Electrical contact between electrically conducting polymer coated wires and electrically conducting substrates using wire bonding

1. A connection unit comprising:

a.) a substrate, wherein the substrate comprises:

i. an insulating layer that is electrically insulating, and

ii. a first conducting region that is electrically conducting;

b.) a first positioning wire;

c.) a conducting wire, wherein

i. the conducting wire comprises a first longitudinal portion,

ii. in a first cross-sectional cut of the first longitudinal portion, the first cross-sectional cut comprises the following layers, in this order:

A) an outer layer that is electrically conducting,

B) an intermediate layer that is electrically insulating,

C) an inner metal core that is electrically conducting,

D) the intermediate layer, and

E) the outer layer;

iii. the first longitudinal portion is located between the substrate and the first positioning wire, such that

A) the first longitudinal portion at least partially overlaps the first conducting region,

B) the first positioning wire is arranged transverse to the first longitudinal portion, and

C) the first longitudinal portion is in electrical contact with both, and touches both

I. the first conducting region, and

II. the first positioning wire;

and

wherein, in a second cross-sectional cut of the connection unit, taken at the position of the first longitudinal portion, the second cross sectional cut comprises the following layers, in this order:

a.) the first positioning wire,

b.) the first longitudinal portion, and

c.) the substrate;

wherein the outer layer comprises at least 10 wt. %, based on the total weight of the outer layer, of an organic material.

2. The connection unit according to claim 1 , wherein

a.) the substrate comprises a second conducting region that is electrically conducting;

b.) the conducting wire comprises a second longitudinal portion, wherein, in a third cross-sectional cut of the second longitudinal portion, the third cross-sectional cut comprises the inner metal core;

c.) the connection unit comprises a second positioning wire, and

d.) the second longitudinal portion is located between the substrate and the second positioning wire, such that

A) the second longitudinal portion at least partially overlaps the second conducting region,

B) the second positioning wire is arranged transverse to the second longitudinal portion,

C) the second longitudinal portion is in electrical contact with both, and touches both

I. the second conducting region, and

II. the second positioning wire;

and

wherein, in a fourth cross-sectional cut of the connection unit, taken at the position of the second longitudinal portion, the fourth cross sectional cut comprises the following layers, in this order:

a.) the second positioning wire,

b.) the second longitudinal portion,

c.) the substrate.

3. The connection unit according to claim 1 , wherein the organic material is a polymer.

4. The connection unit according to claim 1 , wherein the organic material is a polymer selected form the group consisting of I.) a mixture comprising an electrically insulating polymer and a plurality of particles that comprises a metal or a metal compound, or a combination thereof, II.) a conductive polymer, or III.) a combination thereof.

5. The connection unit according to claim 1 , wherein the outer layer comprises 50 wt. %, based on the total weight of the outer layer, of a metal or a metal compound, or a combination thereof.

6. The connection unit according to claim 1 , wherein the outer layer has at least one or all of the following properties:

a.) a thickness in the range of 6 μm to 24 μm;

b.) an electrical conductivity in the range of 10 −8 S/m to 2×10 −2 S/m; and

c.) a Young's modulus in the range of 0.01 MPa to 100 MPa.

7. The connection unit according to claim 1 , wherein the first positioning wire, or a second positioning wire, or both, has, independent of each other, at least one or all of the following properties:

a.) comprises one or more metals;

b.) a thickness in the range of 5 μm to 350 μm;

c.) a length in the range of 0.1 mm to 50 mm; and

d.) an electrical conductivity in the range of 10 4 S/m to 10 8 S/m.

8. The connection unit according to claim 1 , wherein the first conducting region, or a second conducting region, or both, has, independent of each other, at least one or all of the following properties:

a.) comprises a metal;

b.) has a metal plating finish;

c.) a thickness in the range of 1.5 mm to 4.5 mm;

d.) a length in the range of 0.2 mm to 1.2 mm; and

e.) an electrical conductivity in the range of 10 5 S/m to 10 10 S/m.

9. An electronic device comprising a further electronic element that is in electrical contact with a connection unit according to claim 1 .

10. The electronic device according to claim 9 , wherein the electronic device is selected from the group consisting of continuous glucose monitors, electrocardiographs, electromyographs, and electroencephalogram devices.

11. A method for producing a connection unit comprising:

a.) providing a first positioning wire, a substrate, and a conducting wire, wherein

i. the substrate comprises a first conducting region, and

ii. the conducting wire comprises a first longitudinal portion, wherein the first longitudinal portion comprises an outer layer;

b.) arranging the first positioning wire, the substrate, and the first longitudinal portion, such that

i. the first longitudinal portion is located between the substrate and the first positioning wire,

ii. the first longitudinal portion at least partially overlaps the first conducting region,

iii. the first positioning wire is transverse to the first longitudinal portion,

iv. the first longitudinal portion is in electrical contact with both, and touches both

A) the first conducting region, and

B) the first positioning wire; and

v. a distance D 1 between the first positioning wire and the substrate is equal to an initial thickness D LP1 of the first longitudinal portion; and

c.) reducing the distance D 1 between the first positioning wire and the substrate, such that

i. D 1 <D LP1 ,

ii. the outer layer of the first longitudinal portion is deformed, and

iii. the first positioning wire exerts a mechanical force on the first longitudinal portion.

12. The method according to claim 11 , wherein

a.) the substrate comprises a second conducting region, and

b.) the conducting wire comprises a second longitudinal portion, wherein the second longitudinal portion comprises an inner metal core,

and wherein the method comprises the following steps:

a.) providing a second positioning wire;

b.) arranging the second positioning wire, the substrate, and the second longitudinal portion, such that

i. the second longitudinal portion is located between the substrate and the second positioning wire,

ii. the second longitudinal portion at least partially overlaps the second conducting region,

iii. the second positioning wire is transverse to the second longitudinal portion,

iv. the second longitudinal portion is in electrical contact with both, and touches both

A) the second conducting region, and

B) the second positioning wire; and

v. a distance D 2 between the second positioning wire and the substrate is equal to an initial thickness D LP2 of the second longitudinal portion, such that the second positioning wire exerts a mechanical force on the second longitudinal portion.

13. The method according to claim 11 , wherein a first force is applied to the first positioning wire, or a second positioning wire, or both.

14. The method according to claim 13 , wherein the distance D 1 , or a distance D 2 , or both, is reduced by removing the first force.

15. The method according to claim 13 , wherein the strength of the first force, or a second force, or both, is, independent of each other, in the range of 0.5 N to 15 N.

16. The method according to claim 11 , wherein a second force is applied to the first positioning wire, or a second positioning wire, or both.

17. The method according to claim 16 wherein the distance D 1 , or a distance D 2 , or both, is reduced by applying the second force.

18. A connection unit obtainable by a method according to claim 11 .