IP Library Granted Patent US 12,211,656
Granted Patent B2
US 12,211,656 · App. 16/999,995 · Granted Jan 28, 2025

Photovoltaic structure and method of fabrication

Inventors: Lili Wang (Fremont, CA); Nadeem Haque (Fremont, CA); Jeong Chul Lee (Fremont, CA)
Assignee: Maxeon Solar Pte. Ltd.
H01G9/2072H01G9/0036H01G9/2009H01G9/2077H01G9/2095H01L31/0296H01L31/0304H01L31/0322H01L31/0326H01L31/035218H10K19/20H10K30/30H10K30/57H10K30/82H10K30/88H10K77/111H10K85/221
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Quick Facts
Patent No.
US 12,211,656
App. No.
16/999,995
Granted
Jan 28, 2025
Kind
B2
Abstract

A photovoltaic device includes one or more features that taken alone or in combination enhance its efficiency. Some embodiments may comprise a tandem solar device in which a top PV cell is fabricated upon a front transparent substrate, that also serves as the top encapsulating substance. The top PV cell including the front encapsulating substance is then bonded (e.g., using adhesive) to a bottom PV cell in order to complete the tandem device. Using the same transparent, insulating element as both front encapsulating substance and a substrate for fabricating the top PV cell, obviates to the need to provide a separate structure (with resulting interfaces) to perform the latter role. For tandem and non-tandem PV devices, a Through-Substrate-Via (TSV) structure may extend through an insulating substrate in order to provide contact with an opposite side (e.g., back electrode). Embodiments may find particular use in fabricating shingled perovskite photovoltaic solar cells.

Claims (18)

1. An apparatus comprising a four terminal tandem PV device comprising:

a first thin-film photovoltaic (PV) cell comprising:

a perovskite layer;

a first electrically insulating substrate disposed over a back side of the perovskite layer;

a first through substrate via (TSV) structure extending through the first electrically insulating substrate; and

an electrode extending through the first TSV structure to make electrical contact with the perovskite layer, the electrode covering only a portion of a back side of the first electrically insulating substrate; and

a second thin-film PV cell.

2. An apparatus as in claim 1 wherein the perovskite layer overlaps the second thin-film PV cell.

3. An apparatus as in claim 2 wherein the second thin-film PV cell comprises:

an active layer;

a top electrode layer;

a bottom electrode layer; and

at least one other layer selected from a transport layer, a passivation layer, a back-transfer blocking layer, and an in-situ barrier layer.

4. An apparatus as in claim 1 wherein the first electrically insulating substrate comprises glass.

5. An apparatus as in claim 4 wherein the glass has a thickness of between about 1 μm-3200 μm.

6. An apparatus as in claim 2 wherein the second thin-film PV cell is an Interdigitated Back Contact (IBC) solar cell.

7. An apparatus as in claim 1 wherein the first thin-film PV cell is an Interdigitated Back Contact (IBC) solar cell.

8. An apparatus as in claim 1 wherein the perovskite layer comprises halide perovskite.

Assignments (7)
SECURITY INTEREST Recorded Jun 27, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067924/0062 →
SECOND LIEN SECURITY INTEREST AGREEMENT Recorded Jun 26, 2024
From: MAXEON SOLAR PTE. LTD
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 071343/0553 →
SECURITY INTEREST Recorded Jun 5, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067637/0598 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 28, 2023
From: SOLARCA LLC
To: MAXEON SOLAR PTE. LTD.
Reel/Frame 066143/0222 →
MERGER AND CHANGE OF NAME Recorded Oct 19, 2023
From: SOLARIA CORPORATION (AKA THE SOLARIA CORPORATION); SOLARCA LLC
To: SOLARCA LLC
Reel/Frame 065286/0142 →
PARTIAL RELEASE OF SECURITY INTEREST IN PATENTS Recorded Oct 9, 2023
From: KLINE HILL PARTNERS FUND LP
To: SOLARCA, LLC
Reel/Frame 065191/0835 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2023
From: WANG, LILI; HAQUE, NADEEM; LEE, JEONG CHUL
To: SOLARIA CORPORATION
Reel/Frame 065159/0533 →