IP Library Granted Patent US 11,698,194
Granted Patent B2
US 11,698,194 · App. 17/023,353 · Granted Jul 11, 2023

Space oven

Inventors: Michael Desmond Lewis (Kemah, TX); Caleb Michael Daugherty (League City, TX)
Assignee: NANORACKS, LLC
F24C7/002B64G1/66B64G7/00F24C15/322B64G2007/005F24C15/006F24C15/30
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Quick Facts
Patent No.
US 11,698,194
App. No.
17/023,353
Filed
Sep 16, 2020
Granted
Jul 11, 2023
Kind
B2
Art Unit
3761
USPC
373/111
Abstract

A space oven operates in microgravity environments by forcing convection towards the center through a unique heating element and airflow design. The space oven includes a tubular chamber, a heating rack, a heating system, a cooling system, a hatch, a user interface, a microcontroller, an enclosure, at least one first vent, at least one second vent and at least one temperature sensor. The tubular chamber is the cooking area. The heating rack holds consumables in place. The heating system heats up consumables. The cooling system prevents any overheating. The hatch closes off and allows access to the inside of the tubular chamber. The user interface allows a user to input commands. The microcontroller manages the electronic components. The enclosure protects the tubular chamber. The at least one first vent and the at least one second vent reduce pressure buildup. The at least one temperature sensor monitors the internal temperature.

Claims (70)

1. A space oven, comprising:

an enclosure;

a tubular chamber mounted within the enclosure and including an open chamber end and a closed chamber end;

a heating rack mounted within and centrally positioned along the tubular chamber, and that includes a first track and a second track, wherein:

the first track and the second track traverse from the open chamber end to the closed chamber end; and

the first track and the second track are positioned opposite to each other within the tubular chamber;

a heating system mounted within the tubular chamber and distributed around the heating rack;

a cooling system integrated into the enclosure;

a hatch operatively mounted to the open chamber end, wherein the hatch is usable to selectively access the open chamber end;

a user interface mounted within the enclosure;

at least one first vent integrated into the hatch;

at least one second vent integrated into the closed chamber end;

at least one temperature sensor mounted into the closed chamber end; and

a microcontroller mounted within the enclosure and electronically connected to the heating system, the cooling system, the user interface, and the at least one temperature sensor; and

a heating tray that includes a first sealing assembly and a second sealing assembly and that is slidably engaged in between the first track and the second track, wherein:

the first sealing assembly and the second sealing assembly each include a flexible sheet, a rigid frame, and a pressure-release valve;

the pressure-release valve is integrated into the flexible sheet;

the rigid frame is perimetrically connected around the flexible sheet; and

the rigid frame of the first sealing assembly is hermetically connected onto the rigid frame of the second sealing assembly.

2. The space oven as claimed in claim 1 , further comprising:

a quantity of insulation material, wherein:

the tubular chamber includes an inner lateral wall and an outer lateral wall;

the inner lateral wall is concentrically encircled by the outer lateral wall; and

the quantity of insulation material is positioned between the inner lateral wall and the outer lateral wall.

3. The space oven as claimed in claim 1 , wherein:

the heating system includes a plurality of first standoffs, a plurality of second standoffs, and at least one heating wire;

the plurality of first standoffs are mounted adjacent to the open chamber end;

the plurality of second standoffs are mounted adjacent to the closed chamber end;

the plurality of first standoffs and the plurality of second standoffs are distributed around the heating rack; and

the at least one heating wire is strung in between the plurality of first standoffs and the plurality of second standoffs.

4. The space oven as claimed in claim 1 , wherein:

the cooling system includes an inlet fan assembly, an outlet fan assembly, and a plurality of airflow-guiding panels;

the inlet fan assembly and the outlet fan assembly are positioned adjacent to the closed chamber end;

the inlet fan assembly is positioned offset from the outlet fan assembly;

the inlet fan assembly is in fluid communication with the outlet fan assembly through the plurality of airflow-guiding panels, the at least one first vent, and the at least one second vent;

a first airflow path is delineated from the inlet fan assembly, in between the open chamber end and the closed chamber end, and to the outlet fan assembly; and

a second airflow path is delineated from the inlet fan assembly, across the hatch and to the outlet fan assembly.

