Sealed radiation detector module systems and methods

1. A radiation detector module comprising:

a metallic and/or metalized enclosure;

a radiation sensor disposed within the enclosure;

readout electronics configured to provide radiation detection event signals corresponding to incident ionizing radiation in the radiation sensor; and

a cap comprising an internal interface configured to couple to the readout electronics and an external interface configured to couple to a radiation detector, wherein the cap is configured to hermetically seal the radiation sensor within the enclosure, and wherein the cap comprises an edge plated printed circuit board (PCB) comprising:

a slot configured to mate with a planar edge of an open surface of the enclosure, wherein the slot of the cap is soldered to the planar edge of the enclosure to hermetically seal the radiation sensor within the enclosure; and

a via structure formed through the edge plated PCB and configured to electrically couple the external interface of the cap to the internal interface of the cap.

2. The radiation detector module of claim 1 , wherein:

the edge plated PCB comprises a two layer PCB comprising upper and lower metal layers and a dielectric substrate disposed therebetween; and

the slot comprises a plated metal slot formed about a perimeter of the edge plated PCB by controlled depth milling of at least the upper metal layer of the two layer PCB.

3. The radiation detector module of claim 2 , wherein:

the two layer PCB comprises an upper shield plane disposed within the upper metal layer of the cap and electrically and thermally coupled to the slot and/or the enclosure to facilitate temperature equalization across the edge plated PCB and/or between the edge plated PCB and the enclosure.

4. The radiation detector module of claim 1 , wherein:

the edge plated PCB comprises a plurality of the via structures; and

the radiation sensor is separated from the enclosure by one or more damping inserts.

5. The radiation detector module of claim 4 , wherein:

the damping inserts comprise one or more rubber or foam pads disposed around at least a portion of the sensor and the readout electronics and/or between the readout electronics and the cap.

6. The radiation detector module of claim 4 , wherein:

at least one of the damping inserts is disposed substantially across more than half the surface area of a face of the sensor and is configured to provide a thermal barrier to the enclosure and to provide shock absorption.

7. The radiation detector module of claim 1 , further comprising:

a readout printed circuit board (PCB) configured to support the readout electronics, wherein the readout PCB comprises a readout interface; and

a flexible cable coupled between the readout interface and the internal interface of the cap, wherein the flexible cable is configured to damp and/or block transmission of a mechanical shock and/or a thermal gradient from the cap to the readout interface.

8. The radiation detector module of claim 1 , wherein:

the readout electronics comprises a silicon based photomultiplier coupled to a face of the sensor.

9. The radiation detector module of claim 1 , further comprising:

the radiation detector; and

a radiation detector housing, wherein the radiation detector module is configured to physically and/or electrically couple to or within the radiation detector housing using the external interface of the cap and a corresponding interface of the radiation detector module.

10. The radiation detector of claim 9 , further comprising a logic device and a display, wherein the logic device is configured to:

determine a spectroscopy output and/or a dose rate output corresponding to the radiation detection event signals provided by the readout electronics of the radiation detector module; and

display at least a portion of the spectroscopy output and/or the dose rate output using the display.

11. A method comprising:

providing a metallic and/or metalized enclosure;

providing a cap comprising an edge plated printed circuit board (PCB) comprising a slot configured to mate with a planar edge of an open surface of the enclosure;

coupling a radiation sensor and readout electronics to an interior surface of the cap, wherein the readout electronics are configured to provide radiation detection event signals corresponding to incident ionizing radiation in the radiation sensor; and

hermetically sealing the radiation sensor within the enclosure using the cap to form a radiation detector module, wherein:

the cap comprises an internal interface configured to couple to the readout electronics and an external interface configured to couple to a radiation detector;

the hermetically sealing the radiation sensor within the enclosure comprises soldering the slot of the cap to the planar edge of the enclosure to hermetically seal the radiation sensor within the enclosure; and

the edge plated PCB comprises a via structure formed through the edge plated PCB and configured to electrically couple the external interface of the cap to the internal interface of the cap.

12. The method of claim 11 , wherein:

the edge plated PCB comprises a two layer PCB comprising upper and lower metal layers and a dielectric substrate disposed therebetween; and

the slot comprises a plated metal slot formed about a perimeter of the edge plated PCB by controlled depth milling of at least the upper metal layer of the two layer PCB.

13. The method of claim 12 , wherein:

the two layer PCB comprises an upper shield plane disposed within the upper metal layer of the cap and electrically and thermally coupled to the slot and/or the enclosure to facilitate temperature equalization across the edge plated PCB and/or between the edge plated PCB and the enclosure.

14. The method of claim 11 , wherein:

the edge plated PCB comprises a plurality of the via structures; and

the radiation sensor is separated from the enclosure by one or more damping inserts.

15. The method of claim 14 , wherein:

the damping inserts comprise one or more rubber or foam pads disposed around at least a portion of the sensor and the readout electronics and/or between the readout electronics and the cap.

16. The method of claim 14 , wherein:

at least one of the damping inserts is disposed substantially across more than half a surface area of a face of the sensor and is configured to provide a thermal barrier to the enclosure and to provide shock absorption.

17. The method of claim 11 , further comprising:

placing a readout printed circuit board (PCB) within the enclosure, wherein the readout PCB is configured to support the readout electronics and comprises a readout interface; and

coupling a flexible cable between the readout interface and the internal interface of the cap, wherein the flexible cable is configured to damp and/or block transmission of a mechanical shock and/or a thermal gradient from the cap to the readout interface.

18. The method of claim 11 , wherein:

the readout electronics comprises a silicon based photomultiplier coupled to a face of the sensor.

19. The method of claim 11 , further comprising:

coupling the radiation detector module to or within a radiation detector housing, wherein the radiation detector module is configured to physically and/or electrically couple to or within the radiation detector housing using the external interface of the cap and a corresponding interface of the radiation detector module.

20. The method of claim 19 , further comprising:

determining a spectroscopy output and/or a dose rate output corresponding to the radiation detection event signals provided by the readout electronics of the radiation detector module; and

displaying at least a portion of the spectroscopy output and/or the dose rate output using a display.