Hybrid pinning package for radio frequency filters
Disclosed is a device and methods for making same. In one aspect, a device includes a package having at least four pins, and, within the package, a die that includes a filter circuit electrically coupled to the four pins. The filter can: receive, from a first pin, an input signal comprising first and second frequency components, produce, at a second pin, a first output signal of the first frequency component, and produce, at a third and fourth pin, a second output signal of the second frequency component; and/or receive, from a second pin, a first input signal comprising the first frequency component, receive, from a third or fourth pin, a second input signal comprising the second frequency component, and produce, at a first pin, an output signal comprising the first and second frequency components. The second pin is interposed between the third and fourth pins on the package.
1. A device, comprising:
a package having at least a first pin, a second pin, a third pin, and a fourth pin; and
a die, disposed within the package, that comprises a filter circuit that is electrically coupled to the first pin, the second pin, the third pin, and the fourth pin, and that is operable to:
receive, from the first pin, an input signal comprising a first frequency component and a second frequency component; produce, at the second pin, a first output signal comprising the first frequency component; and produce, at the third pin and at the fourth pin, a second output signal comprising the second frequency component; and/or
receive, from the second pin, a first input signal comprising the first frequency component; receive, from the third pin or the fourth pin, a second input signal comprising the second frequency component; and produce, at the first pin, an output signal comprising the first frequency component and the second frequency component; and
wherein the second pin is interposed between the third pin and the fourth pin on the package.
2. The device of claim 1 , wherein:
the filter circuit is electrically coupled to the second pin via a first conductor; and
the filter circuit is electrically coupled to the third pin and the fourth pin via a second conductor.
3. The device of claim 2 , wherein the first conductor crosses over or under the second conductor using a crossover structure comprising an insulation layer that electrically isolates the first conductor from the second conductor within the crossover structure.
4. The device of claim 3 , wherein the die comprises the crossover structure.
5. The device of claim 3 , wherein the package comprises the crossover structure.
6. The device of claim 1 , wherein the filter circuit comprises a surface acoustic wave (SAW) device.
7. The device of claim 1 , wherein the filter circuit comprises a bulk acoustic wave (BAW) device.
8. The device of claim 1 , wherein the filter circuit comprises an inductor and capacitor (LC) circuit.
9. The device of claim 1 , wherein the filter circuit is bidirectional.
10. A method for fabricating a device, the method comprising:
providing a package having at least a first pin, a second pin, a third pin, and a fourth pin; and
providing a die, disposed within the package, that comprises a filter circuit that is electrically coupled to the first pin, to the second pin, to the third pin, and to the fourth pin, and that is operable to:
receive, from the first pin, an input signal comprising a first frequency component and a second frequency component; produce, at the second pin, a first output signal comprising the first frequency component; and produce, at the third pin and at the fourth pin, a second output signal comprising the second frequency component; and/or
receive, from the second pin, a first input signal comprising the first frequency component; receive, from the third pin or the fourth pin, a second input signal comprising the second frequency component; and produce, at the first pin, an output signal comprising the first frequency component and the second frequency component; and
wherein the second pin is interposed between the third pin and the fourth pin on the package.
11. The method of claim 10 , wherein:
the filter circuit is electrically coupled to the second pin via a first conductor; and
the filter circuit is electrically coupled to the third pin and the fourth pin via a second conductor.
12. The method of claim 11 , wherein the first conductor crosses over or under the second conductor using a crossover structure comprising an insulation layer that electrically isolates the first conductor from the second conductor within the crossover structure.
13. The method of claim 12 , wherein the die comprises the crossover structure.
14. The method of claim 12 , wherein the package comprises the crossover structure.
15. The method of claim 10 , wherein the filter circuit comprises a surface acoustic wave (SAW) device.
16. The method of claim 10 , wherein the filter circuit comprises a bulk acoustic wave (BAW) device.
17. The method of claim 10 , wherein the filter circuit comprises an inductor and capacitor (LC) circuit.
18. The method of claim 10 , wherein the filter circuit is bidirectional.