Material deposition apparatus having at least one heating assembly and method for pre- and/or post-heating a substrate

1. A material deposition apparatus for depositing an evaporated material onto a substrate, the material deposition apparatus comprising:

a substrate transportation device comprising a coating drum comprising a curved drum surface and configured to transport the substrate along a substrate transportation direction, the coating drum being a gas cushion coating drum configured to provide a cooling gas between the drum surface and the substrate;

an evaporation source assembly disposed along the substrate transportation direction to provide the evaporated material to the substrate, the evaporation source assembly having a deposition area and wherein the substrate transportation device is configured to transport the substrate on the curved drum surface past the evaporation source assembly; and

at least a first heating assembly disposed along the substrate transportation direction, the first heating assembly being configured to provide a first heating area for heating the substrate, the first heating area being located directly adjacent to the deposition area of the evaporation source assembly;

wherein:

the evaporation source assembly further comprises at least one temperature-controlled shield arranged at the evaporation source assembly and delimiting the deposition area of the evaporation source assembly between a starting point of the deposition area and an end point of the deposition area;

at least part of the first heating area being located such that the substrate is simultaneously cooled by the cooling gas between the drum surface and the substrate such that heat is removed from the substrate to allow for higher deposition rates without damaging the substrate, and heated by the first heating assembly when the substrate is in the first heating area; and

the substrate directly enters the deposition area at the starting point of the deposition area when exiting the first heating area.

2. The material deposition apparatus according to claim 1 , wherein the at least one temperature-controlled shield extends outward the evaporation source assembly and towards the substrate.

3. The material deposition apparatus according to claim 1 , the first heating assembly comprising:

a first heating element configured to provide a first heating zone having a first temperature and

a second heating element configured to provide a second heating zone having a second temperature, the first temperature being different from the second temperature, the first heating element and the second heating element being individually controllable.

4. The material deposition apparatus according to claim 3 , wherein at least one of the first heating element and the second heating element includes a graphite heater.

5. The material deposition apparatus according to claim 1 , wherein the first heating assembly is configured to pre-heat the substrate.

6. The material deposition apparatus according to claim 1 , further comprising:

at least a second heating assembly disposed along the substrate transportation direction, the second heating assembly being configured to provide a second heating area for heating the substrate directly adjacent to the end point of the deposition area.

7. The material deposition apparatus according to claim 6 , the second heating assembly comprising:

a first heating element configured to provide a first heating zone having a first temperature; and

a second heating element configured to provide a second heating zone having a second temperature, the first temperature being different from the second temperature, the first heating element and the second heating element being individually controllable.

8. The material deposition apparatus according to claim 6 , wherein the second heating assembly is configured to post-heat the substrate.

9. The material deposition apparatus according to claim 1 , wherein a distance between the starting point of the deposition area and the first heating area and/or a distance between the end point of the deposition area and a second heating area are less than 1 cm, particularly less than 0.5 cm.

10. The material deposition apparatus according to claim 1 , the evaporation source assembly comprising

a first evaporation source having a first deposition area for depositing a first material onto the substrate and a second evaporation source having a second deposition area for depositing the first material or a second material onto the substrate.

11. The material deposition apparatus according to claim 10 , further comprising at least a second heating assembly disposed along the substrate transportation direction, wherein the first heating assembly and the second heating assembly are provided on opposite sides of the first and/or the second evaporation source along the substrate transportation direction.

12. The material deposition apparatus according to claim 1 , wherein the evaporation source includes one or more crucibles for material evaporation and a distributor with a plurality of nozzles for providing the evaporated material to the substrate.