IP Library Granted Patent US 11,685,660
Granted Patent B2
US 11,685,660 · App. 17/000,552 · Granted Jun 27, 2023

Vapor deposition apparatus and techniques using high purity polymer derived silicon carbide

Inventor: Mark S. Land (Houston, TX)
Assignee: Pallidus, Inc.
C01B32/956C01B32/977C04B35/515C04B35/56C04B35/5603C04B35/571C04B35/80C08G77/20C08G77/50C08L83/04C23C14/0635C30B25/02C30B29/36C04B2235/3418C04B2235/3826C04B2235/3895C04B2235/44C04B2235/48C04B2235/483C04B2235/528C04B2235/5427C04B2235/5436C04B2235/6581C04B2235/72C04B2235/77C04B2235/94C04B2235/96C08G77/12C08G77/80
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Quick Facts
Patent No.
US 11,685,660
App. No.
17/000,552
Granted
Jun 27, 2023
Kind
B2
Abstract

Organosilicon chemistry, polymer derived ceramic materials, and methods. Such materials and methods for making polysilocarb (SiOC) and Silicon Carbide (SiC) materials having 3-nines, 4-nines, 6-nines and greater purity. Vapor deposition processes and articles formed by those processes utilizing such high purity SiOC and SiC.

Claims (46)

1. A method of making boule for the production of a 4H N-Type silicon carbide wafer, having a diameter of from about 6 inches to about 10 inches, the wafer characterized with properties comprising:

type/dopant:N/nitrogen;

orientation:<0001>4.0°±0.5°;

thickness: about 300 to about 800 μm; and,

micropipe density of <1 cm −2 ; and,

the method comprising the steps of: forming a vapor of a polymer derived ceramic SiC starting material, wherein the polymer derived ceramic SiC starting material has a purity of at least about 6 nines, and is oxide layer free; depositing the vapor on a seed crystal to form a boule; and providing the boule to a wafer manufacturing process.

2. The method of claim 1 , wherein the wafer is further characterized with a property comprising RT 0.02-0.2 Ω·cm.

3. The method of claim 2 wherein the wafer manufacturing process produces a wafer having improved features, when compared to a wafer made from a non-polymer derived SiC material.

4. The method of claim 1 , wherein the wafer is further characterized with a property comprising RT 0.01-0.1 Ω·cm.

5. The method of claim 4 wherein the wafer manufacturing process produces a wafer having improved features, when compared to a wafer made from a non-polymer derived SiC material.

6. The method of claim 1 , wherein the wafer is further characterized with a property comprising RT: 0.1-40 Ω·cm.

7. The method of claim 6 wherein the wafer manufacturing process produces a wafer having improved features, when compared to a wafer made from a non-polymer derived SiC material.

8. The methods of claim 1 , 2 , 4 or 6 , wherein the seed crystal comprises a polymer derived ceramic SiC.

9. The method of claim 1 wherein the wafer manufacturing process produces a wafer having improved features, when compared to a wafer made from a non-polymer derived SiC material.

10. The methods of claim 9 , 3 , 5 or 7 , wherein the improved features are selected from the group consisting of bow, edge contour, flatness, focal plane, warp and site flatness.

11. A method of making a 4H silicon carbide wafer, the method comprising the steps of forming a vapor of a polymer derived ceramic SiC, the polymer derived ceramic having a purity of at least about 6 nines, and being oxide layer free, depositing the vapor on a seed crystal to form a boule, and providing the boule to a wafer manufacturing process, wherein the boule has a diameter of from about 6 inches to about 10 inches.

12. The method of claim 11 , wherein the seed crystal comprises a polymer derived ceramic 4H SiC.

13. The method of claim 11 , wherein the wafer manufacturing process produces a wafer having improved features, when compared to a wafer made from a non-polymer derived SiC material, the improved features selected from the group consisting of bow, edge contour, flatness, focal plane, warp and site flatness.

14. A method of making boule for the production of a 4H N-Type silicon carbide wafer, having a diameter of from about 4 inches to about 10 inches, the wafer characterized with properties comprising:

type/dopant:N/nitrogen;

orientation:<0001>4.0°±0.5°;

thickness: about 300 to about 800 μm; and,

micropipe density of <1 cm −2 ; and,

RT:0.01-40 Ω·cm; and,

Bow/Warp/TTV<45 μm;

the method comprising the steps of: forming a vapor of a polymer derived ceramic SiC starting material; wherein the polymer derived ceramic SiC starting material has a purity of at least about 6 nines; depositing the vapor on a seed crystal to form a boule; and providing the boule to a wafer manufacturing process.

15. The method of claim 14 , wherein the seed crystal is polymer derived ceramic SiC.

16. The methods of claim 14 , wherein the RT is 0.1-40 Ω·cm.

17. The methods of claim 14 , wherein the RT is 0.02-0.2 Ω·cm.

18. The methods of claim 14 , 15 , 16 , or 17 , wherein the Bow/Warp/TTV is <35 μm.

19. The methods of claim 14 , 15 , 16 , or 17 , wherein the Bow/Warp/TTV is <25 μm.

20. A method of making boule for the production of a 4H N-Type silicon carbide wafer, having a diameter of from about 8 inches to about 12 inches, the wafer characterized with properties comprising:

type/dopant:N/nitrogen;

orientation:<0001>4.0°±0.5°;

thickness: about 300 to about 800 μm; and,

micropipe density of <1 cm −2 ; and,

the method comprising the steps of: forming a vapor of a polymer derived ceramic SiC starting material, wherein the polymer derived ceramic SiC starting material has a purity of at least about 6 nines, and is oxide layer free; depositing the vapor on a seed crystal to form a boule; and providing the boule to a wafer manufacturing process.

21. A method of making a 4H silicon carbide wafer, the method comprising the steps of forming a vapor of a polymer derived ceramic SiC, the polymer derived ceramic having a purity of at least about 6 nines, and being oxide layer free, depositing the vapor on a seed crystal to form a boule, and providing the boule to a wafer manufacturing process, wherein the boule has a diameter of from about 8″ to about 12″.

22. A method of making boule for the production of a 4H N-Type silicon carbide wafer, having a diameter of from about 8 inches to about 12 inches, the wafer characterized with properties comprising:

type/dopant:N/nitrogen;

orientation:<0001>4.0°±0.5°;

thickness: about 300 to about 800 μm; and,

micropipe density of <1 cm −2 ; and,

RT:0.01-40 Ω·cm; and,

Bow/Warp/TTV<45 μm;

the method comprising the steps of: forming a vapor of a polymer derived ceramic SiC starting material; wherein the polymer derived ceramic SiC starting material has a purity of at least about 6 nines; depositing the vapor on a seed crystal to form a boule; and providing the boule to a wafer manufacturing process.

Assignments (2)
SECURITY INTEREST Recorded Jan 10, 2025
From: PALLIDUS, INC.
To: R&R PALLIDUS HOLDINGS II LLC, AS ADMINISTRATIVE AGENT
Reel/Frame 069818/0486 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2023
From: LAND, MARK S.
To: PALLIDUS, INC.
Reel/Frame 063841/0057 →
Continuity (6)
Continuation 15275055 · Sep 23, 2016
Continuation In Part 14864125 · Sep 24, 2015
Provisional Application 62232355 · Sep 24, 2015
Provisional Application 62055461 · Sep 25, 2014
Provisional Application 62055497 · Sep 25, 2014
Related Publication 20210047188A1 · Feb 18, 2021
Cited By (1)
US 12,617,686