INTEGRATED VAPOR CHAMBER AND HEAT SINK

1 . A device comprising:

a heatsink portion including a plurality of horizontal fins and a plurality of vertical fins forming a grid structure, wherein at least one fin of the plurality of horizontal fins and the plurality of vertical fins has a thickness of between 0.15 mm and 0.2 mm; and

a vapor chamber portion configured to interface with a heat source to be cooled, wherein the vapor chamber portion includes, on a plurality of internal surfaces of the vapor chamber portion, a wicking structure configured to transfer a working fluid within the vapor chamber portion;

wherein the heatsink portion, the vapor chamber portion, and the wicking structure are portions of a same single printed monobody structure.

2 . The device of claim 1 , wherein the single printed monobody structure was printed using Direct Metal Laser Sintering.

3 . The device of claim 1 , wherein a first side of the vapor chamber portion is configured to interface the heat source and a second side of the vapor chamber portion opposite the first side is configured to interface with the heatsink portion.

4 . (canceled)

5 . The device of claim 1 , wherein a top portion of the heatsink portion at least in part encloses the grid structure.

6 . The device of claim 1 , wherein the vapor chamber portion includes at least one slot to evacuate metal powder.

7 . The device of claim 1 , wherein the vapor chamber portion includes a charging port by which the vapor chamber portion is vacuum charged.

8 . The device of claim 1 , wherein the vapor chamber portion includes a plurality of support structures.

9 . The device of claim 1 , wherein the wicking structure includes grooved channels adapted to transport the working fluid.

10 . The device of claim 1 , wherein the wicking structure includes a mesh.

11 . The device of claim 1 , wherein at least one of the heatsink portion and the vapor chamber portion is copper.

12 . The device of claim 1 , wherein at least one of the heatsink portion and the vapor chamber portion is aluminum.

13 . The device of claim 1 , wherein at least a portion of the heatsink portion is made of a different material from at least a portion of a body of the vapor chamber portion.

14 . The device of claim 1 , wherein the heatsink portion includes a fin gap between 0.6 mm and 1.1 mm.

15 . The device of claim 1 , wherein the wicking structure is made by sintering metal powder particles.

16 . A method, comprising:

applying metal powder;

sintering the applied metal powder to form a layer in a monobody integrated heatsink and vapor chamber structure, wherein a vapor chamber portion of the monobody structure includes on an internal surface of the vapor chamber portion a wicking structure configured to transfer a working fluid within the vapor chamber portion;

performing a stress relief cycle;

removing excess parts; and

machining to create a flat surface on a bottom of the monobody integrated heatsink and vapor chamber structure.

17 . The method of claim 16 , wherein performing the stress relief cycle includes:

removing the monobody integrated heatsink and vapor chamber structure from a fabrication piston; and

heating the monobody integrated heatsink and vapor chamber structure.

18 . The method of claim 16 , wherein removing excess parts includes evacuating trapped metal powder from the vapor chamber portion via a slot in the vapor chamber.

19 . The method of claim 16 , further comprising charging and sealing the vapor chamber portion.

20 . A device, comprising:

a plurality of vertical fins arranged adjacent to each other with less than a 1.1 mm gap between adjacent fins;

a plurality of horizontal fins in thermal communication with the plurality of vertical fins and interleaved with the plurality of vertical fins to form a grid structure; and

a wicking structure provided on a plurality of internal surfaces of a vapor chamber portion, the vapor chamber portion configured to interface with the plurality of vertical fins and the plurality of horizontal fins;

wherein:

at least one fin of the plurality of horizontal fins and the plurality of vertical fins has a thickness of between 0.15 mm and 0.2 mm, and

the device has been manufactured using three-dimensional printing.