Optoelectronic component
An optoelectronic component includes an optoelectronic semiconductor chip including a connection surface; a first potting body; and a second potting body, wherein the first potting body covers all lateral side surfaces and the top surface of the semiconductor chip, the first potting body has a bottom surface flush with the connection surface, the second potting body has a bottom surface flush with the bottom surface, the second potting body completely covers all side surfaces of the first potting body facing away from the semiconductor chip, a top surface of the second potting body on the opposite of the connection surface is convexly curved, the first and second potting bodies have a contour in a lateral plane that is not similar, and the optoelectronic semiconductor chip has exclusively on its connection surface exposed electrical contact surfaces via which the semiconductor chip is electrically connectable and operable.
1. An optoelectronic component comprising:
an optoelectronic semiconductor chip comprising a connection surface, a cover surface opposite the connection surface and lateral side surfaces that connect the connection surface and the cover surface to one another;
a first potting body; and
a second potting body,
wherein the first potting body covers all lateral side surfaces and the top surface of the semiconductor chip,
the first potting body has a bottom surface flush with the connection surface of the semiconductor chip,
the second potting body has a bottom surface flush with the bottom surface of the first potting body,
the second potting body completely covers all side surfaces of the first potting body facing away from the semiconductor chip,
a top surface of the second potting body on the opposite of the connection surface is convexly curved,
the first and second potting bodies have a contour in a lateral plane that is not similar,
the optoelectronic semiconductor chip has exclusively on its connection surface exposed electrical contact surfaces via which the semiconductor chip is electrically connectable and operable, and
the first potting body includes at least one conversion agent that at least partially converts electromagnetic radiation generated in the semiconductor chip into electromagnetic radiation of a longer wavelength.
2. The optoelectronic component according to claim 1 , further comprising a carrier that is in places in direct contact with the first potting body and the second potting body, wherein the carrier is connected to the first potting body and the second potting body without a binding agent.
3. The optoelectronic component according to claim 1 , wherein the optoelectronic semiconductor chip, the first potting body and the second potting body are freely accessible on a lower side of the optoelectronic component.
4. The optoelectronic component according to claim 1 , wherein the second potting body is clear.
5. The optoelectronic component according to claim 1 , wherein the first potting body is in direct contact with the semiconductor chip.
6. The optoelectronic component according to claim 1 , wherein the first and the second potting body connect to each other without a binding agent.
7. The optoelectronic component according to claim 1 , which is free of a carrier.
8. The optoelectronic component according to claim 2 , wherein the carrier forms a heat sink for the optoelectronic component.
9. The optoelectronic component according to claim 1 , wherein the optoelectronic component comprises a multiplicity of semiconductor chips mechanically connected to one another, and each semiconductor chip is assigned exactly one first potting body and exactly one second potting body.
10. An optoelectronic component comprising:
an optoelectronic semiconductor chip comprising a connection surface, a cover surface opposite the connection surface and lateral side surfaces that connect the connection surface and the cover surface to one another;
a first potting body;
a second potting body; and
a carrier,
wherein the first potting body covers all lateral side surfaces and the top surface of the semiconductor chip,
the first potting body has a bottom surface flush with the connection surface of the semiconductor chip,
the second potting body has a bottom surface flush with the bottom surface of the first potting body,
the second potting body completely covers all the side surfaces of the first potting body facing away from the semiconductor chip,
a top surface of the second potting body on the opposite of the connection surface is convexly curved,
the first and second potting bodies have a contour in the lateral plane that is not similar,
the optoelectronic semiconductor chip has exclusively on its connection surface exposed electrical contact surfaces via which the semiconductor chip is electrically connectable and operable,
the carrier is in places in direct contact with the first potting body and the second potting body, and
the carrier forms a heat sink for the optoelectronic component.
11. An optoelectronic component comprising:
a multiplicity of optoelectronic semiconductor chips each comprising a connection surface, a cover surface opposite the connection surface and lateral side surfaces that connect the connection surface and the cover surface to one another;
a multiplicity of first potting bodies; and
a multiplicity of second potting bodies,
wherein the semiconductor chips are mechanically connected to one another,
each semiconductor chip is assigned exactly one first potting body and exactly one second potting body,
each first potting body covers all lateral side surfaces and the top surface of the associated semiconductor chip,
each first potting body has a bottom surface flush with the connection surface of the associated semiconductor chip,
each second potting body has a bottom surface flush with the bottom surface of the associated first potting body,
each second potting body completely covers all the side surfaces of the associated first potting body facing away from the semiconductor chip,
a top surface of each second potting body on the opposite of the associated connection surface is convexly curved,
each first and second potting bodies have a contour in the lateral plane that is not similar, and
each optoelectronic semiconductor chip has exclusively on its connection surface exposed electrical contact surfaces via which the semiconductor chip is electrically connectable and operable.