5. The space oven as claimed in claim 4 , further comprising:

at least one cooling rack, wherein:

the at least one cooling rack is mounted within the enclosure;

the at least one cooling rack is positioned adjacent to the open chamber end;

the first airflow path is intersected by the at least one cooling rack; and

the second airflow path is intersected by the at least one cooling rack.

6. The space oven as claimed in claim 1 , wherein:

the enclosure includes a receptacle and a cover;

the receptacle includes an opening;

the open chamber end, the user interface, and the microcontroller are positioned adjacent to the opening;

the cooling system is positioned opposite to the opening about the enclosure;

the receptacle is perimetrically attached to the cover; and

the cover is positioned across the opening.

7. The space oven as claimed in claim 1 , wherein:

the at least one temperature sensor is an automated shutoff thermostat.

8. The space oven as claimed in claim 1 , further comprising:

a door switch, wherein:

the door switch is operatively integrated in between the hatch and the open chamber end;

the door switch is usable to detect a closed configuration for the hatch and an open configuration for the hatch; and

the microcontroller is electronically connected to the door switch.

9. The space oven as claimed in claim 1 , further comprising:

a communication computing device, wherein:

the communication computing device is mounted within the enclosure; and

the communication computing device is electronically connected to the microcontroller.

10. The space oven as claimed in claim 9 , further comprising:

a data port;

a power port; and

an international-standard payload rack;

wherein:

the data port and the power port are integrated into the enclosure;

the enclosure is mounted into the international-standard payload rack;

the international-standard payload rack is electronically connected to the communication computing device by the data port; and

the international-standard payload rack is electrically connected to the heating system, the cooling system, the user interface, the microcontroller, the at least one temperature sensor, and the communication computing device by the power port.

Assignments (5)
RELEASE OF INTELLECTUAL PROPERTY SECURITY INTEREST Recorded Jul 22, 2025
From: HERCULES CAPITAL, INC., AS COLLATERAL AGENT
To: VOYAGER TECHNOLOGIES, INC. (F/K/A VOYAGER SPACE HOLDINGS, INC.); NANORACKS LLC; VOYAGER SPACE IP HOLDINGS, LLC; VALLEY TECH SYSTEMS, INC.; DREAMUP, PBC; PIONEER INVENTION, LLC; SPACE MICRO INC.; ALTIUS SPACE MACHINES, INC.; ZIN TECHNOLOGIES, INC.
Reel/Frame 072129/0689 →
SECURITY INTEREST Recorded May 30, 2025
From: VALLEY TECH SYSTEMS, INC.; ZIN TECHNOLOGIES, INC.; NANORACKS LLC; SPACE MICRO INC.; OPTICAL PHYSICS COMPANY
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 071270/0811 →
SECURITY INTEREST Recorded Jul 1, 2024
From: VOYAGER SPACE HOLDINGS, INC.; VOYAGER SPACE IP HOLDINGS, LLC; DREAMUP, PBC; SPACE MICRO INC.; ZIN TECHNOLOGIES, INC.; NANORACKS LLC; VALLEY TECH SYSTEMS, INC.; PIONEER INVENTION, LLC; ALTIUS SPACE MACHINES, INC.
To: HERCULES CAPITAL, INC., AS AGENT
Reel/Frame 068104/0818 →
PATENT SECURITY AGREEMENT Recorded Mar 24, 2023
From: PIONEER INVENTION, LLC; ALTIUS SPACE MACHINES, INC.; VALLEY TECH SYSTEMS, INC.; SPACE MICRO, INC.; NANORACKS LLC
To: JGB COLLATERAL LLC
Reel/Frame 063164/0430 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2020
From: LEWIS, MICHAEL DESMOND; DAUGHERTY, CALEB MICHAEL
To: NANORACKS, LLC
Reel/Frame 053795/0405 →
Continuity (2)
Provisional Application 62901133 · Sep 16, 2019
Related Publication 20210080181A1 · Mar 18, 2021