IP Library Granted Patent US 11,745,424
Granted Patent B2
US 11,745,424 · App. 17/022,401 · Granted Sep 5, 2023

Building material enclosure comprising a thermal break

Inventors: Robb Morgan (Arlington, MA); Luke Plummer (Jericho, VT); Christopher Auld (Boston, MA)
Assignee: Formlabs, Inc.
B29C64/255B28B1/001B29C64/25B33Y30/00B29C64/153B29C64/295
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,745,424
App. No.
17/022,401
Granted
Sep 5, 2023
Kind
B2
Abstract

According to some aspects, degradation of material in a sintering additive fabrication process may be mitigated or avoided by fabricating parts within a chamber that includes one or more thermal breaks. The thermal break may be implemented using a variety of structures, but generally allows material in the chamber close to the surface to be maintained at different temperatures than the material further from the surface. For instance, as a result of the thermal break, parts located within the material of the chamber that were formed earlier during fabrication may be kept cooler to avoid damage to the parts yet the upper surface (sometimes called the “build surface”) of unconsolidated material may be heated enough so as to require minimal additional energy exposure to trigger consolidation.

Claims (10)

1. An additive fabrication device configured to produce three-dimensional objects by sintering a source material, the device comprising:

a chamber comprising a first metal section that extends to a top of the chamber, a second metal section, and a thermal break arranged between the first metal section and the second metal section, the thermal break comprising plastic;

a fabrication platform arranged within the chamber, configured to receive source material and to be lowered into the chamber as progressive layers of source material are deposited over the fabrication platform;

a material deposition mechanism configured to deposit a layer of the source material over the fabrication platform, such that the layer of source material is arranged at the top of the chamber; and

one or more heaters configured to heat at least the source material deposited by the material deposition mechanism.

2. The additive fabrication device of claim 1 , wherein the first and second metal sections each have a thermal conductivity that is higher than a thermal conductivity of the thermal break.

3. The additive fabrication device of claim 1 , wherein the first and second metal sections of the chamber are joined together by the thermal break.

4. The additive fabrication device of claim 1 , wherein the thermal break is arranged at least 15 mm from the top of the chamber.

5. The additive fabrication device of claim 1 , wherein the thermal break has a height of at least 20 mm.

6. The additive fabrication device of claim 1 , wherein the second metal section extends to a bottom of the chamber.

Assignments (2)
AMENDED AND RESTATED INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Aug 5, 2022
From: FORMLABS INC.; FORMLABS OHIO INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 061087/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2020
From: MORGAN, ROBB; PLUMMER, LUKE; AULD, CHRISTOPHER
To: FORMLABS, INC.
Reel/Frame 054820/0378 →
Continuity (2)
Provisional Application 62901359 · Sep 17, 2019
Related Publication 20210107063A1 · Apr 15, 2021