Package structure and manufacturing method thereof
A package structure and a manufacturing method thereof are provided. The package structure includes a circuit board, a barrier structure and a molding layer. The circuit board includes a substrate and a component disposed on the substrate. The substrate includes a molding area and a non-molding area, and the component is disposed on the molding area. The barrier structure is disposed on the substrate and located between the molding area and the non-molding area. The barrier structure has a first predetermined height. The molding layer is disposed on the molding area and covers the component. The molding layer has a second predetermined height. The first predetermined height of the barrier structure is less than or equal to the second predetermined height of the molding layer.
1. A package structure, comprising:
a circuit board including a substrate and a component disposed on the substrate, wherein the substrate includes a molding area and a non-molding area, the component is disposed on the molding area of the substrate, and the substrate includes a first side surface, a second side surface and a third side surface connected between the first side surface and the second side surface;
a barrier structure disposed on the substrate and located between the molding area and the non-molding area, wherein the barrier structure has a first predetermined height; and
a molding layer disposed on the molding area of the substrate and covering the component, wherein the molding layer has a second predetermined height, which is greater than or equal to the first predetermined height, the molding layer includes a first side face, a second side face, a third side face connected between the first side face and the second side face, and a fourth side face connected between the first side face and the second side face, and the fourth side face corresponds to the third side face;
wherein the first side surface, the second side surface and the third side surface are respectively flush with the first side face, the second side face and the third side face, and the barrier structure abuts against the fourth side face;
wherein the first predetermined height is less than the second predetermined height, the second predetermined height decreases from the third side face toward the fourth side face, and the closer to the barrier structure, the second predetermined height of the molding layer is lesser; and
wherein the molding layer includes a top face, the top face is connected between the first side face, the second side face, the third side face and the fourth side face, and a top surface of the molding layer is arced or curved to form a sloped top face.
2. The package structure according to claim 1 , wherein the first predetermined height is greater than one third of the second predetermined height.
3. The package structure according to claim 1 , wherein the barrier structure is made of a material different from a material of the molding layer.
4. The package structure according to claim 1 , wherein the barrier structure abuts against the fourth side face and is not in contact with the third side face.
5. The package structure according to claim 1 , wherein the barrier structure includes a first end face, a second end face corresponding to the first end face and an abutment face connected between the first end face and the second end face, and the abutment face abuts against the fourth side face, and wherein the first end face and the second end face are flush with the first side surface and the second side surface, respectively.
6. The package structure according to claim 1 , wherein the circuit board further includes a member disposed on the non-molding area of the substrate.