Transponder chip module with module antenna(s) and coupling frame(s)
A capacitive coupling enhanced (CCE) transponder chip module (TCM) comprises an RFID chip (CM, IC), optionally contact pads (CP), a module antenna (MA), and a coupling frame (CF), all on a common substrate or module tape (MT). The coupling frame (CF, 320 A) may be in the form of a ring, having an inner edge (IE), an outer edge IE, 324 ) and a central opening (OP), disposed closely adjacent to and surrounding the module antenna (MA). A slit (S) may extend from the inner edge (IE) to the outer edge (OE) of the coupling frame (CF) so that the coupling frame (CF) is “open loop”. An RFID device may comprise a transponder chip module (TCM) having a module antenna (MA), a device substrate (DS), and an antenna structure (AS) disposed on the device substrate (DS) and connected with the module antenna (MA). A portion of a conductive layer (CL, 904 ) remaining after etching a module antenna (MA) may be segmented to have several smaller isolated conductive structures.
1. A module tape (MT) for a transponder chip module (TCM) comprising:
at least one module antenna (PA) disposed on the module tape;
and at least one coupling frame (CF) disposed on the module tape, each coupling frame having an opening (OP) defined by an inner edge (IE), an outer edge (OE) and a discontinuity comprising a slit (S) or a non-conductive stripe extending from the opening to the outer edge.
2. The module tape of claim 1 comprising two module antennas (PA-1, PA-2).
3. The module tape of claim 2 , wherein:
the two module antennas are planar antennas (PA-1, PA-2).
4. The module tape of claim 2 , wherein:
one of the two module antennas is disposed on one side of the module tape; and
the other of the two module antennas is disposed on an opposite side of the module tape.
5. The module tape of claim 1 , wherein:
at least one module antenna comprises a number of tracks separated by spaces;
a track width is equal to or less than 100 μm; and
a spacing between adjacent tracks is less than 75 μm.
6. The module tape of claim 1 comprising two coupling frames (CF-1, CF-2).
7. The module tape of claim 6 , wherein:
one of the two coupling frames is disposed on a face-up side of the module tape; and
the other of the two coupling frames is disposed on a face-down side of the module tape.
8. The module tape of claim 1 , further comprising:
a capacitor (CAP) connected with the at least one module antenna.
9. The module tape of claim 1 , wherein:
the at least one coupling frame is disposed around the at least one module antenna with its opening surrounding the module antenna and closely adjacent thereto.
10. The module tape of claim 1 , wherein:
one of the at least one coupling frames overlaps at least a portion of one of the at least one module antennas.
11. The module tape of claim 1 , further comprising contact pads (CP).
12. The module tape of claim 11 , wherein:
a conductive layer (CL) disposed on at least one side of the module tape is used to form the contact pads and at least one of (i) the at least one module antenna, and (ii) the at least one coupling frame.
13. The module tape of claim 1 , wherein:
the at least one coupling frame comprises wire embedded in the module tape.
14. A transponder chip module (TCM) comprising:
the module tape of claim 1 ; and
an RFID chip (IC) disposed on the module tape.
15. The transponder chip module of claim 14 , wherein:
the at least one coupling frame has a geometry defined by a shape of its outer edge which is different than a geometry of the transponder chip module.