UV fixing glue for assembly
One aspect relates to a method of manufacture of an electronic assembly comprising at least these steps: providing a substrate having at least a first contact area; positioning a spot of a UV curable substance on the substrate; positioning an electrically conductive item on the substrate wherein the electrically conductive item is superimposed on the first contact area and on the spot of curable substance; exposing the UV curable substance to UV irradiation, wherein a mechanical connection between the electrically conductive item and substrate is formed; and optionally connecting the first contact area with the electrically conductive item. One aspect relates to an electronic assembly comprising a substrate with a contact area, a spot of a cured substance on the substrate and an electrically conductive item that is in electrically conductive connection with the first contact area and mechanically connected through the spot of cured substance to the substrate.
1. A method of manufacture of an electronic assembly comprising the following steps in the following sequence:
(i) providing a substrate having at least a first contact area;
(ii) positioning a spot of a UV curable substance on the substrate;
(iii) positioning an electrically conductive item on the substrate wherein the electrically conductive item is superimposed on the first contact area and on the spot of UV curable substance;
(iv) exposing the spot of UV curable substance to UV irradiation, wherein a mechanical connection between the electrically conductive item and substrate is formed; and
(v) electrically connecting the first contact area with the electrically conductive item.
2. The method according to claim 1 , wherein the positioning of the electrically conductive item on the substrate in (iii) is performed using a gripper.
3. The method according to claim 1 , wherein the UV curable substance is selected from a group consisting of methacrylate esters, modified acrylic polymers and acrylated urethane.
4. The method according to claim 1 , wherein the positioning is automated.
5. The method according to claim 1 , wherein the electrically conductive item is selected from a group consisting of a wire, a stranded wire, a sheet of metal, a sheet of an alloy and a composite.
6. The method according to claim 1 , wherein the electrically conductive connection is formed by soldering of solder or applying a conductive adhesive.