from the respective central portions of a pair of side walls of the protection portion; and a wiring substrate on which to connect between electronic components, wherein the pair of protrusion portions of the holding member are engaged with the wiring substrate, and the plurality of connection terminals of the electronic component are solder connected to the wiring substrate.
1. An electronic component fixation structure in which to fix an electronic component which is formed of a main body portion with a semiconductor element resin sealed therein and a plurality of connection terminals which, being connected to the semiconductor element, are formed protruding from the main body portion, comprising:
a holding member which, being made of an insulating material, is formed of a storing portion which stores the main body portion, a protection portion which surrounds the plurality of connection terminals, and a pair of protrusion portions which protrude upward from the respective central portions of a pair of side walls of the protection portion;
a wiring substrate on which to connect between a plurality of electronic components;
a power module which, being connected to the wiring substrate, generates power with which to drive a rotary electric machine;
a conductor which supplies the rotary electric machine with the output from the power module;
a core which, being provided adjacent to the conductor, is provided in one portion thereof a groove portion, wherein the main body portion of the semiconductor element is disposed in the groove portion; and
a cooler which, having mounted thereon the power module, dissipates heat generated by the power module, wherein
the conductor and the core are molded integrally with resin and fixed to the cooler, and wherein
the pair of protrusion portions of the holding member are engaged with the wiring substrate, and the plurality of connection terminals of the semiconductor element are solder connected to the wiring substrate.
2. The electronic component fixation structure according to claim 1 , wherein
the storing portion of the holding member, being front and top opened, is configured of a groove in which to store the main body portion of the electronic component and a protrusion which protrudes toward the inside of the groove.
3. The electronic component fixation structure according to claim 2 , wherein
the protection portion of the holding member has planar portions, one on each of the respective upper ends of the corner portions thereof, and the wiring substrate is superimposed on the planar portions.
4. The electronic component fixation structure according to claim 3 , wherein
the electronic component is a Hall IC.
5. A current detection device using the electronic component fixation structure according to claim 4 , comprising:
a power module which, being connected to the wiring substrate, generates power with which to drive a rotary electric machine; a conductor which supplies the rotary electric machine with the output from the power module; and a core which, being provided adjacent to the conductor, is provided in one portion thereof a groove portion, wherein
the storing portion of the holding member in which is stored the main body portion of the Hall IC is disposed in the groove portion of the core.
6. The electronic component fixation structure according to claim 2 , wherein
the electronic component is a Hall IC.
7. A current detection device using the electronic component fixation structure according to claim 6 , comprising:
a power module which, being connected to the wiring substrate, generates power with which to drive a rotary electric machine; a conductor which supplies the rotary electric machine with the output from the power module; and a core which, being provided adjacent to the conductor, is provided in one portion thereof a groove portion, wherein
the storing portion of the holding member in which is stored the main body portion of the Hall IC is disposed in the groove portion of the core.
8. The electronic component fixation structure according to claim 1 , wherein
the protection portion of the holding member has planar portions, one on each of the respective upper ends of corner portions thereof, and the wiring substrate is superimposed on the planar portions, and the protrusion portions protrude through the wiring substrate, and wherein the planar portions exist in a first plane and the protrusion portions exist in a second plane, wherein the first plane is further away from the wiring substrate than the second plane.
9. The electronic component fixation structure according to claim 8 , wherein
the electronic component is a Hall IC.
10. A current detection device using the electronic component fixation structure according to claim 9 , comprising:
a power module which, being connected to the wiring substrate, generates power with which to drive a rotary electric machine; a conductor which supplies the rotary electric machine with the output from the power module; and a core which, being provided adjacent to the conductor, is provided in one portion thereof a groove portion, wherein
the storing portion of the holding member in which is stored the main body portion of the Hall IC is disposed in the groove portion of the core.
11. The electronic component fixation structure according to claim 1 , wherein
the pair of protrusion portions of the holding member are provided in respective positions wherein the line connecting the pair of protrusion portions is perpendicular to the direction of alignment of the plurality of connection terminals of the electronic component.
12. The electronic component fixation structure according to claim 11 , wherein
the distance between one of the pair of protrusion portions of the holding member and the alignment of the plurality of connection terminals of the electronic component is taken to be larger than the distance between adjacent ones of the plurality of connection terminals of the electronic component.
13. The electronic component fixation structure according to claim 12 , wherein
the electronic component is a Hall IC.
14. A current detection device using the electronic component fixation structure according to claim 13 , comprising:
a power module which, being connected to the wiring substrate, generates power with which to drive a rotary electric machine; a conductor which supplies the rotary electric machine with the output from the power module; and a core which, being provided adjacent to the conductor, is provided in one portion thereof a groove portion, wherein
the storing portion of the holding member in which is stored the main body portion of the Hall IC is disposed in the groove portion of the core.
15. The electronic component fixation structure according to claim 11 , wherein
the electronic component is a Hall IC.
16. A current detection device using the electronic component fixation structure according to claim 15 , comprising:
a power module which, being connected to the wiring substrate, generates power with which to drive a rotary electric machine; a conductor which supplies the rotary electric machine with the output from the power module; and a core which, being provided adjacent to the conductor, is provided in one portion thereof a groove portion, wherein
the storing portion of the holding member in which is stored the main body portion of the Hall IC is disposed in the groove portion of the core.
17. The electronic component fixation structure according to claim 1 , wherein
the electronic component is a Hall IC.
18. A current detection device using the electronic component fixation structure according to claim 17 , comprising:
a power module which, being connected to the wiring substrate, generates power with which to drive a rotary electric machine; a conductor which supplies the rotary electric machine with the output from the power module; and a core which, being provided adjacent to the conductor, is provided in one portion thereof a groove portion, wherein
the storing portion of the holding member in which is stored the main body portion of the Hall IC is disposed in the groove portion of the core.
19. An electronic component fixation structure in which to fix an electronic component which is formed of a main body portion with a semiconductor element resin sealed therein and a plurality of connection terminals which, being connected to the semiconductor element, are formed protruding from the main body portion, comprising:
a holding member which, being made of an insulating material, is formed of a storing portion which stores the main body portion, a protection portion which surrounds the plurality of connection terminals, and a pair of protrusion portions which protrude upward from the respective central portions of a pair of side walls of the protection portion; and a wiring substrate on which to connect between electronic components, wherein
the pair of protrusion portions of the holding member are engaged with the wiring substrate, and the plurality of connection terminals of the semiconductor element are solder connected to the wiring substrate, and
the protrusion portions of the holding member are configured by insert molding a steel plate in the holding member.