Thermal module assembly for a computing expansion card port of an information handling system
A thermal module assembly, comprising: a computing expansion card; a thermal interface material (TIM) positioned on a surface of the computing expansion card; a thermal plate; and a carrier configured to hold the computing expansion card with the TIM positioned on the surface of the computing expansion card, the carrier include a first end positioned opposite to a second end, wherein the thermal plate is removably coupled to the carrier at the first end and the second end to provide an uniform pressure between the thermal plate, the TIM material, and the computing expansion card.
1. A thermal module assembly, comprising:
a computing expansion card,
a thermal interface material (TIM) positioned on a surface of the computing expansion card;
a thermal plate; and
a carrier configured to hold the computing expansion card with the TIM positioned on the surface of the computing expansion card, the carrier including:
a first end positioned opposite to a second end,
a first side positioned opposite to a second side,
a support bar structure positioned between the first side and the second side at the first end of the carrier, the support bar including:
a first protruding member protruding towards the second end of the carrier, and
a second protruding member protruding towards the second end of the carrier,
wherein the thermal plate is removably coupled to the carrier at the first end and the second end to provide a uniform pressure between the thermal plate, the TIM material, and the computing expansion card.
2. The thermal module assembly of claim 1 , wherein the first side includes a first member extending between the first end and the second end of the carrier, and the second side includes a second member extending between the first end and the second end of the carrier.
3. The thermal module assembly of claim 2 , wherein the first protruding member and the second protruding member protrude over the first member and the second member, respectively.
4. The thermal module assembly of claim 3 , wherein a first end of the thermal plate, when coupled to the carrier, is positioned between the first protruding member and the first member, and between the second protruding member and the second member.
5. The thermal module assembly of claim 4 , wherein the carrier further includes a landing at the second end of the carrier, wherein a second end of the thermal plate, opposite to the first end of the thermal plate, is removably coupled to the landing by a fastener.
6. The thermal module assembly of claim 1 , wherein the first side includes a first platform and the second side includes a second platform, the first and the second platforms holding the computing expansion card.
7. The thermal module assembly of claim 6 , wherein the second end of the carrier includes a third platform connected between the first and the second platforms, the third platform holding the computing expansion card.
8. The thermal module assembly of claim 1 , wherein the first end of the carrier further includes an opening positioned between the first side and the second side.
9. An information handling system, including:
a computing apparatus, including a printed circuit board having a computing expansion card port;
a thermal module assembly, comprising:
a computing expansion card,
a thermal interface material (TIM) positioned on a surface of the computing expansion card;
a thermal plate; and
a carrier configured to hold the computing expansion card with the TIM positioned on the surface of the computing expansion card, the carrier including:
a first end positioned opposite to a second end,
a first side positioned opposite to a second side,
a support bar structure positioned between the first side and the second side at the first end of the carrier, the support bar including:
a first protruding member protruding towards the second end of the carrier, and
a second protruding member protruding towards the second end of the carrier,
wherein the thermal plate is removably coupled to the carrier at the first end and the second end to provide a uniform pressure between the thermal plate, the TIM material, and the computing expansion card,
wherein the thermal module assembly is coupled to the computing expansion card port.
10. The information handling system of claim 9 , wherein the first side includes a first member extending between the first end and the second end of the carrier, and the second side includes a second member extending between the first end and the second end of the carrier.
11. The information handling system of claim 10 , wherein the first protruding member and the second protruding member protrude over the first member and the second member, respectively.
12. The information handling system of claim 11 , wherein a first end of the thermal plate, when coupled to the carrier, is positioned between the first protruding member and the first member, and between the second protruding member and the second member.
13. The information handling system of claim 12 , wherein the carrier further includes a landing at the second end of the carrier, wherein a second end of the thermal plate, opposite to the first end of the thermal plate, is removably coupled to the landing by a fastener.
14. The information handling system of claim 9 , wherein the first side includes a first platform and the second side includes a second platform, the first and the second platforms holding the computing expansion card.
15. The information handling system of claim 14 , wherein the second end of the carrier includes a third platform connected between the first and the second platforms, the third platform holding the computing expansion card.
16. The information handling system of claim 9 , wherein the first end of the carrier further includes an opening positioned between the first side and the second side.