IP Library Granted Patent US 11,088,027
Granted Patent B2
US 11,088,027 · App. 17/011,270 · Granted Aug 10, 2021

Transistor structure

Inventors: Shih-Yin Hsiao (Chiayi County, TW); Ching-Chung Yang (Hsinchu, TW); Kuan-Liang Liu (Hsinchu County, TW)
Assignee: UNITED MICROELECTRONICS CORP.
H01L21/823425H01L21/8249H01L21/823437H01L27/0251H01L29/0607H01L29/4238H01L29/42368H01L29/4925H01L29/7832H01L29/7835H01L29/78
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Quick Facts
Patent No.
US 11,088,027
App. No.
17/011,270
Granted
Aug 10, 2021
Kind
B2
Abstract

A transistor structure includes a source region and a drain region disposed in a substrate, extending along a first direction. A polysilicon layer is disposed over the substrate, extending along a second direction perpendicular to the first direction, wherein the polysilicon layer includes a first edge region, a channel region and a second edge region formed as a gate region between the source region and the drain region in a plane view. The polysilicon layer has at least a first opening pattern at the first edge region having a first portion overlapping with the gate region; and at least a second opening pattern at the second edge region having a second portion overlapping with the gate region.

Claims (14)

1. A transistor structure, comprising:

a source region and a drain region disposed in a substrate and extend along a first direction; and

a polysilicon layer, disposed over the substrate and extending along a second direction perpendicular to the first direction, wherein the polysilicon layer comprises a gate region between the source region and the drain region in a plane view, the gate region along the second direction sequentially has a first edge region, a channel region and a second edge region,

wherein the first edge region has a first opening pattern and the second edge region has a second opening pattern, the first opening pattern is asymmetric to the second opening pattern in locations of openings, or in a number of openings, or in an area occupied by openings,

wherein a portion of the substrate right under the source region, the drain region and the gate region is a single conductivity type.

2. The transistor structure of claim 1 , wherein the channel region is larger than the first edge region and the second edge region along the second direction.

3. The transistor structure of claim 1 ,

wherein the first opening pattern and the second opening pattern comprise parts of first and second opening structures extending in the polysilicon layer beyond the gate region,

wherein the first opening pattern comprises at least one first opening, disposing over and between the source region and the drain region,

wherein the second opening pattern comprises at least one second opening, disposing over and between the source region and the drain region,

wherein the first opening pattern and the second opening pattern are not distributed into the channel region.

4. The transistor structure of claim 3 , wherein the at least one first opening and the at least one second opening are different in opening area.

5. The transistor structure of claim 3 , wherein the at least one first opening is different in the number of openings to the at least one second opening.

6. The transistor structure of claim 3 , wherein the at least one first opening is a single open at a center location between the source region and the drain region along the first direction, and the at least one second opening comprises two opens between the source region and the drain region at the first direction and one of the two opens is closer to the source region and another one is closer to the drain region.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2020
From: HSIAO, SHIH-YIN; YANG, CHING-CHUNG; LIU, KUAN-LIANG
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 053685/0721 →
Priority Claims (1)
TW 106135221 · Oct 13, 2017 · national
Continuity (3)
Continuation 16428651 · May 31, 2019
Continuation 15813945 · Nov 15, 2017
Related Publication 20200402857A1 · Dec 24, 2020