IP Library Granted Patent US 12,044,915
Granted Patent B2
US 12,044,915 · App. 17/024,058 · Granted Jul 23, 2024

Imprinted emboss in chip-on-film

Inventors: Guentaek Oh (Singapore, SG); BongJun Lee (Cascadia, SG)
Assignee: Dell Products L.P.
G02F1/133308G02F1/133608G02F1/1345G02F1/13452B26F1/40H01L23/3114H05K1/189H05K3/0044H05K5/0017H05K5/0043
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Quick Facts
Patent No.
US 12,044,915
App. No.
17/024,058
Granted
Jul 23, 2024
Kind
B2
Abstract

An information handling system display may include a display panel cell, a mold frame, and a chip-on-film. The chip-on-film may be coupled to the display panel cell. The chip-on-film may include one or more protrusions. A first portion of the chip-on-film may be adjacent to the one or more protrusions across a width of a first surface of the chip-on-film. The one or more protrusions may be in contact with a mold frame of the display. The first portion of the chip-on-film adjacent to the one or more protrusions may not be in contact with the mold frame of the display.

Claims (29)

1. A display for an information handling system, the display comprising:

a display panel cell;

a mold frame; and

a chip-on-film coupled to the display panel cell,

wherein the chip-on-film comprises one or more protrusions in contact with the mold frame,

wherein the one or more protrusions comprise a plurality of imprinted embossed impressions, and

wherein the one or more protrusions comprise less than one percent of a surface area of the chip-on-film, wherein a first portion of the chip-on-film is adjacent to the one or more protrusions across a width of a first surface of the chip-on-film, and wherein the first portion of the chip-on-film adjacent to the one or more protrusions is not in contact with the mold frame.

2. The display of claim 1 , wherein the plurality of imprinted embossed impressions comprise convex imprinted embossed impressions, and wherein an apex of one or more of the convex imprinted embossed impressions is in contact with the mold frame.

3. The display of claim 1 , wherein the plurality of imprinted embossed impressions is asymmetrical.

4. The display of claim 1 , wherein the chip-on-film further comprises a plurality of traces, and wherein the plurality of traces are positioned to avoid distortion of one or more of the plurality of traces by the one or more protrusions.

5. The display of claim 1 , further comprising:

a display printed circuit board (PCB),

wherein the chip-on-film is further coupled to the display PCB.

6. The display of claim 1 , further comprising:

a decorative casing,

wherein at least part of a first surface of the chip-on-film is in contact with the decorative casing.

7. The display of claim 1 , wherein the one or more protrusions are positioned to allow particles to move freely between the chip-on-film and the mold frame.

8. A chip-on-film for a display, the chip-on-film comprising:

a first connector for coupling to a display panel cell;

a second connector for coupling to a display printed circuit board (PCB); and

one or more protrusions in contact with a mold frame of the display,

wherein a first portion of the chip-on-film is adjacent to the one or more protrusions across a width of a first surface of the chip-on-film,

wherein the one or more protrusions are in contact with a mold frame and the first portion of the chip-on-film adjacent to the one or more protrusions is not in contact with the mold frame,

wherein the one or more protrusions comprise a plurality of imprinted embossed impressions, and

wherein the one or more protrusions comprise less than one percent of a surface area of the chip-on-film, wherein a first portion of the chip-on-film is adjacent to the one or more protrusions across a width of a first surface of the chip-on-film, and wherein the first portion of the chip-on-film adjacent to the one or more protrusions is not in contact with the mold frame.

9. The chip-on-film of claim 8 , wherein the plurality of imprinted embossed impressions comprise convex imprinted embossed impressions, and wherein an apex of one or more of the convex imprinted embossed impressions is in contact with the mold frame.

10. The chip-on-film of claim 8 , wherein the plurality of imprinted embossed impressions is asymmetrical.

11. The chip-on-film of claim 8 , wherein the chip-on-film further comprises a plurality of traces, and wherein the plurality of traces are positioned to avoid distortion of one or more of the plurality of traces by the one or more protrusions.

12. The chip-on-film of claim 8 , wherein at least part of a surface of the chip-on-film is in contact with a decorative casing.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (054475/0523) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
Reel/Frame 060332/0664 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (054475/0434) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
Reel/Frame 060332/0740 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (054475/0609) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
Reel/Frame 062021/0570 →
RELEASE OF SECURITY INTEREST AT REEL 054591 FRAME 0471 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0463 →
SECURITY INTEREST Recorded Nov 18, 2020
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 054475/0609 →
SECURITY INTEREST Recorded Nov 18, 2020
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 054475/0434 →
SECURITY INTEREST Recorded Nov 18, 2020
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 054475/0523 →
SECURITY AGREEMENT Recorded Nov 13, 2020
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 054591/0471 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2020
From: OH, GUENTAEK; LEE, BONGJUN
To: DELL PRODUCTS L.P.
Reel/Frame 053805/0198 →