Optical module
An optical module includes a housing, a heat sink apparatus arranged in and thermally connected to the housing, and a printed circuit board partially arranged on the heat sink apparatus. The optical module further includes a first optoelectronic chip and a second optoelectronic chip that are both arranged on the heat sink apparatus. The first optoelectronic chip and second optoelectronic chip are both electrically connected to the printed circuit board. The printed circuit board has a first surface, a second surface opposite to the first surface, and an opening that extends from the first surface to the second surface. The second optoelectronic chip is arranged at the opening. The second optoelectronic chip is arranged separately from the first optoelectronic chip.
1. An optical module, comprising:
a housing;
a heat sink apparatus arranged in and thermally connected to the housing; and
a printed circuit board partially arranged in the heat sink apparatus and adhered on the heat sink apparatus,
wherein
the optical module further comprises a first optoelectronic chip and a second optoelectronic chip that are both arranged on the heat sink apparatus,
the first optoelectronic chip and second optoelectronic chip are both electrically connected to the printed circuit board,
the second optoelectronic chip is arranged separately from the first optoelectronic chip,
the printed circuit board has an external electrical interface, for realizing external electrical connections, arranged at an end of the printed circuit board, the external electrical interface including gold fingers,
the first optoelectronic chip is arranged near one end of the printed circuit board opposite to the end of the printed circuit where the gold fingers are arranged,
at least a portion of the first optoelectronic chip is arranged outside of the printed circuit board and does not overlap with the printed circuit board.
2. The optical module according to claim 1 , wherein
the heat sink apparatus comprises a first heat sink and a second heat sink,
the first optoelectronic chip is arranged on the first heat sink, and
the second optoelectronic chip is arranged on the second heat sink.
3. The optical module according to claim 2 , wherein the first heat sink and the second heat sink form an integrated single structure.
4. The optical module according to claim 2 ,
wherein the housing includes a first housing and a second housing facing each other and connected to each other,
the heat sink apparatus being arranged between the first housing and the second housing and thermally connected to the second housing,
the first heat sink has a base and a first protruding platform protruding towards the first housing,
the first optoelectronic chip is arranged on the first protruding platform.
5. The optical module according to claim 1 , wherein
the first optoelectronic chip and the second optoelectronic chip are arranged on opposite sides of the heat sink apparatus.
6. The optical module according to claim 1 , wherein
the optical module comprises an optical interface and an electrical interface,
positions of the first optoelectronic chip and the second optoelectronic chip are staggered along a direction of a line connecting the optical interface and the electrical interface.
7. The optical module according to claim 1 , wherein the heat sink apparatus has a hole or a groove to allow light to pass through.
8. The optical module according to claim 1 , wherein the first optoelectronic chip is a transmitting-end chipset, and the second optoelectronic chip is a receiving-end chipset.
9. The optical module according to claim 1 , wherein
the heat sink apparatus has an L-shape, the L-shape heat sink apparatus extends parallel to a surface of the printed circuit board.
10. The optical module according to claim 1 , wherein the optical module comprises a first electrical isolation pad; the first electrical isolation pad is arranged between the first optoelectronic chip and the heat sink apparatus; and the first electrical isolation pad is thermally connected to and electrically isolated from the heat sink apparatus.
11. An optical module, comprising:
a housing;
a heat sink apparatus arranged in and thermally connected to the housing; and
a printed circuit board partially arranged on the heat sink apparatus,
wherein
the optical module further comprises a first optoelectronic chip and a second optoelectronic chip, the first optoelectronic chip being arranged on the heat sink apparatus,
the first optoelectronic chip and second optoelectronic chip are both electrically connected to the printed circuit board,
the second optoelectronic chip is arranged separately from the first optoelectronic chip,
the printed circuit board has an external electrical interface, for realizing external electrical connections, arranged at an end of the printed circuit board, the external electrical interface including gold fingers,
the housing includes a first housing and a second housing facing each other and connected to each other,
the heat sink apparatus is arranged between the first housing and the second housing and thermally connected to the second housing,
the heat sink apparatus comprises a first heat sink and a second heat sink,
the first heat sink has a base and a first protruding platform protruding towards the first housing,
the first optoelectronic chip is arranged on the first protruding platform, and
the heat sink apparatus has a hole or a groove to allow light to pass through.
12. The optical module according to claim 11 , wherein
the first optoelectronic chip is arranged on the first heat sink, and
the second optoelectronic chip is arranged on the second heat sink.
13. The optical module according to claim 12 , wherein the first heat sink and the second heat sink form an integrated single structure.
14. The optical module according to claim 12 , wherein the printed circuit board is adhered on the heat sink apparatus.
15. The optical module according to claim 11 , wherein
the first optoelectronic chip and the second optoelectronic chip are arranged on opposite sides of the heat sink apparatus.
16. The optical module according to claim 11 , wherein
the optical module comprises an optical interface and an electrical interface,
positions of the first optoelectronic chip and the second optoelectronic chip are staggered along a direction of a line connecting the optical interface and the electrical interface.
17. The optical module according to claim 11 , wherein the first optoelectronic chip is a transmitting-end chipset, and the second optoelectronic chip is a receiving-end chipset.
18. The optical module according to claim 11 , wherein
the heat sink apparatus has an L-shape, the L-shape heat sink apparatus extends parallel to a surface of the printed circuit board.
19. The optical module according to claim 11 , wherein the optical module comprises a first electrical isolation pad; the first electrical isolation pad is arranged between the first optoelectronic chip and the heat sink apparatus; and the first electrical isolation pad is thermally connected to and electrically isolated from the heat sink apparatus.
20. An optical module, comprising:
a housing;
a heat sink apparatus arranged in and thermally connected to the housing; and
a printed circuit board partially arranged on the heat sink apparatus,
wherein
the optical module further comprises a first optoelectronic chip and a second optoelectronic chip, the first optoelectronic chip being arranged on the heat sink apparatus,
the first optoelectronic chip and second optoelectronic chip are both electrically connected to the printed circuit board,
the second optoelectronic chip is arranged separately from the first optoelectronic chip,
the printed circuit board has an external electrical interface, for realizing external electrical connections, arranged at an end of the printed circuit board, the external electrical interface including gold fingers,
the housing includes a first housing and a second housing facing each other and connected to each other,
the heat sink apparatus is arranged between the first housing and the second housing and thermally connected to the second housing,
the heat sink apparatus comprises a first heat sink and a second heat sink,
the first heat sink has a base and a first protruding platform protruding towards the first housing,
the first optoelectronic chip is arranged on the first protruding platform, and
the heat sink apparatus has an L-shape, the L-shape heat sink apparatus extends parallel to a surface of the printed circuit board.