MICROELECTRONIC DEVICES DESIGNED WITH INTEGRATED ANTENNAS ON A SUBSTRATE
Embodiments of the invention include a microelectronic device that includes a die having at least one transceiver unit, a redistribution package coupled to the die, and a substrate coupled to the redistribution package. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.
1 - 20 . (canceled)
21 . A microelectronic package, comprising:
a package substrate;
an antenna within the package substrate, wherein the antenna is to transmit or receive wireless communications with a frequency greater than 24 gigahertz (GHz); and
a die physically coupled with the package substrate within the microelectronic package, wherein the die includes circuitry related to transmission or reception of a wireless communication.
22 . The microelectronic package of claim 21 , wherein the antenna is to transmit or receive wireless communications with a millimeter-wave frequency.
23 . The microelectronic package of claim 21 , wherein the antenna is a first antenna, and wherein the microelectronic package further comprises a second antenna within the package substrate.
24 . The microelectronic package of claim 21 , wherein the antenna is a conductive element in a layer of the package substrate.
25 . The microelectronic package of claim 21 , wherein the circuitry related to transmission or reception of a wireless communication is transceiver circuitry.
26 . The microelectronic package of claim 21 , wherein the microelectronic package comprises a fifth generation (5G) package architecture for use with 5G communications.
27 . The microelectronic package of claim 21 , further comprising a redistribution package positioned between, and physically coupled with, the die and the package substrate.
28 . The microelectronic package of claim 21 , wherein the antenna is completely encapsulated within the package substrate.
29 . The microelectronic package of claim 21 , wherein the antenna is at least partially exposed at a surface of the package substrate.
30 . The microelectronic package of claim 21 , wherein the microelectronic package is communicatively coupled with a processor of a mobile device.
31 . An electronic device, comprising:
a printed circuit board (PCB);
a processor coupled with the PCB;
a touchscreen display and a camera communicatively coupled with the processor; and
a microelectronic package coupled with the PCB and communicatively coupled with the processor, wherein the microelectronic package includes:
a package substrate;
an antenna completely encapsulated by the package substrate, wherein the antenna is to transmit or receive wireless communications with a millimeter wave frequency; and
a die physically coupled with the package substrate, wherein the die includes transceiver circuitry that is communicatively coupled with the antenna.
32 . The electronic device of claim 31 , wherein the antenna is a first antenna, and wherein the microelectronic package further includes a second antenna encapsulated by the package substrate.
33 . The electronic device of claim 32 , wherein the first antenna and second antenna are elements of an antenna array.
34 . The electronic device of claim 31 , wherein the antenna is a conductive element in a layer of the package substrate.
35 . The electronic device of claim 31 , wherein the microelectronic package comprises a fifth generation (5G) package architecture for use with 5G communications.
36 . The electronic device of claim 31 , further comprising a redistribution package positioned between, and physically coupled with, the die and the package substrate.
37 . A microelectronic package, comprising:
a package substrate that includes a first antenna and a second antenna within the package substrate, wherein the first and second antennas are to send or receive wireless signals with a frequency greater than 24 gigahertz (GHz), and wherein at least one of the first antenna and the second antenna is fully encapsulated by the package substrate; and
a transceiver die coupled with the package substrate within the microelectronic package, wherein the transceiver die is communicatively coupled with the first antenna and the second antenna through the package substrate.
38 . The microelectronic package of claim 37 , wherein the first antenna is a conductive element in a layer of the package substrate.
39 . The microelectronic package of claim 37 , wherein the first antenna and the second antenna are elements of an antenna array.
40 . The microelectronic package of claim 37 , wherein the microelectronic package is communicatively coupled with a touchscreen display.