Electronic power package and heat sink/cold rail arrangement
An automotive power package includes a heat sink layer fabricated onto at least one surface of the automotive power package. The heat sink layer includes a material having a thermal conductivity higher than 130 W/m-K and a coefficient of thermal expansion between 5 and 15 ppm/° C.
1. An automotive power package including a ceramic power package, a first heat sink layer, and a second heat sink layer,
the first heat sink layer being fabricated onto a first surface of said ceramic power package of the automotive power package, the first heat sink layer including a first layer comprising aluminum silicon carbide (AlSiC), and the first layer being fabricated to the first surface of said ceramic power package of the automotive power package by a first bonding layer or thermal interface material,
the second heat sink layer being fabricated onto a second surface of said ceramic power package of the automotive power package, the second heat sink layer being fabricated to the second surface of said ceramic power package of the automotive power package by a second bonding layer or thermal interface material, and
said first heat sink layer comprising a material having a thermal conductivity higher than 130 W/m-K, and a coefficient of thermal expansion between 5 and 15 ppm/° C.
2. The automotive power package as claimed in claim 1 , wherein said coefficient of thermal expansion is between 6 and 11 ppm/° C.
3. The automotive power package as claimed in claim 1 , wherein said thermal conductivity is higher than 165 W/m-K.
4. The automotive power package as claimed in claim 1 , wherein said AlSiC is formed by fusing aluminum with silicon carbide.
5. The automotive power package as claimed in claim 1 , further comprising a third heat sink layer including molybdenum/copper alloy, tungsten/copper alloy, molybdenum, tungsten, or alloys of molybdenum, tungsten or copper distal to said ceramic power package.
6. The automotive power package as claimed in claim 1 , wherein said first heat sink layer has a stiffness greater than 26 GPa·cm 3 /g.
7. An automotive power package including a ceramic power package and two heat sink layers, the two heat sink layers being fabricated onto two respective surfaces of said ceramic power package, said heat sink layers each including a first heat sink layer comprising of aluminum silicon carbide (AlSiC) and being bonded to the ceramic power package by a thin bonding or thermal interface material, said heat sink layers comprising a material having a thermal conductivity higher than 130 W/m-K, and a coefficient of thermal expansion between 5 and 15 ppm/° C.
8. The automotive power package as claimed in claim 7 , wherein said coefficient of thermal expansion is between 6 and 11 ppm/° C.
9. The automotive power package as claimed in claim 7 , wherein said heat sink layers include a second heatsink layer, said second heat sink layer being comprised of different material fabricated onto said first heat sink layer, distal to said ceramic power package.
10. A method of fabricating an automotive power package including a ceramic power package and two heat sink layers, the method comprising:
fabricating a first heat sink layer onto a first surface of said ceramic power package, said first heat sink layer comprising a first layer comprising aluminum silicon carbide (AlSiC) that is bonded to the first surface of the ceramic power package by a first bonding or thermal interface material, and
fabricating a second heat sink layer onto a second surface of said ceramic power package that is bonded to the second surface of the ceramic power package by a second bonding layer or thermal interface material,
wherein the AlSiC has a thermal conductivity greater than 130 W/m-K and a coefficient of thermal expansion between 5 and 15 ppm/° C.
11. The method as claimed in claim 10 , the method further comprising fabricating a third heat sink layer including molybdenum/copper alloy, tungsten/copper alloy, molybdenum, tungsten, or alloys of molybdenum, tungsten or copper.
12. The method as claimed in claim 11 , wherein the third heat sink layer comprises substantially of aluminum or copper.
13. The method as claimed in claim 10 , wherein said AlSiC is formed by fusing aluminum with silicon carbide.
14. The method as claimed in claim 13 , wherein said AlSiC is formed by fusion of molten aluminum with silicon carbide.